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公开(公告)号：US07208806B2
公开(公告)日：2007-04-24
申请号：US11273827
申请日：2005-11-14
Applicant: Kui Yao , Xujiang He , Jian Zhang , Santiranjan Shannigrahi
Inventor： Kui Yao , Xujiang He , Jian Zhang , Santiranjan Shannigrahi
CPC classification number: B81C1/00587 , B81B3/0035
Abstract: A method for fabricating a MEMS device comprises providing a substrate having a back side, a front side opposite to the back side and a periphery portion. A desired microstructure is formed on the back side of the substrate. The substrate is then supported for rotation. A precursor solution is deposited on the front side of the substrate during rotation so that a thin film layer may be formed thereon. During formation of the thin film layer, the substrate is supported and rotated that the microstructure formed on the back side is protected.
Abstract translation: 一种制造MEMS器件的方法包括提供具有背面，与背侧相对的正面和周边部分的基板。 在衬底的背面形成所需的微结构。 然后支撑基板旋转。 在旋转期间，前体溶液沉积在基板的前侧，从而可以在其上形成薄膜层。 在形成薄膜层的过程中，基板被支撑并旋转，使得在背面形成的微结构被保护。
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公开(公告)号：US20050014306A1
公开(公告)日：2005-01-20
申请号：US10619923
申请日：2003-07-15
Applicant: Kui Yao , Xujiang He , Jian Zhang , Santiranjan Shannigrahi
Inventor： Kui Yao , Xujiang He , Jian Zhang , Santiranjan Shannigrahi
IPC: B81C1/00 , B81B1/00 , B81B3/00 , H01L21/00 , H01L41/08 , H01L41/09 , H01L41/18 , H01L41/22 , H01L41/24
CPC classification number: B81C1/00587 , B81B3/0035
Abstract: A method for fabricating a MEMS device comprises providing a substrate having a back side, a front side opposite to the back side and a periphery portion. A desired microstructure is formed on the back side of the substrate. The substrate is then supported for rotation. A precursor solution is deposited on the front side of the substrate during rotation so that a thin film layer may be formed thereon. During formation of the thin film layer, the substrate is supported and rotated that the microstructure formed on the back side is protected.
Abstract translation: 一种制造MEMS器件的方法包括提供具有背面，与背侧相对的正面和周边部分的基板。 在衬底的背面形成所需的微结构。 然后支撑基板旋转。 在旋转期间，前体溶液沉积在基板的前侧，从而可以在其上形成薄膜层。 在形成薄膜层的过程中，基板被支撑并旋转，使得在背面形成的微结构被保护。
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公开(公告)号：US20070164634A1
公开(公告)日：2007-07-19
申请号：US11568114
申请日：2004-04-23
Applicant: Kui Yao , Xiao Song Tang , Peng Gao , Xujiang He , Jian Zhang , Santiranjan Shannigrahi
Inventor： Kui Yao , Xiao Song Tang , Peng Gao , Xujiang He , Jian Zhang , Santiranjan Shannigrahi
CPC classification number: H01L41/0946 , H01L41/1876 , H01L41/25 , H01L41/318 , Y10T29/42 , Y10T29/435 , Y10T29/49005 , Y10T29/4902 , Y10T29/49144 , Y10T29/49153
Abstract: An electromechanical device includes a support structure formed by attaching inner surfaces of second and third substrates to a first substrate. The support structure includes at least one cavity between the second and third layers. An electromechanical active element is provided on an outer surface of at least one of the second or third layers.
Abstract translation: 机电装置包括通过将第二和第三基板的内表面附接到第一基板而形成的支撑结构。 支撑结构包括在第二和第三层之间的至少一个空腔。 机电有源元件设置在第二层或第三层中的至少一层的外表面上。
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公开(公告)号：US07018862B2
公开(公告)日：2006-03-28
申请号：US10619923
申请日：2003-07-15
Applicant: Kui Yao , Xujiang He , Jian Zhang , Santiranjan Shannigrahi
Inventor： Kui Yao , Xujiang He , Jian Zhang , Santiranjan Shannigrahi
IPC: H01L21/46
CPC classification number: B81C1/00587 , B81B3/0035
Abstract: A method for fabricating a MEMS device comprises providing a substrate having a back side, a front side opposite to the back side and a periphery portion. A desired microstructure is formed on the back side of the substrate. The substrate is then supported for rotation. A precursor solution is deposited on the front side of the substrate during rotation so that a thin film layer may be formed thereon. During formation of the thin film layer, the substrate is supported and rotated that the microstructure formed on the back side is protected.
Abstract translation: 一种制造MEMS器件的方法包括提供具有背面，与背侧相对的正面和周边部分的基板。 在衬底的背面形成所需的微结构。 然后支撑基板旋转。 在旋转期间，前体溶液沉积在基板的前侧，从而可以在其上形成薄膜层。 在形成薄膜层的过程中，基板被支撑并旋转，使得在背面形成的微结构被保护。
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公开(公告)号：US20100019623A1
公开(公告)日：2010-01-28
申请号：US12573161
申请日：2009-10-05
Applicant: Kui Yao , Xiao Song Eric Tang , Jian Zhang , Santiranjan Shannigrahi , Peng Gao , Xujiang HE
Inventor： Kui Yao , Xiao Song Eric Tang , Jian Zhang , Santiranjan Shannigrahi , Peng Gao , Xujiang HE
IPC: H01L41/053 , H01L41/04
CPC classification number: H01L41/0946 , H01L41/1876 , H01L41/25 , H01L41/318 , Y10T29/42 , Y10T29/435 , Y10T29/49005 , Y10T29/4902 , Y10T29/49144 , Y10T29/49153
Abstract: An electromechanical device includes a support structure formed by attaching inner surfaces of second and third substrates to a first substrate. The support structure includes at least one cavity between the second and third layers. An electromechanical active element is provided on an outer surface of at least one of the second or third layers.
Abstract translation: 机电装置包括通过将第二和第三基板的内表面附接到第一基板而形成的支撑结构。 支撑结构包括在第二和第三层之间的至少一个空腔。 机电有源元件设置在第二层或第三层中的至少一层的外表面上。
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Patent Agency Ranking
公开(公告)号：US07596841B2
公开(公告)日：2009-10-06
申请号：US11568114
申请日：2004-04-23
Applicant: Kui Yao , Xiao Song Eric Tang , Peng Gao , Xujiang He , Jian Zhang , Santiranjan Shannigrahi
Inventor： Kui Yao , Xiao Song Eric Tang , Peng Gao , Xujiang He , Jian Zhang , Santiranjan Shannigrahi
CPC classification number: H01L41/0946 , H01L41/1876 , H01L41/25 , H01L41/318 , Y10T29/42 , Y10T29/435 , Y10T29/49005 , Y10T29/4902 , Y10T29/49144 , Y10T29/49153
Abstract: An electromechanical device includes a support structure formed by attaching inner surfaces of second and third substrates to a first substrate. The support structure includes at least one cavity between the second and third layers. An electromechanical active element is provided on an outer surface of at least one of the second or third layers.
Abstract translation: 机电装置包括通过将第二和第三基板的内表面附接到第一基板而形成的支撑结构。 支撑结构包括在第二和第三层之间的至少一个空腔。 机电有源元件设置在第二层或第三层中的至少一层的外表面上。
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公开(公告)号：US20060068564A1
公开(公告)日：2006-03-30
申请号：US11273827
申请日：2005-11-14
Applicant: Kui Yao , Xujiang He , Jian Zhang , Santiranjan Shannigrahi
Inventor： Kui Yao , Xujiang He , Jian Zhang , Santiranjan Shannigrahi
CPC classification number: B81C1/00587 , B81B3/0035
Abstract: A method for fabricating a MEMS device comprises providing a substrate having a back side, a front side opposite to the back side and a periphery portion. A desired microstructure is formed on the back side of the substrate. The substrate is then supported for rotation. A precursor solution is deposited on the front side of the substrate during rotation so that a thin film layer may be formed thereon. During formation of the thin film layer, the substrate is supported and rotated that the microstructure formed on the back side is protected.
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公开(公告)号：USD980356S1
公开(公告)日：2023-03-07
申请号：US29844017
申请日：2022-06-25
Applicant: Jian Zhang
Designer： Jian Zhang
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公开(公告)号：US11524401B1
公开(公告)日：2022-12-13
申请号：US16829277
申请日：2020-03-25
Applicant: Jian Zhang , Mario J. Srouji , Ruslan Salakhutdinov
Inventor： Jian Zhang , Mario J. Srouji , Ruslan Salakhutdinov
Abstract: A method includes determining motion imitation information for causing a system to imitate a physical task using a first machine learning model that is trained using motion information that represents a performance of the physical task, determining a predicted correction based on the motion information and a current state from the system using a second machine learning model that is trained using the motion information, determining an action to be performed by the system based on the motion imitation information and the predicted correction; and controlling motion of the system in accordance with the action.
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公开(公告)号：US20220005720A1
公开(公告)日：2022-01-06
申请号：US16873779
申请日：2020-07-02
Applicant: Jian Zhang
Inventor： Jian Zhang
IPC: H01L21/68 , H01L21/67 , H01L21/687 , H01L21/683 , H01L23/00
Abstract: The present invention comprises an arrangement and process for the fluxless manufacture of an integrated circuit component, comprising the steps of loading a solder ball and chip arrangement, solder ball side up or down, onto a first or a second donor chuck respectively; monitoring the solder ball and chip arrangement by a computer-controlled camera; removing the solder ball and chip arrangement from the donor chuck by a computer-controlled gripper mechanism; moving the solder ball and chip arrangement via the gripper mechanism onto a computer-controlled gang carrier, the monitored by a second computer controlled camera; flipping the gang carrier about a horizontal axis so as to arrange the solder ball and chip arrangement into an inverted, solder ball side down orientation over a receiver chuck substrate, monitored and positionally controlled by a third computer-controlled camera; and compressing the solder ball side down solder ball and chip arrangement onto the receiver chuck substrate by a computer-controlled compression rod so as to bond the solder ball side down solder ball and chip arrangement onto the receiver chuck substrate so as to form an integrated circuit assembly.
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