公开(公告)号：US5160787A

公开(公告)日：1992-11-03

申请号：US754997

申请日：1991-09-05

申请人： Morio Gaku ,  Kenzi Ishii ,  Takamasa Nakai

发明人： Morio Gaku ,  Kenzi Ishii ,  Takamasa Nakai

IPC分类号： B32B15/08 ,  C08K5/45 ,  H01L23/552 ,  H05K1/03

CPC分类号： H01L23/552 ,  B32B15/08 ,  C08K5/45 ,  H01L2924/0002 ,  H05K1/0373 ,  Y10S428/901 ,  Y10T428/261 ,  Y10T428/31525 ,  Y10T428/31529 ,  Y10T428/31688 ,  Y10T442/2607 ,  Y10T442/3415 ,  Y10T442/656

摘要： An electrical laminate having an ability to absorb or shield ultraviolet rays having wavelength of 300-420 nm which comprises (i) at least one thermosetting resin-impregnated substrate, (ii) said substrate and a metal foil or (iii) said substrate, a metal foil and an adhesive layer for the metal foil comprising a thermosetting resin, characterized in that the thermosetting resin constituting part or all of said substrates or constituting said adhesive layer contains 0.2-6.0% by weight of a light absorber (A) on the basis of weight of the thermosetting resin, said light absorber is (a) an alkylthioxantone or a mixture of (a) said alkylthioxantone and (b) an ultraviolet rays-absorber.

摘要翻译： 具有吸收或屏蔽波长为300-420nm的紫外线的能力的电层压板，其包括（i）至少一种热固性树脂浸渍基材，（ii）所述基材和金属箔或（iii）所述基材， 金属箔和用于包含热固性树脂的金属箔的粘合剂层，其特征在于，构成所述基材的一部分或全部或构成所述粘合剂层的热固性树脂在基础上含有0.2-6.0重量％的光吸收体（A） 所述光吸收剂为（a）烷基噻吨酮或（a）所述烷基噻吨酮和（b）紫外线吸收剂的混合物。

公开(公告)号：US5435877A

公开(公告)日：1995-07-25

申请号：US56536

申请日：1993-05-05

申请人： Kenji Ishii ,  Yoshinori Kondo ,  Hiroyuki Matsumoto ,  Takamasa Nakai

发明人： Kenji Ishii ,  Yoshinori Kondo ,  Hiroyuki Matsumoto ,  Takamasa Nakai

IPC分类号： B29C70/08 ,  B32B15/08 ,  B32B37/18 ,  H05K1/03 ,  H05K1/09 ,  B32B31/12 ,  B32B31/18 ,  B32B31/20 ,  B32B31/22

CPC分类号： B32B37/182 ,  B29C70/088 ,  B32B15/08 ,  B32B37/04 ,  B32B37/06 ,  H05K1/0366 ,  H05K1/09 ,  B32B2305/08 ,  B32B2311/12 ,  H05K2201/029 ,  H05K2201/0355 ,  Y10T156/1075

摘要： A process for the production of a copper-clad laminate which is improved in dimensional accuracy and freedom from bow and twist and shows nearly the same values of dimensional accuracy, thermal expansion coefficient and elastic modulus in the length and width directions, the process using:a prepreg (I) comprising a glass cloth (I-1) having a thickness of 190.+-.20 .mu.m, a weight of 210.+-.20 g/m.sup.2, warp and weft counts of 35 to 38 yarns/25 mm and a warp and weft difference of 2 yarns or less in count, anda copper foil (II) having a ductility, measured in atmosphere at 180.degree. C. in length and width directions, of at least 10% when it is a 1/2 oz/Ft.sup.2 foil, at least 15% when it is a 1 oz/Ft.sup.2 foil and at least 20% when it is a 2 oz/Ft.sup.2 foil, andthe set of the prepreg or prepregs and copper foil or copper foils is laminate-molded by curing it under predetermined heat in a laminate-molding step using a press machine, removing the application of pressure and then cooling the resultant laminate in the press machine.

摘要翻译： 一种生产覆铜层压板的方法，其尺寸精度提高并且不受弯曲和弯曲，并且在长度和宽度方向上显示出几乎相同的尺寸精度，热膨胀系数和弹性模量的值，该方法使用： 包括厚度为190 +/-20μm，重量为210 +/- 20g / m 2的玻璃布（I-1），经纬度为35至38根/ 25mm的预浸料（I） 以及计数为2根以下的纬纱和纬纱的差异，以及在长度和宽度方向的180℃下在大气中测定的具有延展性的铜箔（II）为1 / 2盎司/ Ft2箔，当为1盎司/ Ft2箔时为至少15％，当为2盎司/ Ft2箔时为至少20％，并且预浸料坯或预浸料和铜箔或铜箔的组合为层压体 通过使用压制机在层压成型步骤中在预定热下固化来模塑，除去施加压力，然后冷却所得到的层 在压机中。

公开(公告)号：US5368921A

公开(公告)日：1994-11-29

申请号：US736341

申请日：1991-07-26

申请人： Kenji Ishii ,  Takamasa Nakai ,  Hiroyuki Matsumoto

发明人： Kenji Ishii ,  Takamasa Nakai ,  Hiroyuki Matsumoto

IPC分类号： B32B15/08 ,  B32B15/14 ,  B32B17/04 ,  H05K1/03 ,  B32B17/02 ,  B32B5/06 ,  B32B5/16

CPC分类号： H05K1/0373 ,  B32B15/14 ,  H05K2201/0209 ,  H05K2201/0239 ,  H05K2201/0245 ,  Y10S428/901 ,  Y10T442/3415 ,  Y10T442/3439 ,  Y10T442/656

摘要： A metal foil-clad laminate obtained by lamination molding a resin-impregnated substrate and a metal foil, wherein the resin-impregnated substrate contains from 5 to 30% by weight of at least one inorganic filler selected from the group consisting of calcined kaolin, spherical fused silica, non-swellable synthetic mica, and a glass fine powder, the filler having an average particle diameter of from 0.1 to 5 .mu.m and at least 90 wt % of the filler having a particle diameter of from 0.02 to 5 .mu.m, and the resin-impregnated substrate is used as at least a surface layer of the laminate or as a resin-impregnated substrate which adheres the metal foil, thereby providing a surface smooth metal foil-clad laminate having a diminished surface undulation attributable to the substrate.

摘要翻译： 通过层压模塑树脂浸渍基材和金属箔而获得的覆金属箔层压板，其中所述浸渍树脂的基材含有5至30重量％的至少一种选自煅烧高岭土，球形 熔融二氧化硅，不溶胀合成云母和玻璃细粉末，平均粒径为0.1〜5μm的填料和粒径为0.02〜5μm的填料的至少90重量％ 并且树脂浸渍基材用作层压体的至少表面层或作为粘附金属箔的树脂浸渍基材，从而提供由于基材导致的表面起伏减小的表面光滑的金属箔覆层压板。

公开(公告)号：US5242540A

公开(公告)日：1993-09-07

申请号：US833448

申请日：1992-02-06

申请人： Kenji Ishii ,  Takamasa Nakai ,  Hiroyuki Matsumoto ,  Kenichi Moriyama

发明人： Kenji Ishii ,  Takamasa Nakai ,  Hiroyuki Matsumoto ,  Kenichi Moriyama

IPC分类号： B32B15/08 ,  C23F1/18 ,  H05K3/00 ,  H05K3/02 ,  H05K3/06 ,  H05K3/26

CPC分类号： H05K3/26 ,  H05K3/06 ,  H05K2203/025 ,  H05K2203/0353 ,  H05K3/022

摘要： A process for producing a thin copper foil-clad circuit board substrate which comprises subjecting a copper foil-clad circuit board substrate (a) comprising an electrically insulating support overlaid on one or both sides with a copper foil having an average thickness of 12 .mu.m or more to etching with a copper-etching solution thereby to etch the whole surface of the copper foil at a predetermined etching rate selected from the range of from 0.01 to 0.4 .mu.m/sec, thereby to reduce the thickness of the copper foil on at least one side of the insulating support to 10 to 80% of its original thickness with the thickness variation of the remaining etched copper foil being within .+-.1.0 .mu.m on the basis of a desired thickness, wherein said copper foil-clad circuit board substrate (a) is one in which the surface of the copper foil is substantially free of adherent dust particles having an average particle diameter of 3 .mu.m or more.