公开(公告)号：US20110290864A1

公开(公告)日：2011-12-01

申请号：US13205606

申请日：2011-08-08

申请人： Mengzhi PANG ,  Liu Pilin ,  Charan GURUMURTHY

发明人： Mengzhi PANG ,  Liu Pilin ,  Charan GURUMURTHY

IPC分类号： B23K1/20

CPC分类号： B23K35/262 ,  B23K2101/36 ,  H01L24/13 ,  H01L24/16 ,  H01L2224/0401 ,  H01L2224/05647 ,  H01L2224/05655 ,  H01L2224/13111 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/73204 ,  H01L2224/81815 ,  H01L2924/00013 ,  H01L2924/01029 ,  H01L2924/01327 ,  H01L2924/14 ,  Y10T428/12708 ,  H01L2924/00014 ,  H01L2924/01047 ,  H01L2924/01083 ,  H01L2924/01027 ,  H01L2924/01015 ,  H01L2224/13099 ,  H01L2224/13599 ,  H01L2224/05599 ,  H01L2224/05099 ,  H01L2224/29099 ,  H01L2224/29599

摘要： Electronic assemblies and solders used in electronic assemblies are described. One embodiment includes a die and a substrate, with a solder material positioned between the die and the substrate, the solder comprising at least 91 weight percent Sn, 0.4 to 1.0 weight percent Cu and at least one dopant selected from the group consisting of Ag, Bi, P, and Co. Other embodiments are described and claimed.

摘要翻译： 描述在电子组件中使用的电子组件和焊料。 一个实施例包括管芯和衬底，其中焊料材料位于管芯和衬底之间，焊料包含至少91重量％的Sn，0.4至1.0重量％的Cu和至少一种掺杂剂，其选自Ag， Bi，P和Co.描述和要求保护其它实施例。

公开(公告)号：US20100155947A1

公开(公告)日：2010-06-24

申请号：US12344194

申请日：2008-12-24

申请人： Mengzhi PANG ,  Liu Pilin ,  Charan GURUMURTHY

发明人： Mengzhi PANG ,  Liu Pilin ,  Charan GURUMURTHY

IPC分类号： H01L23/488 ,  B23K1/00

CPC分类号： B23K35/262 ,  B23K2101/36 ,  H01L24/13 ,  H01L24/16 ,  H01L2224/0401 ,  H01L2224/05647 ,  H01L2224/05655 ,  H01L2224/13111 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/73204 ,  H01L2224/81815 ,  H01L2924/00013 ,  H01L2924/01029 ,  H01L2924/01327 ,  H01L2924/14 ,  Y10T428/12708 ,  H01L2924/00014 ,  H01L2924/01047 ,  H01L2924/01083 ,  H01L2924/01027 ,  H01L2924/01015 ,  H01L2224/13099 ,  H01L2224/13599 ,  H01L2224/05599 ,  H01L2224/05099 ,  H01L2224/29099 ,  H01L2224/29599

摘要： Electronic assemblies and solders used in electronic assemblies are described. One embodiment includes a die and a substrate, with a solder material positioned between the die and the substrate, the solder comprising at least 91 weight percent Sn, 0.4 to 1.0 weight percent Cu and at least one dopant selected from the group consisting of Ag, Bi, P, and Co. Other embodiments are described and claimed.

摘要翻译： 描述在电子组件中使用的电子组件和焊料。 一个实施例包括管芯和衬底，其中焊料材料位于管芯和衬底之间，焊料包含至少91重量％的Sn，0.4至1.0重量％的Cu和至少一种掺杂剂，其选自Ag， Bi，P和Co.描述和要求保护其它实施例。

公开(公告)号：US20130075907A1

公开(公告)日：2013-03-28

申请号：US13243078

申请日：2011-09-23

申请人： Mengzhi PANG

发明人： Mengzhi PANG

IPC分类号： H01L23/48 ,  H01L21/44 ,  H01L21/768 ,  H01L21/60

CPC分类号： H01L24/03 ,  H01L23/3192 ,  H01L24/05 ,  H01L24/11 ,  H01L24/13 ,  H01L2224/0346 ,  H01L2224/0347 ,  H01L2224/036 ,  H01L2224/0401 ,  H01L2224/05022 ,  H01L2224/05547 ,  H01L2224/05552 ,  H01L2224/05553 ,  H01L2224/05555 ,  H01L2224/05559 ,  H01L2224/05572 ,  H01L2224/05647 ,  H01L2224/1146 ,  H01L2224/1147 ,  H01L2224/116 ,  H01L2224/13007 ,  H01L2224/13023 ,  H01L2224/1308 ,  H01L2224/13082 ,  H01L2224/131 ,  H01L2224/16148 ,  H01L2224/16238 ,  H01L2224/73204 ,  H01L2224/94 ,  H01L2924/01029 ,  H01L2924/10253 ,  H01L2924/15787 ,  H01L2924/3512 ,  H01L2924/35121 ,  H01L2924/00014 ,  H01L2224/03 ,  H01L2224/11 ,  H01L2924/00012 ,  H01L2924/014 ,  H01L2924/00

摘要： In order to achieve finer bump interconnect pitch for integrated circuit packaging, while relieving pressure-induced delamination of upper layer dielectric films, the under bump metallurgy of the present invention provides a pressure distribution pedestal upon which a narrower copper pillar is disposed. A solder mini-bump is disposed on the upper exposed portion of the copper pillar, wherein the solder is softer than the copper pillar. The radius of the copper pillars is selected such that lateral deformation of the solder mini-bumps during final assembly does not form undesired conductive bridges between adjacent pillars.

摘要翻译： 为了实现用于集成电路封装的更好的凸块互连间距，在缓和上层电介质膜的压力引起的分层的同时，本发明的凸块下的冶金提供了一个压力分配基座，在该压力分配基座上设置较窄的铜柱。 焊料微型凸块设置在铜柱的上部暴露部分上，其中焊料比铜柱更软。 选择铜柱的半径，使得在最终组装期间焊料微型凸块的横向变形在相邻柱之间不形成不期望的导电桥。

公开(公告)号：US20110293962A1

公开(公告)日：2011-12-01

申请号：US13205613

申请日：2011-08-08

申请人： Mengzhi PANG ,  Pilin LIU ,  Charan GURUMURTHY

发明人： Mengzhi PANG ,  Pilin LIU ,  Charan GURUMURTHY

IPC分类号： B32B15/00 ,  H01L23/488

CPC分类号： B23K35/262 ,  B23K2101/36 ,  H01L24/13 ,  H01L24/16 ,  H01L2224/0401 ,  H01L2224/05647 ,  H01L2224/05655 ,  H01L2224/13111 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/73204 ,  H01L2224/81815 ,  H01L2924/00013 ,  H01L2924/01029 ,  H01L2924/01327 ,  H01L2924/14 ,  Y10T428/12708 ,  H01L2924/00014 ,  H01L2924/01047 ,  H01L2924/01083 ,  H01L2924/01027 ,  H01L2924/01015 ,  H01L2224/13099 ,  H01L2224/13599 ,  H01L2224/05599 ,  H01L2224/05099 ,  H01L2224/29099 ,  H01L2224/29599

摘要： Electronic assemblies and solders used in electronic assemblies are described. One embodiment includes a die and a substrate, with a solder material positioned between the die and the substrate, the solder comprising at least 91 weight percent Sn, 0.4 to 1.0 weight percent Cu and at least one dopant selected from the group consisting of Ag, Bi, P, and Co. Other embodiments are described and claimed.