公开(公告)号：US20050061202A1

公开(公告)日：2005-03-24

申请号：US10481018

申请日：2002-06-18

申请人： Akira Hosomi ,  Naoki Kogure ,  Kenichi Moriyama ,  Kenichi Takahashi ,  Atsushi Hosoda ,  Kazuhiko Ikeda

发明人： Akira Hosomi ,  Naoki Kogure ,  Kenichi Moriyama ,  Kenichi Takahashi ,  Atsushi Hosoda ,  Kazuhiko Ikeda

IPC分类号： C23C22/52 ,  C23F1/18 ,  H05K3/26 ,  H05K3/38 ,  C09D11/00

CPC分类号： C23F1/18 ,  C23C22/52 ,  H05K3/383 ,  H05K2203/124

摘要： The surface treatment agent for copper and copper alloys contains hydrogen peroxide, a mineral acid, an azole compound, silver ion and a halide ion. The surface treatment agent for copper and copper alloys is useful in the production of printed wiring boards in electronics industry. The surface treatment agent roughens the surface of copper and copper alloys. Particularly, the surface treatment agent can form a uniform and undulation-free roughened surface on copper-clad substrates having plated mirror surface, this having been difficult in conventional techniques, thereby significantly improving the adhesion to etching resists, solder resists, in addition, to prepregs and a resin for mounting electronic parts.

摘要翻译： 铜和铜合金表面处理剂含有过氧化氢，无机酸，唑类化合物，银离子和卤离子。 铜和铜合金表面处理剂可用于电子工业印刷线路板的生产。 表面处理剂使铜和铜合金的表面变粗糙。 特别地，表面处理剂可以在具有电镀镜面的铜包覆基板上形成均匀且无起伏的粗糙表面，这在常规技术中是困难的，从而显着提高与抗蚀剂，阻焊剂的粘附性，另外， 预浸料和用于安装电子部件的树脂。

公开(公告)号：US5802901A

公开(公告)日：1998-09-08

申请号：US915085

申请日：1997-08-20

申请人： Hirohisa Oda ,  Masamichi Miyauchi ,  Akinori Miura ,  Kenichi Moriyama ,  Tsuneo Funahashi ,  Yukihisa Moriya ,  Katsushi Takeda

发明人： Hirohisa Oda ,  Masamichi Miyauchi ,  Akinori Miura ,  Kenichi Moriyama ,  Tsuneo Funahashi ,  Yukihisa Moriya ,  Katsushi Takeda

IPC分类号： C25B11/00 ,  B21D1/00 ,  B21D1/02 ,  B21D1/06 ,  B21D13/04 ,  C25C20060101 ,  C25C7/02 ,  C25C7/06 ,  B21B15/00 ,  B21D3/02

CPC分类号： B21D1/02 ,  B21D13/045 ,  C25C7/02

摘要： Bent or twisted electrolytic seed plates are caused to undergo primary straightening by a total of at least 15 vertically staggered work rolls having a diameter not exceeding 50 mm. Then, ribs are formed on the seed plates by groove-forming rolls having annular flanges along their outer periphery, and the plates are caused to undergo secondary straightening by rolls having annular grooves along their outer periphery.

摘要翻译： 弯曲或扭曲的电解种子板通过总共至少15个垂直交错的直径不超过50mm的工作辊进行初次矫直。 然后，通过沿其外周具有环形凸缘的槽形成辊在种子板上形成肋，并且通过沿其外周的具有环形槽的辊进行二次矫直。

公开(公告)号：US5242540A

公开(公告)日：1993-09-07

申请号：US833448

申请日：1992-02-06

申请人： Kenji Ishii ,  Takamasa Nakai ,  Hiroyuki Matsumoto ,  Kenichi Moriyama

发明人： Kenji Ishii ,  Takamasa Nakai ,  Hiroyuki Matsumoto ,  Kenichi Moriyama

IPC分类号： B32B15/08 ,  C23F1/18 ,  H05K3/00 ,  H05K3/02 ,  H05K3/06 ,  H05K3/26

CPC分类号： H05K3/26 ,  H05K3/06 ,  H05K2203/025 ,  H05K2203/0353 ,  H05K3/022

摘要： A process for producing a thin copper foil-clad circuit board substrate which comprises subjecting a copper foil-clad circuit board substrate (a) comprising an electrically insulating support overlaid on one or both sides with a copper foil having an average thickness of 12 .mu.m or more to etching with a copper-etching solution thereby to etch the whole surface of the copper foil at a predetermined etching rate selected from the range of from 0.01 to 0.4 .mu.m/sec, thereby to reduce the thickness of the copper foil on at least one side of the insulating support to 10 to 80% of its original thickness with the thickness variation of the remaining etched copper foil being within .+-.1.0 .mu.m on the basis of a desired thickness, wherein said copper foil-clad circuit board substrate (a) is one in which the surface of the copper foil is substantially free of adherent dust particles having an average particle diameter of 3 .mu.m or more.

公开(公告)号：US07232528B2

公开(公告)日：2007-06-19

申请号：US10481018

申请日：2002-06-18

申请人： Akira Hosomi ,  Naoki Kogure ,  Kenichi Moriyama ,  Kenichi Takahashi ,  Atsushi Hosoda ,  Kazuhiko Ikeda

发明人： Akira Hosomi ,  Naoki Kogure ,  Kenichi Moriyama ,  Kenichi Takahashi ,  Atsushi Hosoda ,  Kazuhiko Ikeda

IPC分类号： H01L21/302

CPC分类号： C23F1/18 ,  C23C22/52 ,  H05K3/383 ,  H05K2203/124

摘要： The surface treatment agent for copper and copper alloys contains hydrogen peroxide, a mineral acid, an azole compound, silver ion and a halide ion. The surface treatment agent for copper and copper alloys is useful in the production of printed wiring boards in electronics industry. The surface treatment agent roughens the surface of copper and copper alloys. Particularly, the surface treatment agent can form a uniform and undulation-free roughened surface on copper-clad substrates having plated mirror surface, this having been difficult in conventional techniques, thereby significantly improving the adhesion to etching resists, solder resists, in addition, to prepregs and a resin for mounting electronic parts.

摘要翻译： 铜和铜合金表面处理剂含有过氧化氢，无机酸，唑类化合物，银离子和卤离子。 铜和铜合金表面处理剂可用于电子工业印刷线路板的生产。 表面处理剂使铜和铜合金的表面变粗糙。 特别地，表面处理剂可以在具有电镀镜面的铜包覆基板上形成均匀且无起伏的粗糙表面，这在常规技术中是困难的，从而显着提高与抗蚀剂，阻焊剂的粘附性，另外， 预浸料和用于安装电子部件的树脂。