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公开(公告)号：US07208806B2
公开(公告)日：2007-04-24
申请号：US11273827
申请日：2005-11-14
Applicant: Kui Yao , Xujiang He , Jian Zhang , Santiranjan Shannigrahi
Inventor： Kui Yao , Xujiang He , Jian Zhang , Santiranjan Shannigrahi
CPC classification number: B81C1/00587 , B81B3/0035
Abstract: A method for fabricating a MEMS device comprises providing a substrate having a back side, a front side opposite to the back side and a periphery portion. A desired microstructure is formed on the back side of the substrate. The substrate is then supported for rotation. A precursor solution is deposited on the front side of the substrate during rotation so that a thin film layer may be formed thereon. During formation of the thin film layer, the substrate is supported and rotated that the microstructure formed on the back side is protected.
Abstract translation: 一种制造MEMS器件的方法包括提供具有背面，与背侧相对的正面和周边部分的基板。 在衬底的背面形成所需的微结构。 然后支撑基板旋转。 在旋转期间，前体溶液沉积在基板的前侧，从而可以在其上形成薄膜层。 在形成薄膜层的过程中，基板被支撑并旋转，使得在背面形成的微结构被保护。
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Patent Agency Ranking
公开(公告)号：US20050014306A1
公开(公告)日：2005-01-20
申请号：US10619923
申请日：2003-07-15
Applicant: Kui Yao , Xujiang He , Jian Zhang , Santiranjan Shannigrahi
Inventor： Kui Yao , Xujiang He , Jian Zhang , Santiranjan Shannigrahi
IPC: B81C1/00 , B81B1/00 , B81B3/00 , H01L21/00 , H01L41/08 , H01L41/09 , H01L41/18 , H01L41/22 , H01L41/24
CPC classification number: B81C1/00587 , B81B3/0035
Abstract: A method for fabricating a MEMS device comprises providing a substrate having a back side, a front side opposite to the back side and a periphery portion. A desired microstructure is formed on the back side of the substrate. The substrate is then supported for rotation. A precursor solution is deposited on the front side of the substrate during rotation so that a thin film layer may be formed thereon. During formation of the thin film layer, the substrate is supported and rotated that the microstructure formed on the back side is protected.
Abstract translation: 一种制造MEMS器件的方法包括提供具有背面，与背侧相对的正面和周边部分的基板。 在衬底的背面形成所需的微结构。 然后支撑基板旋转。 在旋转期间，前体溶液沉积在基板的前侧，从而可以在其上形成薄膜层。 在形成薄膜层的过程中，基板被支撑并旋转，使得在背面形成的微结构被保护。
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公开(公告)号：US20070164634A1
公开(公告)日：2007-07-19
申请号：US11568114
申请日：2004-04-23
Applicant: Kui Yao , Xiao Song Tang , Peng Gao , Xujiang He , Jian Zhang , Santiranjan Shannigrahi
Inventor： Kui Yao , Xiao Song Tang , Peng Gao , Xujiang He , Jian Zhang , Santiranjan Shannigrahi
CPC classification number: H01L41/0946 , H01L41/1876 , H01L41/25 , H01L41/318 , Y10T29/42 , Y10T29/435 , Y10T29/49005 , Y10T29/4902 , Y10T29/49144 , Y10T29/49153
Abstract: An electromechanical device includes a support structure formed by attaching inner surfaces of second and third substrates to a first substrate. The support structure includes at least one cavity between the second and third layers. An electromechanical active element is provided on an outer surface of at least one of the second or third layers.
Abstract translation: 机电装置包括通过将第二和第三基板的内表面附接到第一基板而形成的支撑结构。 支撑结构包括在第二和第三层之间的至少一个空腔。 机电有源元件设置在第二层或第三层中的至少一层的外表面上。
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公开(公告)号：US07018862B2
公开(公告)日：2006-03-28
申请号：US10619923
申请日：2003-07-15
Applicant: Kui Yao , Xujiang He , Jian Zhang , Santiranjan Shannigrahi
Inventor： Kui Yao , Xujiang He , Jian Zhang , Santiranjan Shannigrahi
IPC: H01L21/46
CPC classification number: B81C1/00587 , B81B3/0035
Abstract: A method for fabricating a MEMS device comprises providing a substrate having a back side, a front side opposite to the back side and a periphery portion. A desired microstructure is formed on the back side of the substrate. The substrate is then supported for rotation. A precursor solution is deposited on the front side of the substrate during rotation so that a thin film layer may be formed thereon. During formation of the thin film layer, the substrate is supported and rotated that the microstructure formed on the back side is protected.
Abstract translation: 一种制造MEMS器件的方法包括提供具有背面，与背侧相对的正面和周边部分的基板。 在衬底的背面形成所需的微结构。 然后支撑基板旋转。 在旋转期间，前体溶液沉积在基板的前侧，从而可以在其上形成薄膜层。 在形成薄膜层的过程中，基板被支撑并旋转，使得在背面形成的微结构被保护。
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公开(公告)号：US07596841B2
公开(公告)日：2009-10-06
申请号：US11568114
申请日：2004-04-23
Applicant: Kui Yao , Xiao Song Eric Tang , Peng Gao , Xujiang He , Jian Zhang , Santiranjan Shannigrahi
Inventor： Kui Yao , Xiao Song Eric Tang , Peng Gao , Xujiang He , Jian Zhang , Santiranjan Shannigrahi
CPC classification number: H01L41/0946 , H01L41/1876 , H01L41/25 , H01L41/318 , Y10T29/42 , Y10T29/435 , Y10T29/49005 , Y10T29/4902 , Y10T29/49144 , Y10T29/49153
Abstract: An electromechanical device includes a support structure formed by attaching inner surfaces of second and third substrates to a first substrate. The support structure includes at least one cavity between the second and third layers. An electromechanical active element is provided on an outer surface of at least one of the second or third layers.
Abstract translation: 机电装置包括通过将第二和第三基板的内表面附接到第一基板而形成的支撑结构。 支撑结构包括在第二和第三层之间的至少一个空腔。 机电有源元件设置在第二层或第三层中的至少一层的外表面上。
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公开(公告)号：US20060068564A1
公开(公告)日：2006-03-30
申请号：US11273827
申请日：2005-11-14
Applicant: Kui Yao , Xujiang He , Jian Zhang , Santiranjan Shannigrahi
Inventor： Kui Yao , Xujiang He , Jian Zhang , Santiranjan Shannigrahi
CPC classification number: B81C1/00587 , B81B3/0035
Abstract: A method for fabricating a MEMS device comprises providing a substrate having a back side, a front side opposite to the back side and a periphery portion. A desired microstructure is formed on the back side of the substrate. The substrate is then supported for rotation. A precursor solution is deposited on the front side of the substrate during rotation so that a thin film layer may be formed thereon. During formation of the thin film layer, the substrate is supported and rotated that the microstructure formed on the back side is protected.
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