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公开(公告)号：US20140264793A1
公开(公告)日：2014-09-18
申请号：US13794841
申请日：2013-03-12
申请人： Kai Yun Yow , Alexander M. Arayata , Jian Wen
发明人： Kai Yun Yow , Alexander M. Arayata , Jian Wen
IPC分类号： H01L23/495
CPC分类号： H01L23/49568 , H01L23/3107 , H01L23/49503 , H01L23/49541 , H01L23/49565 , H01L24/06 , H01L24/32 , H01L24/48 , H01L24/49 , H01L24/73 , H01L2224/04042 , H01L2224/05554 , H01L2224/06163 , H01L2224/06165 , H01L2224/32145 , H01L2224/48145 , H01L2224/48247 , H01L2224/49113 , H01L2224/49171 , H01L2224/49175 , H01L2224/73265 , H01L2924/00014 , H01L2924/1461 , H01L2924/00012 , H01L2924/00 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： A semiconductor package includes a lead frame, a semiconductor die, bond wires providing an electrical connection between the die and the lead frame, and a mold compound that encapsulates the lead frame, the die and the bond wires. The lead frame includes spaced apart first and second frame members each having an inner peripheral edge and an opposing outer peripheral edge, spaced apart lead pads disposed between the inner peripheral edges of the first and second frame members, and conductive leads disposed proximate to the outer peripheral edge of each of the first and second frame members. The die is mounted on the lead pads.
摘要翻译： 半导体封装包括引线框架，半导体管芯，在管芯和引线框架之间提供电连接的接合线以及封装引线框架，管芯和接合线的模具化合物。 引线框架包括间隔开的第一和第二框架构件，每个具有内周边缘和相对的外周边缘，间隔开的引线焊盘，设置在第一和第二框架构件的内周边缘之间，以及导电引线设置在靠近外部 每个第一和第二框架构件的周边边缘。 芯片安装在引线板上。
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公开(公告)号：US08836091B1
公开(公告)日：2014-09-16
申请号：US13794841
申请日：2013-03-12
申请人： Kai Yun Yow , Alexander M. Arayata , Jian Wen
发明人： Kai Yun Yow , Alexander M. Arayata , Jian Wen
IPC分类号： H01L23/495
CPC分类号： H01L23/49568 , H01L23/3107 , H01L23/49503 , H01L23/49541 , H01L23/49565 , H01L24/06 , H01L24/32 , H01L24/48 , H01L24/49 , H01L24/73 , H01L2224/04042 , H01L2224/05554 , H01L2224/06163 , H01L2224/06165 , H01L2224/32145 , H01L2224/48145 , H01L2224/48247 , H01L2224/49113 , H01L2224/49171 , H01L2224/49175 , H01L2224/73265 , H01L2924/00014 , H01L2924/1461 , H01L2924/00012 , H01L2924/00 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： A semiconductor package includes a lead frame, a semiconductor die, bond wires providing an electrical connection between the die and the lead frame, and a mold compound that encapsulates the lead frame, the die and the bond wires. The lead frame includes spaced apart first and second frame members each having an inner peripheral edge and an opposing outer peripheral edge, spaced apart lead pads disposed between the inner peripheral edges of the first and second frame members, and conductive leads disposed proximate to the outer peripheral edge of each of the first and second frame members. The die is mounted on the lead pads.
摘要翻译： 半导体封装包括引线框架，半导体管芯，在管芯和引线框架之间提供电连接的接合线以及封装引线框架，管芯和接合线的模具化合物。 引线框架包括间隔开的第一和第二框架构件，每个具有内周边缘和相对的外周边缘，间隔开的引线焊盘，设置在第一和第二框架构件的内周边缘之间，以及导电引线设置在靠近外部 每个第一和第二框架构件的周边边缘。 芯片安装在引线板上。
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公开(公告)号：US20050140142A1
公开(公告)日：2005-06-30
申请号：US11065759
申请日：2005-02-25
申请人： Richard Welches , Daniel Hohm , Jian Wen
发明人： Richard Welches , Daniel Hohm , Jian Wen
IPC分类号： H02J3/01 , H02J3/18 , H02J3/30 , H02J9/06 , H02M5/458 , H02P9/48 , H02P9/04 , F02N11/06 , H02P1/46 , H02P3/18
CPC分类号： H02P9/48 , H02J3/01 , H02J3/1864 , H02J3/30 , H02J9/062 , H02M5/458 , H02P2101/45 , Y02E40/40 , Y02E60/16
摘要： The invention in one embodiment is an improved variable speed engine/generator set with an integrated power conditioning system and control method including load shedding to generate high quality AC power with improved fuel efficiency and reduced emissions. The variable speed generator control scheme allows for load adaptive speed control of engine and generator field. The transformerless power inverter topology and control method provides the necessary output frequency, voltage and/or current waveform regulation, harmonic distortion rejection, and provides for single phase, or unbalanced loading.
摘要翻译： 在一个实施例中，本发明是一种改进的变速发动机/发电机组，其具有集成的功率调节系统和控制方法，包括负载脱落以产生具有改进的燃料效率和减少的排放的高质量AC电力。 变速发电机控制方案允许发动机和发电机领域的负载自适应速度控制。 无变压器功率逆变器拓扑和控制方法提供必要的输出频率，电压和/或电流波形调节，谐波失真抑制，并提供单相或不平衡负载。
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公开(公告)号：US09044735B2
公开(公告)日：2015-06-02
申请号：US12892618
申请日：2010-09-28
申请人： Jian Wen , Jerome P. Ferrance , James P. Landers
发明人： Jian Wen , Jerome P. Ferrance , James P. Landers
CPC分类号： B01J20/103 , B01J20/26 , B01J20/264 , B01J20/28014 , B01J20/28042 , B01J20/3278 , B01J2220/58 , B01J2220/82
摘要： The present invention relates to the fabrication of a grafted, UV photo-polymerized silica-based monolithic column and the use of such column for the extraction of DNA. In one embodiment, a method is provided for fabricating a silica-based monolithic column, wherein a vessel is filled with a polymerization mixture that is formed into monolithic solid phase for DNA extraction through in situ photo-polymerization.
摘要翻译： 本发明涉及一种接枝的UV光聚合二氧化硅基整体柱的制造，以及这种柱用于提取DNA的用途。 在一个实施方案中，提供了一种用于制造二氧化硅基整体柱的方法，其中容器填充有聚合混合物，其通过原位光聚合形成用于DNA提取的整体固相。
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6.发明授权Lead frame having a flag with in-plane and out-of-plane mold locking features 有权引线框架具有带平面和平面外模具锁定功能的标志公开(公告)号：US08742555B2
公开(公告)日：2014-06-03
申请号：US13220898
申请日：2011-08-30
申请人： Jian Wen , Darrel R. Frear , William G. McDonald
发明人： Jian Wen , Darrel R. Frear , William G. McDonald
IPC分类号： H01L23/62 , H01L23/495
CPC分类号： H01L23/49503 , H01L21/565 , H01L23/3107 , H01L23/49544 , H01L23/49548 , H01L23/49551 , H01L23/49555 , H01L24/73 , H01L2224/32245 , H01L2224/48091 , H01L2224/48247 , H01L2224/73265 , H01L2924/00 , H01L2924/00012 , H01L2924/00014
摘要： A semiconductor device lead frame having enhanced mold locking features is provided. The lead frame has a flag with bendable edge features along the edge of the flag. Each edge feature is shaped to resist movement against encapsulating mold material in a plane of the edge feature. By bending a portion of the edge feature, improved mold locking of the flag is provided in multiple planes.
摘要翻译： 提供了具有增强的模具锁定特征的半导体器件引线框架。 引线框架具有沿着标志边缘的可弯曲边缘特征的标志。 每个边缘特征被成形为抵抗将模具材料封装在边缘特征的平面内的运动。 通过弯曲边缘特征的一部分，在多个平面中提供了标志的改进的模具锁定。
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公开(公告)号：US20140033814A1
公开(公告)日：2014-02-06
申请号：US13562853
申请日：2012-07-31
申请人： Jian Wen , William G. McDonald
发明人： Jian Wen , William G. McDonald
CPC分类号： G01L19/14 , G01L19/0038 , G01L19/0654 , G01L19/141 , G01L19/145 , H01L2224/48091 , H01L2224/48145 , H01L2924/16235 , H01L2924/181 , H01L2924/00012 , H01L2924/00014
摘要： An overmolded pressure sensor package is provided. The pressure sensor die (Pcell) is capped so that the Pcell has enhanced rigidity to withstand stress effects produced by the molding encapsulant. The Pcell cap includes a hole located away from the Pcell diaphragm, so that external gas pressure can be experienced by the Pcell, while at the same time directing moisture away from the diaphragm. Gel does not need to be used, and instead a soft film can be deposited on the Pcell to protect the Pcell diaphragm from excess moisture, if needed. The Pcell cap can take the form of, for example, a dummy silicon wafer or a functional ASIC.
摘要翻译： 提供了包覆成型的压力传感器封装。 压力传感器模具（Pcell）被封盖，使得Pcell具有增强的刚度以承受由模制密封剂产生的应力效应。 Pcell帽包括一个远离Pcell隔膜的孔，使得Pcell能够承受外部气体压力，同时将水分从隔膜引导出来。 凝胶不需要使用，相反，如果需要，可以在Pcell上沉积软膜以保护Pcell隔膜免受过多的水分。 Pcell帽可以采取例如虚拟硅晶片或功能ASIC的形式。
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8.发明申请公开(公告)号：US20090142090A1
公开(公告)日：2009-06-04
申请号：US11947862
申请日：2007-11-30
IPC分类号： G03G15/00
CPC分类号： G03G21/02 , G03G15/0194 , G03G2215/00721
摘要： The present application is directed to methods of operating a multi-color image forming device in a mono-color mode. The methods may include performing three basic loops during the printing in the mono-color mode. A first loop may include printing mono-color pages up to an initial preset maximum. The preset maximum may prevent a wear mark from forming on the non-operational PC members due to rubbing against the moving ITM. A second loop may occur when the mono-color pages exceeds the initial preset maximum. The second loop may include rotating the non-operational imaging stations to prevent wear. A third loop may occur when the number of mono-color images exceeds an overall maximum number. The third loop may include resetting the non-operational image forming stations to allow for continuing printing in the mono-color mode.
摘要翻译： 本申请涉及以单色模式操作多色图像形成装置的方法。 所述方法可以包括在单色模式下在打印期间执行三个基本循环。 第一循环可以包括打印单色页面，直到初始预设最大值。 预设的最大值可以防止由于摩擦移动的ITM而在非操作的PC构件上形成磨损痕迹。 当单色页面超过初始预设最大值时，可能会发生第二个循环。 第二回路可以包括旋转非操作成像站以防磨损。 当单色图像的数量超过总体最大数量时，可能会发生第三个循环。 第三循环可以包括复位非操作图像形成站以允许以单色模式继续打印。
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公开(公告)号：US06969922B2
公开(公告)日：2005-11-29
申请号：US11065759
申请日：2005-02-25
申请人： Richard Shaun Welches , Daniel P. Hohm , Jian Wen
发明人： Richard Shaun Welches , Daniel P. Hohm , Jian Wen
CPC分类号： H02P9/48 , H02J3/01 , H02J3/1864 , H02J3/30 , H02J9/062 , H02M5/458 , H02P2101/45 , Y02E40/40 , Y02E60/16
摘要： The invention in one embodiment is an improved variable speed engine/generator set with an integrated power conditioning system and control method including load shedding to generate high quality AC power with improved fuel efficiency and reduced emissions. The variable speed generator control scheme allows for load adaptive speed control of engine and generator field. The transformerless power inverter topology and control method provides the necessary output frequency, voltage and/or current waveform regulation, harmonic distortion rejection, and provides for single phase, or unbalanced loading.
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公开(公告)号：US06879053B1
公开(公告)日：2005-04-12
申请号：US10691030
申请日：2003-10-22
申请人： Richard Shaun Welches , Daniel P. Hohm , Jian Wen , Kevin E LeRow , Richard Griessel , Thomas O'Reilly
发明人： Richard Shaun Welches , Daniel P. Hohm , Jian Wen , Kevin E LeRow , Richard Griessel , Thomas O'Reilly
CPC分类号： H02P9/48 , H02J3/01 , H02J3/1864 , H02J3/30 , H02J9/062 , H02M5/458 , H02P2101/45 , Y02E40/40 , Y02E60/16
摘要： The invention in the simplest form is an improved variable speed engine/generator set with an integrated power conditioning system and control method, used to generate high quality AC power with optimum fuel efficiency and reduced emissions. The variable speed generator control scheme allows for load adaptive speed control of engine and generator field. The transformerless power inverter topology and control method provides the necessary output frequency, voltage and/or current waveform regulation, harmonic distortion rejection, and provides for single phase, or unbalanced loading.
摘要翻译： 本发明最简单的形式是具有综合功率调节系统和控制方法的改进型变速发动机/发电机组，用于产生具有最佳燃料效率和减少排放的高品质交流电力。 变速发电机控制方案允许发动机和发电机领域的负载自适应速度控制。 无变压器功率逆变器拓扑和控制方法提供必要的输出频率，电压和/或电流波形调节，谐波失真抑制，并提供单相或不平衡负载。
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