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公开(公告)号：US11114355B2
公开(公告)日：2021-09-07
申请号：US16541206
申请日：2019-08-15
IPC分类号： H01L23/15 , H01L23/13 , H01L23/373 , C04B41/50 , C04B41/87 , H01L25/07 , H01L25/18 , H05K1/02 , H05K1/03 , H05K3/46 , F28F21/04 , H01L21/48 , H01L23/31 , H01L23/00
摘要： A power module includes a power wiring line provided with a power element, a glass ceramic multilayer substrate provided with a control element to control the power element, and a highly heat-conductive ceramic substrate made of a ceramic material having higher thermal conductivity than a glass ceramic contained in the glass ceramic multilayer substrate. The power wiring line is disposed on the highly heat-conductive ceramic substrate, and the glass ceramic multilayer substrate is disposed directly on the highly heat-conductive ceramic substrate.
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公开(公告)号：US08975743B2
公开(公告)日：2015-03-10
申请号：US13776752
申请日：2013-02-26
IPC分类号： H01L23/34 , H01L23/373 , H01L23/538 , H01L25/07 , H01L25/16 , H01L23/00
摘要： In a semiconductor device including a semiconductor element that produces heat and a substrate on which the semiconductor element is mounted, functions of the substrate are divided between a heat dissipating substrate and a wiring substrate. The heat dissipating substrate has a relatively high thermal conductivity, and includes principal surfaces defined by electric insulators, one of which is provided with an outer conductor located thereon. The wiring substrate is mounted on the upper principal surface of the heat dissipating substrate, has a thermal conductivity lower than that of the heat dissipating substrate, and includes a wiring conductor made mainly of silver or copper and located inside the wiring substrate, the wiring conductor being electrically connected to the outer conductor. The semiconductor element is mounted on the upper principal surface of the heat dissipating substrate and disposed in a through hole of the wiring substrate.
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公开(公告)号：US12126304B2
公开(公告)日：2024-10-22
申请号：US17481598
申请日：2021-09-22
发明人： Yasutaka Sugimoto
CPC分类号： H03F1/0211 , H03F3/19 , H03F3/21 , H03F2200/381 , H03F2200/451 , H03F2200/465 , H03F2200/468 , H03F2200/471
摘要： An amplifier circuit includes an input terminal to which a radio frequency signal is input, an amplifier transistor that has a control terminal and amplifies the radio frequency signal, a bias circuit that includes an emitter-follower circuit or a source-follower circuit and supplies a bias current to the control terminal of the amplifier transistor, an inductor arranged in series between an emitter of the emitter-follower circuit and the control terminal of the amplifier transistor or between a source of the source-follower circuit and the control terminal of the amplifier transistor, and a variable resistance circuit connected to the inductor.
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4.发明授权公开(公告)号：US10906839B2
公开(公告)日：2021-02-02
申请号：US15790267
申请日：2017-10-23
发明人： Yasutaka Sugimoto , Kazuhiro Kaneko
IPC分类号： C04B35/195 , H01B3/12 , C04B35/16 , H05K1/03 , B32B18/00 , C04B35/14 , C03C3/064 , C03C3/089 , C03C14/00 , C04B35/63 , C04B35/64 , H03H7/01 , H05K1/09 , H05K1/11 , H05K3/46
摘要： A mixed powder for a low temperature cofired ceramic material that contains 65 to 80 parts by weight of SiO2, 5 to 25 parts by weight of BaO, 1 to 10 parts by weight of Al2O3, 0.1 to 5 parts by weight of MnO, 0.1 to 5 parts by weight of B2O3, and 0.1 to less than 3 parts by weight of Li2O. The ceramic sintered body is used for, for example, ceramic electronic components, e.g., a multilayer circuit board or a coupler.
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公开(公告)号：US09030005B2
公开(公告)日：2015-05-12
申请号：US13776752
申请日：2013-02-26
IPC分类号： H01L23/34 , H01L23/373 , H01L23/538 , H01L25/07 , H01L25/16 , H01L23/00
CPC分类号： H01L23/34 , H01L23/3735 , H01L23/5383 , H01L23/5389 , H01L24/06 , H01L24/32 , H01L24/48 , H01L24/73 , H01L25/072 , H01L25/16 , H01L2224/32225 , H01L2224/48101 , H01L2224/48157 , H01L2224/48227 , H01L2224/73265 , H01L2924/00014 , H01L2924/01019 , H01L2924/09701 , H01L2924/00012 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： In a semiconductor device including a semiconductor element that produces heat and a substrate on which the semiconductor element is mounted, functions of the substrate are divided between a heat dissipating substrate and a wiring substrate. The heat dissipating substrate has a relatively high thermal conductivity, and includes principal surfaces defined by electric insulators, one of which is provided with an outer conductor located thereon. The wiring substrate is mounted on the upper principal surface of the heat dissipating substrate, has a thermal conductivity lower than that of the heat dissipating substrate, and includes a wiring conductor made mainly of silver or copper and located inside the wiring substrate, the wiring conductor being electrically connected to the outer conductor. The semiconductor element is mounted on the upper principal surface of the heat dissipating substrate and disposed in a through hole of the wiring substrate.
摘要翻译： 在包括产生热的半导体元件的半导体器件和其上安装半导体元件的衬底之间，衬底的功能在散热衬底和布线衬底之间被划分。 散热基板具有相对高的导热性，并且包括由绝缘体限定的主表面，其中一个被设置有位于其上的外部导体。 布线基板安装在散热基板的上主面上，其导热系数低于散热基板的导热系数，并且包括主要由银或铜制成并位于布线基板内的布线导体，布线导体 电连接到外导体。 半导体元件安装在散热基板的上主表面上，并布置在布线基板的通孔中。
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公开(公告)号：US11924968B2
公开(公告)日：2024-03-05
申请号：US17351633
申请日：2021-06-18
CPC分类号： H05K1/0306 , B32B18/00 , H05K1/115 , B32B37/06 , B32B2305/77 , B32B2307/732 , B32B2315/02 , B32B2457/08 , H05K2201/10015 , H05K2201/1003 , H05K2201/1006
摘要： The laminate of the present disclosure is a laminate including multiple glass ceramic layers each containing quartz and a glass that contains SiO2, B2O3, Al2O3, and M2O, where M is an alkali metal. An Al2O3 content of a surface layer portion of the laminate is higher than an Al2O3 content of an inner layer portion of the laminate, and a M2O content of the surface layer portion is lower than a M2O content of the inner layer portion.
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公开(公告)号：US11903126B2
公开(公告)日：2024-02-13
申请号：US17345141
申请日：2021-06-11
CPC分类号： H05K1/0306 , B32B3/266 , B32B17/06 , B32B37/06 , B32B37/18 , C03C10/0018 , C03C10/0054 , B32B2255/205 , B32B2307/202 , B32B2307/206 , B32B2310/049 , B32B2311/08 , B32B2311/12 , B32B2315/02 , B32B2315/08 , B32B2457/04 , C03C2204/00
摘要： The laminate of the present disclosure includes multiple glass ceramic layers each containing quartz and a glass that contains SiO2, B2O3, Al2O3, and M2O, where M is an alkali metal. The B concentration of a surface layer portion of the laminate is lower than the B concentration of an inner layer portion of the laminate.
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公开(公告)号：US11760686B2
公开(公告)日：2023-09-19
申请号：US17345116
申请日：2021-06-11
CPC分类号： C03C10/0054 , C03C27/044 , H05K1/0306
摘要： The glass ceramic material of the present disclosure contains a glass that contains SiO2, B2O3, Al2O3, and M2O, where M is an alkali metal, and a filler that contains quartz, Al2O3, and ZrO2. The glass ceramic material contains the glass in an amount of 57.4% by weight or more and 67.4% by weight or less, the quartz in the filler in an amount of 29% by weight or more and 39% by weight or less, the Al2O3 in the filler in an amount of 1.8% by weight or more and 5% by weight or less, and the ZrO2 in the filler in an amount of 0.3% by weight or more and 1.8% by weight or less.
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公开(公告)号：US11107741B2
公开(公告)日：2021-08-31
申请号：US16541208
申请日：2019-08-15
IPC分类号： B32B3/00 , H01L23/15 , C04B41/50 , C04B41/87 , H01L23/13 , H01L25/07 , H01L25/18 , H05K1/02 , H05K1/03 , H05K3/46 , F28F21/04 , H01L21/48 , H01L23/31 , H01L23/373 , H01L23/00
摘要： A composite ceramic multilayer substrate includes a glass ceramic insulating layer including a wiring layer and a highly thermally conductive ceramic insulating layer made of a ceramic material having a higher thermal conductivity than the glass ceramic insulating layer. The glass ceramic insulating layer is provided on at least one main surface of the highly thermally conductive ceramic insulating layer directly and/or with a wiring layer interposed therebetween. When viewed in a direction perpendicular or substantially perpendicular to a main surface of the composite ceramic multilayer substrate, the composite ceramic multilayer substrate includes at least one heat generating element-mounting portion surrounded by the glass ceramic insulating layer and at which a heat generating element-mounting wiring line provide on the main surface of the highly thermally conductive ceramic insulating layer is exposed.
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公开(公告)号：US10666199B2
公开(公告)日：2020-05-26
申请号：US15647686
申请日：2017-07-12
摘要： Provided is a detector circuit that includes: a first transistor that has an alternating current signal input to a base thereof, and that outputs a first detection signal that depends on the alternating current signal from a collector thereof; a second transistor that has the first detection signal input to a base thereof, and that outputs a second detection signal that depends on the first detection signal from a collector thereof; and an alternating current signal path along which the alternating current signal is supplied to the base of the second transistor.
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