- 专利标题： Resin composition, prepreg, laminate, and printed wiring board
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申请号： US14435585申请日： 2013-10-18
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公开(公告)号： US09902851B2公开(公告)日： 2018-02-27
- 发明人: Hiroshi Takahashi , Tomo Chiba , Nobuyoshi Ohnishi , Katsuya Tomizawa , Keisuke Takada , Eisuke Shiga , Takaaki Ogashiwa
- 申请人： MITSUBISHI GAS CHEMICAL COMPANY, INC.
- 申请人地址： JP Tokyo
- 专利权人： MITSUBISHI GAS CHEMICAL COMPANY, INC.
- 当前专利权人： MITSUBISHI GAS CHEMICAL COMPANY, INC.
- 当前专利权人地址： JP Tokyo
- 代理机构： Greenblum & Bernstein, P.L.C.
- 优先权： JP2012-231632 20121019; JP2013-169894 20130819
- 国际申请： PCT/JP2013/078389 WO 20131018
- 国际公布： WO2014/061812 WO 20140424
- 主分类号： C08L63/00
- IPC分类号： C08L63/00 ; C08G59/62 ; H05K1/03 ; C08J5/24 ; C08K3/34 ; C08K3/36 ; B32B15/092 ; B32B27/06 ; B32B27/28 ; B32B27/38 ; B32B5/02 ; B32B15/14 ; C08L83/06 ; C08G77/04 ; C08G77/14
摘要：
A resin composition containing a cyclic epoxy-modified silicone compound (A) represented by formula (1), a cyanic acid ester compound (B) and/or a phenol resin (C) and an inorganic filler (D): wherein Ra each independently represent an organic group having an epoxy group; Rb each independently represent a substituted or unsubstituted monovalent hydrocarbon group; x represents an integer of 0 to 2; and y represents an integer of 1 to 6; and the siloxane unit marked with x and the siloxane unit marked with y are arranged mutually at random.
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