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公开(公告)号：US10721817B2
公开(公告)日：2020-07-21
申请号：US15737498
申请日：2016-07-04
IPC分类号： C08L45/00 , H05K1/03 , C08J5/24 , C08F267/10 , C08G73/00 , C08F222/40 , C08F34/00 , C08G73/12 , C08G77/26 , C08G81/02 , C08L39/04 , C08L79/08 , C08L83/08
摘要： The resin composition of the present invention comprises a prepolymer (P) and a thermosetting component, the prepolymer (P) being obtained by polymerizing an alkenyl-substituted nadimide (A), a maleimide compound (B), and an amino-modified silicone (C).
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2.发明授权公开(公告)号：US10717837B2
公开(公告)日：2020-07-21
申请号：US15738834
申请日：2016-07-04
发明人： Katsuya Tomizawa , Eisuke Shiga , Meguru Ito , Tomo Chiba
IPC分类号： C08J5/24 , C08K3/00 , C08L79/04 , C08L57/00 , C08L35/00 , C08K5/3465 , H05K1/03 , B32B5/02 , B32B15/14 , C08K5/3447 , C08L65/02 , H01L23/14 , H01L23/00
摘要： The present invention provides a resin composition containing an alkenyl-substituted nadimide and a perinone-based colorant, wherein the content of the perinone-based colorant is 0.8 parts by mass or less based on 100 parts by mass in total of resin-constituting components in the resin composition.
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3.发明授权公开(公告)号：US10676579B2
公开(公告)日：2020-06-09
申请号：US15737504
申请日：2016-07-04
发明人： Katsuya Tomizawa , Yoichi Takano , Meguru Ito , Eisuke Shiga
IPC分类号： C08J5/24 , B32B27/30 , H05K1/03 , C08L35/00 , B32B5/00 , C08F2/44 , B32B15/082 , C09D4/00 , B32B27/00 , B32B15/08 , C08G61/10 , H05K1/09
摘要： It is intended to provide a resin composition that serves as a raw material for a printed circuit board excellent in heat resistance after moisture absorption and is excellent in moldability. The resin composition of the present invention contains a maleimide compound, a silane compound having a carbon-carbon unsaturated bond and a hydrolyzable group or a hydroxy group, a silane compound having an epoxy skeleton and a hydrolyzable group or a hydroxy group, and an inorganic filler.
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公开(公告)号：US20150267047A1
公开(公告)日：2015-09-24
申请号：US14435585
申请日：2013-10-18
发明人： Hiroshi Takahashi , Tomo Chiba , Nobuyoshi Ohnishi , Katsuya Tomizawa , Keisuke Takada , Eisuke Shiga , Takaaki Ogashiwa
IPC分类号： C08L65/00 , C08L63/00 , H05K1/03 , B32B27/06 , B32B27/38 , B32B27/28 , C08J5/24 , B32B15/092
CPC分类号： C08L63/00 , B32B5/024 , B32B15/092 , B32B15/14 , B32B27/06 , B32B27/28 , B32B27/283 , B32B27/38 , B32B2250/02 , B32B2260/021 , B32B2260/046 , B32B2262/101 , B32B2307/202 , B32B2307/206 , B32B2307/306 , B32B2457/08 , C08G59/621 , C08G77/045 , C08G77/14 , C08J5/24 , C08J2363/00 , C08J2365/00 , C08J2383/06 , C08J2463/00 , C08J2479/04 , C08J2483/06 , C08K3/013 , C08K3/34 , C08K3/36 , C08L71/126 , C08L83/06 , C08L2201/08 , C08L2203/20 , C08L2205/03 , C08L2205/035 , H05K1/0353 , H05K2201/012 , H05K2201/0162 , H05K2201/0209 , H05K2201/029 , Y10T428/31511 , Y10T428/31529 , C08K3/0033
摘要： A resin composition containing a cyclic epoxy-modified silicone compound (A) represented by formula (1), a cyanic acid ester compound (B) and/or a phenol resin (C) and an inorganic filler (D): wherein Ra each independently represent an organic group having an epoxy group; Rb each independently represent a substituted or unsubstituted monovalent hydrocarbon group; x represents an integer of 0 to 2; and y represents an integer of 1 to 6; and the siloxane unit marked with x and the siloxane unit marked with y are arranged mutually at random.
摘要翻译： 含有由式（1）表示的环状环氧改性硅氧烷化合物（A），氰酸酯化合物（B）和/或酚醛树脂（C）和无机填料（D）的树脂组合物：其中Ra各自独立地 表示具有环氧基的有机基团; Rb各自独立地表示取代或未取代的单价烃基; x表示0〜2的整数， y表示1〜6的整数。 标有x的硅氧烷单元和标有y的硅氧烷单元相互排列。
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5.发明授权公开(公告)号：US11769607B2
公开(公告)日：2023-09-26
申请号：US17527417
申请日：2021-11-16
发明人： Katsuya Tomizawa , Yoichi Takano , Meguru Ito , Eisuke Shiga
IPC分类号： H01B3/44 , B32B27/34 , B32B5/00 , C08K3/00 , B32B27/00 , C08L101/00 , C08K5/54 , C08K5/5415 , C08K9/06 , H05K1/03 , C08L79/00 , C08J7/043 , C08J5/24 , C08K5/20 , C08K5/3415 , C08K5/5419 , C08L25/18 , H01B3/50 , C08K5/05
CPC分类号： H01B3/442 , B32B5/00 , B32B27/00 , B32B27/34 , C08J5/244 , C08J5/249 , C08J7/043 , C08K3/00 , C08K5/05 , C08K5/20 , C08K5/3415 , C08K5/5415 , C08K5/5419 , C08K9/06 , C08L25/18 , C08L79/00 , C08L101/00 , H01B3/50 , H05K1/03 , H05K1/0373 , C08L2203/20 , H05K2201/0209
摘要： A resin composition comprising a maleimide compound, a cyanate ester compound, a silane compound having a styrene skeleton and a hydrolyzable group or a hydroxy group, and an inorganic filler.
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6.发明授权公开(公告)号：US11195638B2
公开(公告)日：2021-12-07
申请号：US16744625
申请日：2020-01-16
发明人： Katsuya Tomizawa , Yoichi Takano , Meguru Ito , Eisuke Shiga
IPC分类号： H01B3/44 , B32B27/34 , B32B5/00 , C08K3/00 , B32B27/00 , C08L101/00 , C08J5/24 , C08K5/54 , C08K5/5415 , C08K9/06 , H05K1/03 , C08L79/00 , C08J7/043 , C08K5/20 , C08K5/3415 , C08K5/5419 , C08L25/18 , H01B3/50
摘要： A resin composition that includes a maleimide compound, an alkenyl-substituted nadimide, a silane compound having a styrene skeleton and a hydrolyzable group or a hydroxy group, and an inorganic filler.
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7.发明授权公开(公告)号：US10030141B2
公开(公告)日：2018-07-24
申请号：US14435574
申请日：2013-10-18
发明人： Tomo Chiba , Hiroshi Takahashi , Eisuke Shiga , Takaaki Ogashiwa
IPC分类号： B32B3/10 , C08L73/00 , C08L63/00 , C08G59/24 , C08G59/42 , C08G59/62 , C08L63/06 , H05K1/03 , C08J5/24 , C08K3/34 , C08K3/36 , C08L83/06 , C08L83/14 , B32B5/26 , B32B15/14 , C08G77/52 , C08G77/18
摘要： An object of the present invention is to provide a resin composition that can attain cured products having high flame retardancy, high heat resistance, a small coefficient of thermal expansion, and high drilling processability, a prepreg having the resin composition, a laminate and a metal foil clad laminate having the prepreg, and a printed circuit board having the resin composition. A resin composition, having at least an epoxy silicone resin (A) prepared by reacting a linear polysiloxane (a) having a carboxyl group with a cyclic epoxy compound (b) having an epoxy group such that the epoxy group of the cyclic epoxy compound (b) is 2 to 10 equivalents based on the carboxyl group of the linear polysiloxane (a), a cyanic acid ester compound (B) and/or a phenol resin (C), and an inorganic filler (D).
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公开(公告)号：US09902851B2
公开(公告)日：2018-02-27
申请号：US14435585
申请日：2013-10-18
发明人： Hiroshi Takahashi , Tomo Chiba , Nobuyoshi Ohnishi , Katsuya Tomizawa , Keisuke Takada , Eisuke Shiga , Takaaki Ogashiwa
IPC分类号： C08L63/00 , C08G59/62 , H05K1/03 , C08J5/24 , C08K3/34 , C08K3/36 , B32B15/092 , B32B27/06 , B32B27/28 , B32B27/38 , B32B5/02 , B32B15/14 , C08L83/06 , C08G77/04 , C08G77/14
CPC分类号： C08L63/00 , B32B5/024 , B32B15/092 , B32B15/14 , B32B27/06 , B32B27/28 , B32B27/283 , B32B27/38 , B32B2250/02 , B32B2260/021 , B32B2260/046 , B32B2262/101 , B32B2307/202 , B32B2307/206 , B32B2307/306 , B32B2457/08 , C08G59/621 , C08G77/045 , C08G77/14 , C08J5/24 , C08J2363/00 , C08J2365/00 , C08J2383/06 , C08J2463/00 , C08J2479/04 , C08J2483/06 , C08K3/013 , C08K3/34 , C08K3/36 , C08L71/126 , C08L83/06 , C08L2201/08 , C08L2203/20 , C08L2205/03 , C08L2205/035 , H05K1/0353 , H05K2201/012 , H05K2201/0162 , H05K2201/0209 , H05K2201/029 , Y10T428/31511 , Y10T428/31529 , C08K3/0033
摘要： A resin composition containing a cyclic epoxy-modified silicone compound (A) represented by formula (1), a cyanic acid ester compound (B) and/or a phenol resin (C) and an inorganic filler (D): wherein Ra each independently represent an organic group having an epoxy group; Rb each independently represent a substituted or unsubstituted monovalent hydrocarbon group; x represents an integer of 0 to 2; and y represents an integer of 1 to 6; and the siloxane unit marked with x and the siloxane unit marked with y are arranged mutually at random.
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9.发明授权公开(公告)号：US10815349B2
公开(公告)日：2020-10-27
申请号：US15738840
申请日：2016-07-04
IPC分类号： C08J5/24 , C08L63/00 , C08K5/3417 , C08K5/3445 , C08K5/3415 , C08L79/08 , C09D179/08 , C08L79/00 , C08G61/02 , C08G73/00 , H01L23/14 , H01L23/00 , H05K1/03 , H01L21/48 , H05K3/02
摘要： It is intended to provide a resin composition that suppresses the thermal expansion of a printed circuit board more than ever and also prevents the bleedout of substances from the printed circuit board, while maintaining a high glass transition temperature. The resin composition of the present invention contains an alkenyl-substituted nadimide, a maleimide compound, and an epoxy-modified cyclic silicone compound.
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公开(公告)号：US10703874B2
公开(公告)日：2020-07-07
申请号：US15738400
申请日：2016-07-04
发明人： Yoichi Takano , Nobuyoshi Ohnishi , Katsuya Tomizawa , Naoki Kashima , Hiroshi Takahashi , Eisuke Shiga
IPC分类号： C08G73/00 , C08J5/24 , C08F222/40 , B32B17/04 , C09D4/00 , C09D4/06 , C08F236/20 , B32B5/28 , B32B27/00 , C08F2/44 , H05K1/03 , B32B5/02 , B32B15/14 , C08G73/10 , H01L23/14 , H01L23/00 , C08K3/22 , C08K3/28 , C08K3/36 , H01L21/48
摘要： The resin composition of the present invention comprises an alkenyl-substituted nadimide (A), a maleimide compound (B), and an amino-modified silicone (C).
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