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    Forming a layer on a substrate
    1.
    发明授权
    Forming a layer on a substrate 有权
    在基材上形成一层

    公开(公告)号：US08066930B2

    公开(公告)日：2011-11-29

    申请号：US12749552

    申请日：2010-03-30

    Applicant: Sidlgata V. Sreenivasan ,  Michael P. C. Watts

    Inventor： Sidlgata V. Sreenivasan ,  Michael P. C. Watts

    IPC: B29C41/12 ,  B81C1/00

    CPC classification number: G03F7/0002 ,  B29C59/02 ,  B82Y10/00 ,  B82Y40/00

    Abstract: The present invention is directed to a method of forming an imprinting layer on a substrate including high resolution features, and transferring the features into a solidified region of the substrate. Desired thickness of the residual layer may be minimized in addition to visco-elastic behavior of the material.

    Abstract translation: 本发明涉及一种在包括高分辨率特征的基板上形成压印层的方法，并将特征转移到基板的固化区域中。 除了材料的粘弹性行为之外，残留层的期望厚度可以最小化。

    Capillary imprinting technique
    2.
    发明授权
    Capillary imprinting technique 有权
    毛细管压印技术

    公开(公告)号：US07442336B2

    公开(公告)日：2008-10-28

    申请号：US10645306

    申请日：2003-08-21

    Applicant: Byung-Jin Choi ,  Sidlgata V. Sreenivasan ,  Michael P. C. Watts

    Inventor： Byung-Jin Choi ,  Sidlgata V. Sreenivasan ,  Michael P. C. Watts

    IPC: B29C35/08 ,  B29C41/12 ,  B81C1/00

    CPC classification number: G03F7/0002 ,  B82Y10/00 ,  B82Y40/00 ,  C23F1/08

    Abstract: The present invention provides a method for patterning a substrate with a template having a mold that features positioning conformable material between the substrate and the mold and filling a volume defined between the mold and the substrate with the conformable material through capillary action between the conformable material and one of the mold and the substrate. Thereafter, the conformable material is solidified. Specifically, the distance between the mold and the substrate is controlled to a sufficient degree to attenuate, if not avoid, compressive forces between the mold and the substrate. As a result, upon initial contact of the mold with the conformable material, spontaneous capillary filling of the volume between the mold and the substrate occurs.

    Abstract translation: 本发明提供了一种用模板图案化模板的方法，该模板具有在基板和模具之间具有定位适形材料的模具，并且通过适形材料之间的毛细管作用在适形材料之间填充限定在模具和基板之间的体积， 模具和基材之一。 此后，使适形材料固化。 具体地说，模具和基板之间的距离被控制到足够的程度以减小模具和基板之间的压缩力（如果不是避免的话）。 结果，在模具与适形材料初次接触时，发生模具和基板之间的体积的自发毛细管填充。

    Method for fabricating bulbous-shaped vias
    6.
    发明授权
    Method for fabricating bulbous-shaped vias 失效
    制造球状通孔的方法

    公开(公告)号：US07071088B2

    公开(公告)日：2006-07-04

    申请号：US10227105

    申请日：2002-08-23

    Applicant: Michael P. C. Watts ,  Sidlgata V. Sreenivasan

    Inventor： Michael P. C. Watts ,  Sidlgata V. Sreenivasan

    IPC: H01L21/44

    CPC classification number: G03F7/0002 ,  B82Y10/00 ,  B82Y40/00 ,  H01L21/0272 ,  H01L21/28587 ,  H01L21/312 ,  H01L21/76804 ,  H01L21/76817

    Abstract: The present invention provides a method for fabricating bulbous-shaped vias on a substrate, having a surface, by disposing, on the substrate, a polymerizable fluid composition. A mold is placed in contact with the polymerizable fluid composition. The mold includes a relief structure on a surface thereof to create a recess in a layer of the polymerizable fluid composition. The polymerizable fluid composition is subjected to conditions to cause polymerization, forming a polymerized layer having a solidified indentation. An opening to the surface of the substrate is formed by removing material disposed on the substrate surface through etch processes. In a further embodiment a conductive layer may be disposed in the opening to form a gate. A lift-off process may be employed to remove the polymerized layer.

    Abstract translation: 本发明提供一种在基板上制造球状通孔的方法，其具有通过在基板上设置可聚合流体组合物的表面。 将模具放置成与可聚合流体组合物接触。 模具在其表面上包括浮雕结构，以在可聚合流体组合物的层中形成凹部。 可聚合流体组合物经历引起聚合的条件，形成具有固化压痕的聚合层。 通过蚀刻处理去除设置在基板表面上的材料来形成通向基板表面的开口。 在另一个实施例中，导电层可以设置在开口中以形成栅极。 可以采用剥离工艺来除去聚合层。

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