公开(公告)号：US20140014995A1

公开(公告)日：2014-01-16

申请号：US13983853

申请日：2012-01-19

申请人： Markus Pindl ,  Simon Jerebic ,  Tobias Gebuhr

发明人： Markus Pindl ,  Simon Jerebic ,  Tobias Gebuhr

IPC分类号： H01L33/56

CPC分类号： H01L33/56 ,  H01L33/483 ,  H01L33/505 ,  H01L33/54 ,  H01L33/58 ,  H01L2224/48091 ,  H01L2224/48464 ,  H01L2224/73265 ,  H01L2924/0002 ,  H01L2933/005 ,  H01L2924/00 ,  H01L2924/00014

摘要： An optoelectronic component includes a substrate, a semiconductor chip arranged on the substrate, and a light-transmissive cover, wherein the light-transmissive cover covers at least an area of the semiconductor chip facing away from the substrate, the light-transmissive cover has a hardness greater than that of silicone, and a connecting material is arranged as a potting material between the light-transmissive cover and the substrate such that those areas of the semiconductor chip not covered by the substrate are surrounded by the connecting material, and the connecting material forms a cavity seal.

摘要翻译： 光电子部件包括基板，布置在基板上的半导体芯片和透光盖，其中透光盖覆盖半导体芯片的远离基板的至少一个区域，透光盖具有 硬度大于硅树脂，并且连接材料被布置为在透光性盖和基板之间的灌封材料，使得未被基板覆盖的半导体芯片的那些区域被连接材料包围，并且连接材料 形成空腔密封。

公开(公告)号：US09018661B2

公开(公告)日：2015-04-28

申请号：US13983853

申请日：2012-01-19

申请人： Markus Pindl ,  Simon Jerebic ,  Tobias Gebuhr

发明人： Markus Pindl ,  Simon Jerebic ,  Tobias Gebuhr

IPC分类号： H01L33/00 ,  H01L33/56 ,  H01L33/48 ,  H01L33/50 ,  H01L33/54 ,  H01L33/58

CPC分类号： H01L33/56 ,  H01L33/483 ,  H01L33/505 ,  H01L33/54 ,  H01L33/58 ,  H01L2224/48091 ,  H01L2224/48464 ,  H01L2224/73265 ,  H01L2924/0002 ,  H01L2933/005 ,  H01L2924/00 ,  H01L2924/00014

摘要： An optoelectronic component includes a substrate, a semiconductor chip arranged on the substrate, and a light-transmissive cover, wherein the light-transmissive cover covers at least an area of the semiconductor chip facing away from the substrate, the light-transmissive cover has a hardness greater than that of silicone, and a connecting material is arranged as a potting material between the light-transmissive cover and the substrate such that those areas of the semiconductor chip not covered by the substrate are surrounded by the connecting material, and the connecting material forms a cavity seal.

摘要翻译： 光电子部件包括基板，布置在基板上的半导体芯片和透光盖，其中透光盖覆盖半导体芯片的远离基板的至少一个区域，透光盖具有 硬度大于硅树脂，并且连接材料被布置为在透光性盖和基板之间的灌封材料，使得未被基板覆盖的半导体芯片的那些区域被连接材料包围，并且连接材料 形成空腔密封。

公开(公告)号：US20140191272A1

公开(公告)日：2014-07-10

申请号：US14233754

申请日：2012-06-27

申请人： Simon Jerebic ,  Erik Heinemann ,  Markus Pindl ,  Michael Bestele ,  Jan Marfeld

发明人： Simon Jerebic ,  Erik Heinemann ,  Markus Pindl ,  Michael Bestele ,  Jan Marfeld

IPC分类号： H01L33/50

CPC分类号： H01L33/508 ,  H01L25/0753 ,  H01L33/58 ,  H01L33/60 ,  H01L2924/0002 ,  H01L2924/00

摘要： An optoelectronic component includes a substrate, on which a semiconductor chip and a wettable attractor element are arranged. A medium including pigments at least regionally covers the exposed region of the substrate that is not covered by the semiconductor chip and the attractor element. The medium at least partly wets the semiconductor chip and the attractor element.

摘要翻译： 光电子部件包括其上布置有半导体芯片和可吸湿吸引子元件的基板。 包括颜料的介质至少区域地覆盖未被半导体芯片和吸引元件覆盖的基板的暴露区域。 该介质至少部分地润湿半导体芯片和吸引元件。

公开(公告)号：US20130077280A1

公开(公告)日：2013-03-28

申请号：US13700414

申请日：2011-04-13

申请人： Thomas Bemmerl ,  Simon Jerebic ,  Markus Pindl

发明人： Thomas Bemmerl ,  Simon Jerebic ,  Markus Pindl

IPC分类号： H05K7/02

CPC分类号： H01L24/32 ,  H01L21/56 ,  H01L23/3142 ,  H01L24/83 ,  H01L25/167 ,  H01L33/06 ,  H01L33/32 ,  H01L33/44 ,  H01L33/507 ,  H01L33/54 ,  H01L33/56 ,  H01L33/58 ,  H01L33/60 ,  H01L33/62 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/83951 ,  H01L2924/12041 ,  H01L2924/1434 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2933/005 ,  H01L2933/0066 ,  H01L2933/0091 ,  H05K7/02 ,  H01L2924/00

摘要： An electronic arrangement (1) comprising a carrier (2), on which at least one connecting area (6) is arranged. At least one electronic component (3a, 3b, 3c) is fixed on the connecting area (6) by means of a contact material (4). A covering area (5) surrounds the connecting area (6) on the carrier (2). At least one covered region (15, 16, 17, 18, 19) is covered by a covering material (10). The covering material (10) is designed in such a way that an optical contrast between the covering area (5) and the covered region (15, 16, 17, 18, 19) is minimized.

摘要翻译： 一种包括载体（2）的电子装置（1），其上布置有至少一个连接区域（6）。 至少一个电子部件（3a，3b，3c）借助接触材料（4）固定在连接区域（6）上。 覆盖区域（5）围绕载体（2）上的连接区域（6）。 至少一个覆盖区域（15,16,17,18,19）被覆盖材料（10）覆盖。 覆盖材料（10）被设计成使覆盖区域（5）和覆盖区域（15,16,17,18,19）之间的光学对比度最小化。

公开(公告)号：US09681566B2

公开(公告)日：2017-06-13

申请号：US13700414

申请日：2011-04-13

申请人： Thomas Bemmerl ,  Simon Jerebic ,  Markus Pindl

发明人： Thomas Bemmerl ,  Simon Jerebic ,  Markus Pindl

IPC分类号： H05K7/02 ,  H01L33/44 ,  H01L23/00

CPC分类号： H01L24/32 ,  H01L21/56 ,  H01L23/3142 ,  H01L24/83 ,  H01L25/167 ,  H01L33/06 ,  H01L33/32 ,  H01L33/44 ,  H01L33/507 ,  H01L33/54 ,  H01L33/56 ,  H01L33/58 ,  H01L33/60 ,  H01L33/62 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/83951 ,  H01L2924/12041 ,  H01L2924/1434 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2933/005 ,  H01L2933/0066 ,  H01L2933/0091 ,  H05K7/02 ,  H01L2924/00

摘要： An electronic arrangement (1) comprising a carrier (2), on which at least one connecting area (6) is arranged. At least one electronic component (3a, 3b, 3c) is fixed on the connecting area (6) by means of a contact material (4). A covering area (5) surrounds the connecting area (6) on the carrier (2). At least one covered region (15, 16, 17, 18, 19) is covered by a covering material (10). The covering material (10) is designed in such a way that an optical contrast between the covering area (5) and the covered region (15, 16, 17, 18, 19) is minimized.

公开(公告)号：US09368700B2

公开(公告)日：2016-06-14

申请号：US14233754

申请日：2012-06-27

申请人： Simon Jerebic ,  Erik Heinemann ,  Markus Pindl ,  Michael Bestele ,  Jan Marfeld

发明人： Simon Jerebic ,  Erik Heinemann ,  Markus Pindl ,  Michael Bestele ,  Jan Marfeld

IPC分类号： H01L33/54 ,  H01L33/50 ,  H01L33/60 ,  H01L25/075

CPC分类号： H01L33/508 ,  H01L25/0753 ,  H01L33/58 ,  H01L33/60 ,  H01L2924/0002 ,  H01L2924/00

摘要： An optoelectronic component includes a substrate, on which a semiconductor chip and a wettable attractor element are arranged. A medium including pigments at least regionally covers the exposed region of the substrate that is not covered by the semiconductor chip and the attractor element. The medium at least partly wets the semiconductor chip and the attractor element.

摘要翻译： 光电子部件包括其上布置有半导体芯片和可吸湿吸引子元件的基板。 包括颜料的介质至少区域地覆盖未被半导体芯片和吸引元件覆盖的基板的暴露区域。 该介质至少部分地润湿半导体芯片和吸引元件。

公开(公告)号：US09818921B2

公开(公告)日：2017-11-14

申请号：US13703127

申请日：2011-06-10

申请人： Johann Ramchen ,  David Racz ,  Hans-Christoph Gallmeier ,  Stefan Grötsch ,  Simon Jerebic

发明人： Johann Ramchen ,  David Racz ,  Hans-Christoph Gallmeier ,  Stefan Grötsch ,  Simon Jerebic

IPC分类号： H01L29/227 ,  H01L33/60 ,  H01L33/46 ,  H01L23/29 ,  H01L23/31 ,  H01L23/00 ,  H01L25/075 ,  H01L31/0232 ,  H01L33/54 ,  H01L33/62 ,  H01L25/16 ,  H01L23/60

CPC分类号： H01L33/60 ,  H01L23/295 ,  H01L23/3121 ,  H01L23/60 ,  H01L24/29 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L25/0753 ,  H01L25/167 ,  H01L31/0232 ,  H01L33/46 ,  H01L33/54 ,  H01L33/56 ,  H01L33/62 ,  H01L2224/291 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/45015 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/48471 ,  H01L2224/48479 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/01013 ,  H01L2924/01023 ,  H01L2924/01079 ,  H01L2924/05032 ,  H01L2924/05432 ,  H01L2924/12036 ,  H01L2924/181 ,  H01L2924/207 ,  H01L2924/00 ,  H01L2924/014 ,  H01L2924/00012 ,  H01L2224/45099

摘要： An optoelectronic semiconductor component includes a carrier and at least one optoelectronic semiconductor chip mounted on the carrier top. The semiconductor component includes at least one bonding wire, via which the semiconductor chip is electrically contacted, and at least one covering body mounted on a main radiation side and projects beyond the bonding wire. At least one reflective potting compound encloses the semiconductor chip laterally and extends at least as far as the main radiation side of the semiconductor chip. The bonding wire is covered completely by the reflective potting compound or completely by the reflective potting compound together with the covering body.

公开(公告)号：US20140061676A1

公开(公告)日：2014-03-06

申请号：US14009921

申请日：2012-03-15

申请人： Markus Maute ,  Jürgen Moosburger ,  Simon Jerebic

发明人： Markus Maute ,  Jürgen Moosburger ,  Simon Jerebic

IPC分类号： H01L33/48

CPC分类号： H01L33/60 ,  H01L33/20 ,  H01L33/44 ,  H01L33/48 ,  H01L33/486 ,  H01L33/501 ,  H01L33/56 ,  H01L2933/0091

摘要： A method of producing an optoelectronic component includes providing a semiconductor chip having an active layer that generates radiation and is arranged on a carrier, applying a dispersed material including a matrix material and particles embedded therein to the semiconductor chip and/or the carrier at least in regions, wherein before the dispersed material is applied, at least one chip edge of the semiconductor chip facing away from the carrier is modified such that the dispersed material at least partly separates into its constituents during application at the chip edge.

摘要翻译： 制造光电子部件的方法包括提供具有产生辐射的有源层的半导体芯片，并且布置在载体上，将包含基质材料的分散材料和嵌入其中的颗粒施加到半导体芯片和/或载体上至少在 区域，其中在施加分散的材料之前，半导体芯片的远离载体的至少一个芯片边缘被修改，使得分散的材料在芯片边缘的施加期间至少部分地分离成其组成。

公开(公告)号：US08580070B2

公开(公告)日：2013-11-12

申请号：US11720954

申请日：2005-11-09

申请人： Edward Fuergut ,  Hermann Vilsmeier ,  Simon Jerebic ,  Michael Bauer

发明人： Edward Fuergut ,  Hermann Vilsmeier ,  Simon Jerebic ,  Michael Bauer

IPC分类号： B32B37/02

CPC分类号： H01L21/6835 ,  H01L21/6836 ,  H01L21/78 ,  H01L24/27 ,  H01L24/29 ,  H01L24/83 ,  H01L29/0657 ,  H01L2221/68327 ,  H01L2221/6834 ,  H01L2224/274 ,  H01L2224/83191 ,  H01L2224/8385 ,  H01L2924/01033 ,  H01L2924/01068 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01077 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/07802 ,  H01L2924/10158 ,  H01L2924/3512 ,  H01L2924/00

摘要： The invention relates to a method for making a semiconductor. In one embodiment the method includes applying an adhesive layer to ground-thin or thinned semiconductor chips of a semiconductor wafer. In this embodiment, the adhesive layer composed of curable adhesive is introduced relatively early into a method for the thinning by grinding, separation and singulation of a semiconductor wafer to form thinned semiconductor chips, and is used further in a semiconductor device into which the thinned semiconductor chip is to be incorporated.

摘要翻译： 本发明涉及制造半导体的方法。 在一个实施例中，该方法包括将粘合剂层应用于半导体晶片的接地薄或薄化的半导体芯片。 在本实施例中，由可固化粘合剂组成的粘合剂层相对较早地引入用于通过半导体晶片的研磨，分离和分离来减薄的方法以形成变薄的半导体芯片，并且进一步用于半导体器件中，其中薄化半导体 芯片将被并入。

公开(公告)号：US07524699B2

公开(公告)日：2009-04-28

申请号：US10529565

申请日：2004-07-08

申请人： Edward Fuergut ,  Bernd Goller ,  Robert-Christian Hagen ,  Simon Jerebic ,  Jens Pohl ,  Peter Strobel ,  Holger Woerner

发明人： Edward Fuergut ,  Bernd Goller ,  Robert-Christian Hagen ,  Simon Jerebic ,  Jens Pohl ,  Peter Strobel ,  Holger Woerner

IPC分类号： H01L21/44 ,  H01L21/48 ,  H01L21/50

CPC分类号： H01L23/3128 ,  H01L23/49537 ,  H01L23/49575 ,  H01L24/45 ,  H01L24/48 ,  H01L24/97 ,  H01L25/065 ,  H01L25/0657 ,  H01L2224/05001 ,  H01L2224/05026 ,  H01L2224/05571 ,  H01L2224/056 ,  H01L2224/16 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/97 ,  H01L2225/0651 ,  H01L2225/06517 ,  H01L2225/06527 ,  H01L2225/06541 ,  H01L2225/06572 ,  H01L2225/06582 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/0101 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01057 ,  H01L2924/01058 ,  H01L2924/01068 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2224/85 ,  H01L2924/00 ,  H01L2224/05099 ,  H01L2924/00012

摘要： One embodiment of the invention relates to an electronic component having stacked semiconductor chips, and to a panel for production of the component. In one case, the stack has a flat conductor structure with a chip island on which a stacked semiconductor chip is arranged, while a first semiconductor chip is located underneath it. The chip island is surrounded by flat conductors which have contact pillars. These contact pillars have pillar contact pads which, together with the active upper face of the first semiconductor chip and the upper face areas of a plastic encapsulation compound form a coplanar overall upper face.

摘要翻译： 本发明的一个实施例涉及具有堆叠的半导体芯片的电子部件和用于生产部件的面板。 在一种情况下，堆叠具有平坦的导体结构，其中布置有堆叠半导体芯片的芯片岛，而第一半导体芯片位于其下方。 芯片岛由具有接触柱的扁平导体包围。 这些接触柱具有支柱接触垫，其与第一半导体芯片的有源上表面和塑料封装化合物的上表面区域一起形成共面的整个上表面。