COIL COMPONENT, COIL MODULE, AND METHOD FOR MANUFACTURING COIL COMPONENT
    1.
    发明申请
    COIL COMPONENT, COIL MODULE, AND METHOD FOR MANUFACTURING COIL COMPONENT 审中-公开
    线圈组件,线圈模块和制造线圈组件的方法

    公开(公告)号:US20160372259A1

    公开(公告)日:2016-12-22

    申请号:US15255965

    申请日:2016-09-02

    Abstract: A coil component that includes a coil having a thick coil core and good inductance characteristics and is able to narrow the pitch of a coil electrode is provided. The wiring of a coil electrode in a direction across the direction of a winding axis of the coil electrode includes a plurality of first metal pins and a plurality of second metal pins. By elongating each metal pin, the wiring of the coil electrode is easily elongated in a metal pin direction. Thus, a coil core is easily thickened in the metal pin direction. The wiring of the coil electrode can be formed in the metal pin direction only by arranging the metal pins. Thus, it is possible to provide a coil component that includes a coil having the thick coil core and good inductance characteristics and is able to narrow the pitch of the coil electrode.

    Abstract translation: 提供一种线圈部件,其包括具有厚的线圈芯线和良好的电感特性并且能够使线圈电极的间距变窄的线圈。 线圈电极沿着线圈电极的卷绕轴线方向的布线包括多个第一金属销和多个第二金属销。 通过延长每个金属销,线圈电极的布线容易在金属销方向上伸长。 因此,线圈芯在金属销方向上容易增厚。 线圈电极的布线只能通过布置金属销而形成在金属销方向上。 因此,可以提供包括具有厚线圈芯线圈和良好的电感特性的线圈的线圈部件,并且能够使线圈电极的间距变窄。

    MULTILAYER WIRING SUBSTRATE, PROBE CARD, AND METHOD FOR MANUFACTURING MULTILAYER WIRING SUBSTRATE
    2.
    发明申请
    MULTILAYER WIRING SUBSTRATE, PROBE CARD, AND METHOD FOR MANUFACTURING MULTILAYER WIRING SUBSTRATE 有权
    多层布线基板,探针卡及制造多层布线基板的方法

    公开(公告)号:US20140209356A1

    公开(公告)日:2014-07-31

    申请号:US14231780

    申请日:2014-04-01

    Abstract: A multilayer wiring substrate includes a substrate main body and a plurality of wiring lines. The substrate main body includes first and second main surfaces. The plurality of wiring lines extend from the first main surface toward the second main surface side in the substrate main body. The substrate main body includes a plurality of insulator layers laminated on each other. The wiring lines each include via conductors separately provided in the plurality of insulator layers. In at least one of the plurality of wiring lines, a diameter of the via conductor provided in a first insulator layer defining the first main surface of the substrate main body is smaller than a diameter of the via conductor provided in at least one of the plurality of insulator layers other than the first insulator layer.

    Abstract translation: 多层布线基板包括基板主体和多条布线。 基板主体包括第一和第二主表面。 多个布线从基板主体的第一主面向第二主面侧延伸。 基板主体包括彼此层叠的多个绝缘体层。 布线各自包括分开设置在多个绝缘体层中的通孔导体。 在多个布线中的至少一个中,设置在限定基板主体的第一主表面的第一绝缘体层中的通孔导体的直径小于设置在多个布线中的至少一个布线中的通孔导体的直径 的除了第一绝缘体层之外的绝缘体层。

    INDUCTOR COMPONENT MANUFACTURING METHOD AND INDUCTOR COMPONENT

    公开(公告)号:US20170178796A1

    公开(公告)日:2017-06-22

    申请号:US15451465

    申请日:2017-03-07

    CPC classification number: H01F27/29 H01F17/0013 H01F41/04 H01F41/041

    Abstract: An inductor component includes an inductor electrode having two metal pins that form input and output terminals and a connecting conductor that connects one end of each of the metal pins to each other, the inductor electrode arranged such that other ends of the metal pins oppose each other, and a resin layer containing the inductor electrode such that other ends of the metal pins are exposed. The resin layer is formed having a single-layer structure. Variation in the characteristics of the inductor electrode can be reduced as compared to a case where the parts corresponding to the metal pins of the inductor electrode are formed as via conductors or through-hole conductors. Because the resin layer has a single-layer structure, stress acting on joint portions between the metal pins and the connecting conductor can be reduced, which makes it possible to improve the reliability of the inductor component.

    COIL MODULE
    4.
    发明申请
    COIL MODULE 审中-公开
    线圈模块

    公开(公告)号:US20170018349A1

    公开(公告)日:2017-01-19

    申请号:US15276888

    申请日:2016-09-27

    Abstract: A coil component is provided with only first and second columnar conductors that are a part of a coil electrode. This can simplify the manufacturing process and reduce the cost of the coil component. A wiring substrate is provided with substrate-side wiring electrode traces that form the remaining part of the coil electrode. In the process of forming the wiring substrate using a substrate forming technique commonly used, the substrate-side wiring electrode traces can be easily formed together with other wiring electrodes. Therefore, when the coil electrode is configured to be formed by placing the coil component on the wiring substrate, a coil module including the coil component can be inexpensively manufactured.

    Abstract translation: 线圈部件仅具有作为线圈电极的一部分的第一和第二柱状导体。 这可以简化制造过程并降低线圈部件的成本。 布线基板设置有形成线圈电极的剩余部分的基板侧布线电极迹线。 在使用常用的基板形成技术形成布线基板的过程中,可以容易地与其它布线电极一起形成基板侧布线电极迹线。 因此,通过将线圈部件配置在配线基板上而构成线圈电极,能够廉价地制造包括线圈部件的线圈模块。

    ELECTRICAL ELEMENT, MOBILE DEVICE, AND METHOD FOR MANUFACTURING ELECTRICAL ELEMENT
    5.
    发明申请
    ELECTRICAL ELEMENT, MOBILE DEVICE, AND METHOD FOR MANUFACTURING ELECTRICAL ELEMENT 审中-公开
    电气元件,移动装置和制造电子元件的方法

    公开(公告)号:US20160372819A1

    公开(公告)日:2016-12-22

    申请号:US15256822

    申请日:2016-09-06

    Abstract: An electrical element includes a flexible antenna and a rigid member higher in rigidity than the flexible antenna. At least one of the flexible antenna and the rigid member is made of thermoplastic resin. A conductor pattern defining at least a portion of a section that performs the main function of the electrical element is provided at the flexible antenna. No conductor pattern that performs the main function of the electrical element is provided at the rigid member. Opposing surfaces of the flexible antenna and the rigid member are directly joined to each other.

    Abstract translation: 电气元件包括柔性天线和刚性高于柔性天线的刚性构件。 柔性天线和刚性构件中的至少一个由热塑性树脂制成。 在柔性天线处提供限定执行电气元件的主要功能的部分的至少一部分的导体图案。 没有执行电气元件的主要功能的导体图案设置在刚性构件上。 柔性天线和刚性构件的相对表面彼此直接接合。

    MODULE, METHOD FOR MANUFACTURING THE MODULE, AND ELECTRONIC APPARATUS INCLUDING THE MODULE
    6.
    发明申请
    MODULE, METHOD FOR MANUFACTURING THE MODULE, AND ELECTRONIC APPARATUS INCLUDING THE MODULE 审中-公开
    模块,制造模块的方法和包括模块的电子设备

    公开(公告)号:US20140251670A1

    公开(公告)日:2014-09-11

    申请号:US14200743

    申请日:2014-03-07

    Abstract: A module includes a wiring board; a component mounted on the wiring board; a columnar conductor for external connection, the columnar conductor being connected at one end thereof to the wiring board; and a resin layer disposed on the wiring board and configured to cover the columnar conductor and the component, with an end face of the columnar conductor exposed from a surface of the resin layer, the end face being at the other end of the columnar conductor. A gap to be filled with solder is formed between the resin layer and a periphery of an end portion of the columnar conductor, the end portion being at the other end of the columnar conductor.

    Abstract translation: 模块包括布线板; 安装在所述布线板上的部件; 用于外部连接的柱状导体,所述柱状导体的一端连接到所述布线板; 以及设置在所述布线板上并被构造成覆盖所述柱状导体和所述部件的树脂层,所述柱状导体的端面从所述树脂层的表面露出,所述端面位于所述柱状导体的另一端。 在树脂层和柱状导体的端部的周边之间形成填充有焊料的间隙,端部位于柱状导体的另一端。

    COIL COMPONENT
    9.
    发明申请
    COIL COMPONENT 审中-公开

    公开(公告)号:US20170221624A1

    公开(公告)日:2017-08-03

    申请号:US15491120

    申请日:2017-04-19

    Abstract: A coil component includes an insulating layer in which a magnetic core is embedded, coil electrodes wound around the magnetic core, external connection pad electrodes that are provided on the upper surface of the insulating layer and are connected to the coil electrodes. Each of the coil electrodes includes a plurality of inner metal pins standing in the insulating layer, a plurality of outer metal pins standing in the insulating layer, a plurality of upper wiring patterns formed on the upper surface of the insulating layer, and a plurality of lower wiring pattern formed on the undersurface of the insulating layer. Each of the pad electrodes is directly connected to the upper end surface of the inner metal pin or the outer metal pin, and has, in plan view, an area larger than that of the single upper wiring pattern or the single lower wiring pattern.

    INDUCTOR DEVICE, INDUCTOR ARRAY, AND MULTILAYERED SUBSTRATE, AND METHOD FOR MANUFACTURING INDUCTOR DEVICE
    10.
    发明申请
    INDUCTOR DEVICE, INDUCTOR ARRAY, AND MULTILAYERED SUBSTRATE, AND METHOD FOR MANUFACTURING INDUCTOR DEVICE 审中-公开
    电感器件,电感器阵列和多层衬底,以及制造电感器件的方法

    公开(公告)号:US20160372246A1

    公开(公告)日:2016-12-22

    申请号:US15253151

    申请日:2016-08-31

    Abstract: An inductor device (1) includes a magnetic body (2) and a conductor buried in the magnetic body (2), and the conductor includes first conductors (3) as metal pins. The magnetic body (2) is formed into a flat plate shape with a first main surface and a second main surface each having a predetermined shape, which oppose each other, and side surfaces connecting the first main surface and the second main surface. The conductor includes the first conductors (3) one end portions of which are exposed to the second main surface of the magnetic body (2) and a second conductor (4) which is connected to the other end portions of the first conductors (3).

    Abstract translation: 电感器件(1)包括磁体(2)和埋在磁体(2)中的导体,并且导体包括作为金属引脚的第一导体(3)。 磁体(2)形成为具有彼此相对的具有预定形状的第一主表面和第二主表面以及连接第一主表面和第二主表面的侧表面的平板形状。 导体包括其一端暴露于磁体(2)的第二主表面的第一导体(3)和与第一导体(3)的另一端连接的第二导体(4) 。

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