Abstract:
Integrated circuits are provided that have volatile memory elements. The memory elements produce output signals. The integrated circuits may be programmable logic device integrated circuits containing programmable core logic including transistors with gates. The core logic is powered using a core logic power supply level defined by a core logic positive power supply voltage and a core logic ground voltage. When loaded with configuration data, the memory elements produce output signals that are applied to the gates of the transistors in the core logic to customize the programmable logic device. The memory elements are powered with a memory element power supply level defined by a memory element positive power supply voltage and a memory element ground power supply voltage. The memory element power supply level is elevated with respect to the core logic power supply level.
Abstract:
Integrated circuits are provided that have volatile memory elements. The memory elements produce output signals. The integrated circuits may be programmable logic device integrated circuits containing programmable core logic including transistors with gates. The core logic is powered using a core logic power supply level defined by a core logic positive power supply voltage and a core logic ground voltage. When loaded with configuration data, the memory elements produce output signals that are applied to the gates of the transistors in the core logic to customize the programmable logic device. The memory elements are powered with a memory element power supply level defined by a memory element positive power supply voltage and a memory element ground power supply voltage. The memory element power supply level is elevated with respect to the core logic power supply level.
Abstract:
Integrated circuits with memory elements are provided. An integrated circuit may include logic circuitry formed in a first portion having complementary metal-oxide-semiconductor (CMOS) devices and may include at least a portion of the memory elements and associated memory circuitry formed in a second portion having nano-electromechanical (NEM) relay devices. The NEM and CMOS devices may be interconnected through vias in a dielectric stack. Devices in the first and second portions may receive respective power supply voltages. In one suitable arrangement, the memory elements may include two relay switches that provide nonvolatile storage characteristics and soft error upset (SEU) immunity. In another suitable arrangement, the memory elements may include first and second cross-coupled inverting circuits. The first inverting circuit may include relay switches, whereas the second inverting circuit includes only CMOS transistors. Memory elements configured in this way may be used to provide volatile storage characteristics and SEU immunity.
Abstract:
Memory elements may be provided that include bi-stable data storage elements based on cross-coupled inverters. A pair of address transistors may be used to implement a differential data writing scheme for the memory elements. One of the address transistors may be coupled between a first data line and a first data storage node in each memory element and another of the address transistors may be coupled between a second data line and a second data storage node. A read circuit may be coupled to the second data storage node. Clear transistors may be interspersed through the array. The clear transistors may help pull the data lines to desired voltages during clear operations. An adjustable power supply may supply a weakened power supply voltage to a pull-up clear transistor and to the first and second inverters during clear operations.
Abstract:
Integrated circuits are provided that have volatile memory elements. The memory elements produce output signals. The integrated circuits may be programmable logic device integrated circuits containing programmable core logic including transistors with gates. The core logic is powered using a core logic power supply level defined by a core logic positive power supply voltage and a core logic ground voltage. When loaded with configuration data, the memory elements produce output signals that are applied to the gates of the transistors in the core logic to customize the programmable logic device. The memory elements are powered with a memory element power supply level defined by a memory element positive power supply voltage and a memory element ground power supply voltage. The memory element power supply level is elevated with respect to the core logic power supply level.
Abstract:
Integrated circuits such as programmable logic device integrated circuits have arrays of memory elements into which configuration data is loaded. The memory elements are formed form a pair of independently-powered cross-coupled inverters. Control circuitry generates a first inverter power supply signal and a second inverter power supply signal. The first and second inverter power supply signals are distributed to the inverters in the memory elements using pairs of inverter power distribution paths. When it is desired to reset the memory elements, the control circuitry takes the second power supply signal high before the first power supply signal. When it is desired to preset the memory elements, the control circuitry takes the second power supply high after the first power supply signal.
Abstract:
Integrated circuits with memory elements are provided. An integrated circuit may include logic circuitry formed in a first portion having complementary metal-oxide-semiconductor (CMOS) devices and may include at least a portion of the memory elements and associated memory circuitry formed in a second portion having nano-electromechanical (NEM) relay devices. The NEM and CMOS devices may be interconnected through vias in a dielectric stack. Devices in the first and second portions may receive respective power supply voltages. In one suitable arrangement, the memory elements may include two relay switches that provide nonvolatile storage characteristics and soft error upset (SEU) immunity. In another suitable arrangement, the memory elements may include first and second cross-coupled inverting circuits. The first inverting circuit may include relay switches, whereas the second inverting circuit includes only CMOS transistors. Memory elements configured in this way may be used to provide volatile storage characteristics and SEU immunity.
Abstract:
Integrated circuits are provided that have memory elements. The memory elements may be organized in an array. Data such as programmable logic device configuration data may be loaded into the array using read and write control circuitry. Each memory element may store data using a pair of cross-coupled inverters. Power supply circuitry may be used to power the cross-coupled inverters. A positive power supply signal and a ground power supply signal may be provided to the inverters by the power supply circuitry. Each memory element may have an associated clear transistor. A clear control signal may be asserted to turn on the clear transistor when clearing the memory elements. A given one of the inverters in each memory element may be momentarily weakened with respect to the clear transistor in that memory element by using the power supply circuitry to temporarily elevate the ground power supply signal.
Abstract:
Memory elements for integrated circuit are provided that have efficient transistor layouts. The integrated circuits may be programmable logic device integrated circuits on which memory elements are formed into arrays. Each memory element may have a pair of cross-coupled inverters, an address transistor, and a clear transistor. The transistors in each memory element may be formed from n-type and p-type semiconductor regions that are crossed by only three gate conductor fingers. Programmable transistors on the integrated circuit may be controlled by static output signals from the memory elements. The programmable transistors may be used to form multiplexers. The multiplexers may be formed from n-type regions that are crossed by only three gate fingers each. The gate fingers of the multiplexers may be aligned with the gate fingers of the transistor structures of the memory elements.
Abstract:
Integrated circuits are provided that have volatile memory elements. The memory elements produce output signals. The integrated circuits may be programmable logic device integrated circuits containing programmable core logic including transistors with gates. The core logic is powered using a core logic power supply level defined by a core logic positive power supply voltage and a core logic ground voltage. When loaded with configuration data, the memory elements produce output signals that are applied to the gates of the transistors in the core logic to customize the programmable logic device. The memory elements are powered with a memory element power supply level defined by a memory element positive power supply voltage and a memory element ground power supply voltage. The memory element power supply level is elevated with respect to the core logic power supply level.