Invention Grant
- Patent Title: Micro-electromechanical devices and methods of fabricating thereof
- Patent Title (中): 微机电装置及其制造方法
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Application No.: US11568114Application Date: 2004-04-23
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Publication No.: US07596841B2Publication Date: 2009-10-06
- Inventor: Kui Yao , Xiao Song Eric Tang , Peng Gao , Xujiang He , Jian Zhang , Santiranjan Shannigrahi
- Applicant: Kui Yao , Xiao Song Eric Tang , Peng Gao , Xujiang He , Jian Zhang , Santiranjan Shannigrahi
- Applicant Address: SG Singapore JP Tokyo
- Assignee: Agency for Science Technology and Research,Sony Corporation
- Current Assignee: Agency for Science Technology and Research,Sony Corporation
- Current Assignee Address: SG Singapore JP Tokyo
- Agency: Horizon IP Pte Ltd
- International Application: PCT/SG2004/000107 WO 20040423
- International Announcement: WO2005/104257 WO 20051103
- Main IPC: H01L41/22
- IPC: H01L41/22 ; H01L41/00
Abstract:
An electromechanical device includes a support structure formed by attaching inner surfaces of second and third substrates to a first substrate. The support structure includes at least one cavity between the second and third layers. An electromechanical active element is provided on an outer surface of at least one of the second or third layers.
Public/Granted literature
- US20070164634A1 Micro-electromechanical device Public/Granted day:2007-07-19
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