公开(公告)号：US20150304579A1

公开(公告)日：2015-10-22

申请号：US14714411

申请日：2015-05-18

Applicant: Kabushiki Kaisha Toshiba

Inventor： Hiroto HONDA ,  Kazuhiro SUZUKI ,  Mitsuyoshi KOBAYASHI ,  Risako UENO ,  Honam KWON ,  Hideyuki FUNAKI

IPC: H04N5/374 ,  H04N5/347 ,  H04N5/225 ,  H04N5/3745 ,  G02B3/00 ,  G02B13/00

CPC classification number: H04N5/374 ,  G02B3/0056 ,  G02B13/0085 ,  H01L27/14605 ,  H01L27/14625 ,  H01L27/14627 ,  H04N5/2254 ,  H04N5/2258 ,  H04N5/347 ,  H04N5/3745

Abstract: A solid-state imaging device according to an embodiment includes: an imaging element including an imaging area formed with a plurality of pixel blocks each including pixels; a first optical system forming an image of an object on an imaging surface; and a second optical system re-forming the image, which has been formed on the imaging surface, on the pixel blocks corresponding to microlenses, the second optical system including a microlens array formed with the microlenses provided in accordance with the pixel blocks. The microlenses are arranged in such a manner that an angle θ between a straight line connecting center points of adjacent microlenses and one of a row direction and a column direction in which the pixels are aligned is expressed as follows: θ>sin−1(2dp/Dml), where Dml represents microlens pitch, and dp represents pixel pitch.

Abstract translation: 根据实施例的固态成像装置包括：成像元件，包括形成有包括像素的多个像素块的成像区域; 第一光学系统，其在成像表面上形成物体的图像; 以及第二光学系统，其已经形成在成像表面上的图像对应于微透镜的像素块，第二光学系统包括由根据像素块设置的微透镜形成的微透镜阵列。 微透镜以角度和角度的方式排列; 在连接相邻微透镜的中心点的直线与像素排列的行方向和列方向之间的直线表示如下：＆eta; sin-1（2dp / Dml）其中Dml表示微透镜间距，以及 dp表示像素间距。

公开(公告)号：US20140240559A1

公开(公告)日：2014-08-28

申请号：US14162122

申请日：2014-01-23

Applicant: Kabushiki Kaisha Toshiba

Inventor： Risako UENO ,  Hiroto HONDA ,  Mitsuyoshi KOBAYASHI ,  Kazuhiro SUZUKI ,  Honam KWON ,  Hideyuki FUNAKI

IPC: H04N5/335

CPC classification number: H04N5/335 ,  G02B3/0056 ,  G02B13/001 ,  G02B27/4205 ,  H04N5/2254 ,  H04N5/2257 ,  H04N13/271

Abstract: A solid state imaging device according to an embodiment includes: an imaging element formed on a semiconductor substrate, and including pixel blocks each having pixels; a main lens forming an image of a subject on an imaging plane; a microlens array including microlenses corresponding to the pixel blocks, the microlens array reducing an image to be formed on the imaging plane by Nf times or less and forming reduced images on the pixel blocks corresponding to the respective microlenses; and an image processing unit enlarging and synthesizing the reduced images formed by the microlenses, the solid state imaging device meeting conditions of an expression MTFMain(u)≦MTFML(u)≦MTFMain(u×Nf) where u denotes an image spatial frequency, MTFML(u) denotes an MTF function of the microlenses, and MTFMain(u) denotes an MTF function of the main lens.

Abstract translation: 根据实施例的固态成像装置包括：成像元件，形成在半导体衬底上，并且包括每个具有像素的像素块; 在成像平面上形成被摄体的图像的主透镜; 微透镜阵列，其包括对应于所述像素块的微透镜，所述微透镜阵列将要在所述成像平面上形成的图像减少N倍以下，并且在对应于所述各个微透镜的像素块上形成缩小图像; 以及图像处理单元，放大和合成由微透镜形成的缩小图像，所述固态成像装置满足表达式MTFMain（u）＆nlE; MTFML（u）＆nlE; MTFMain（u×Nf）的条件，其中u表示图像空间 频率，MTFML（u）表示微透镜的MTF函数，MTFMain（u）表示主透镜的MTF函数。

公开(公告)号：US20170263793A1

公开(公告)日：2017-09-14

申请号：US15385139

申请日：2016-12-20

Applicant: KABUSHIKI KAISHA TOSHIBA

Inventor： Risako UENO ,  Kazuhiro SUZUKI ,  Hiroto HONDA ,  Koichi ISHll ,  Hideyuki FUNAKI

IPC: H01L31/0232 ,  H01L31/028 ,  H01L31/0216 ,  G01S17/10 ,  H01L31/0224 ,  H01L31/02 ,  G01S7/481 ,  G01S7/486 ,  H01L27/144 ,  H01L31/107

CPC classification number: H01L31/02327 ,  G01S7/4816 ,  G01S7/4818 ,  G01S7/4861 ,  G01S7/4865 ,  G01S17/10 ,  G02B6/12004 ,  G02B6/4207 ,  G02B6/4214 ,  G02B2006/12123 ,  G02B2006/12195 ,  H01L27/1446 ,  H01L31/02005 ,  H01L31/02027 ,  H01L31/02161 ,  H01L31/022408 ,  H01L31/028 ,  H01L31/107

Abstract: A photodetector according to an embodiment includes: a semiconductor substrate including a first region and a second region adjacent to the first region; at least one light detection cell including a first semiconductor layer disposed in the first region, a second semiconductor layer disposed between the first semiconductor layer and the semiconductor substrate and including a junction portion with the first semiconductor layer, a third semiconductor layer disposed in the semiconductor substrate separately from the second semiconductor layer, a first electrode on the semiconductor substrate and applying a voltage to the first semiconductor layer, and a second electrode on the semiconductor substrate and applying a voltage to the third semiconductor layer; and a light guide disposed in the second region and guiding incident light to be propagated in a first direction to the junction portion between the first semiconductor layer and the second semiconductor layer.

公开(公告)号：US20150241282A1

公开(公告)日：2015-08-27

申请号：US14693661

申请日：2015-04-22

Applicant: KABUSHIKI KAISHA TOSHIBA

Inventor： Hiroto HONDA ,  Kazuhiro SUZUKI ,  Hideyuki FUNAKI ,  Masaki ATSUTA ,  Keita SASAKI ,  Koichi ISHII ,  Honam KWON

IPC: G01J5/06 ,  G01J5/12 ,  G01J5/02 ,  H04N5/33 ,  G01J5/22

CPC classification number: G01J5/12 ,  G01J5/023 ,  G01J5/20 ,  G01J5/22 ,  G01J2005/0077 ,  H01L27/14649 ,  H04N5/33

Abstract: An imaging device according to an embodiment includes: a semiconductor substrate; a reference pixel with a first concave portion disposed in a first portion of a surface of the semiconductor substrate; and one or more infrared detection pixels each configured to detect light with a second concave portion disposed in a second portion of the surface of the semiconductor substrate, the reference pixel being directly connected to the semiconductor substrate at a position where the first concave portion is not present, and including a first thermoelectric conversion unit configured to convert heat to an electric signal, the first thermoelectric conversion unit being disposed in the first concave portion and including a first thermoelectric conversion element, each infrared detection pixel including a second thermoelectric conversion unit being disposed in the second concave portion and including a second thermoelectric conversion element.

Abstract translation: 根据实施例的成像装置包括：半导体衬底; 参考像素，其具有设置在所述半导体衬底的表面的第一部分中的第一凹部; 以及一个或多个红外检测像素，每个红外检测像素被配置为利用设置在所述半导体衬底的表面的第二部分中的第二凹部来检测光，所述参考像素在所述第一凹部不在所述位置处直接连接到所述半导体衬底 存在并且包括被配置为将热量转换为电信号的第一热电转换单元，第一热电转换单元设置在第一凹部中并且包括第一热电转换元件，每个红外检测像素包括第二热电转换单元， 在第二凹部中并且包括第二热电转换元件。

公开(公告)号：US20150077622A1

公开(公告)日：2015-03-19

申请号：US14460862

申请日：2014-08-15

Applicant: Kabushiki Kaisha Toshiba

Inventor： Risako UENO ,  Hiroto HONDA ,  Mitsuyoshi KOBAYASHI ,  Kazuhiro SUZUKI ,  Honam KWON ,  Hideyuki FUNAKI

IPC: G02B3/00 ,  G02B13/00 ,  H04N5/225 ,  G02B13/18

CPC classification number: G02B3/0056 ,  G02B5/005 ,  G02B9/34 ,  G02B13/001 ,  G02B13/0015 ,  G02B13/004 ,  G02B13/0055 ,  G02B13/16 ,  G02B13/18 ,  G03B9/02 ,  H04N5/2251 ,  H04N5/2254

Abstract: According to one embodiment, an imaging lens includes a first optical system and a microlens array. The first optical system includes an optical axis. The microlens array is provided between the first optical system and an imaging element. The microlens array includes microlens units provided in a first plane. The imaging element includes pixel groups. Each of the pixel groups includes pixels. The microlens units respectively overlap the pixel groups when projected onto the first plane. The first optical system includes an aperture stop, a first lens, a second lens, a third lens, and a fourth lens. The first lens is provided between the aperture stop and the microlens array. The second lens is provided between the first lens and the microlens array. The third lens is provided between the second lens and the microlens array. The fourth lens is provided between the third lens and the microlens array.

Abstract translation: 根据一个实施例，成像透镜包括第一光学系统和微透镜阵列。 第一光学系统包括光轴。 微透镜阵列设置在第一光学系统和成像元件之间。 微透镜阵列包括设置在第一平面中的微透镜单元。 成像元件包括像素组。 每个像素组包括像素。 当投影到第一平面上时，微透镜单元分别与像素组重叠。 第一光学系统包括孔径光阑，第一透镜，第二透镜，第三透镜​​和第四透镜。 第一透镜设置在孔径光阑和微透镜阵列之间。 第二透镜设置在第一透镜和微透镜阵列之间。 第三透镜设置在第二透镜和微透镜阵列之间。 第四透镜设置在第三透镜和微透镜阵列之间。

公开(公告)号：US20150077585A1

公开(公告)日：2015-03-19

申请号：US14481999

申请日：2014-09-10

Applicant: Kabushiki Kaisha Toshiba

Inventor： Mitsuyoshi KOBAYASHI ,  Risako UENO ,  Kazuhiro SUZUKI ,  Hiroto HONDA ,  Honam KWON ,  Hideyuki FUNAKI

IPC: G02B3/00 ,  H04N5/232 ,  H04N5/369

CPC classification number: H04N5/23212 ,  G02B3/0037 ,  H04N5/2257

Abstract: According to an embodiment, a microlens array for a solid-state image sensing device includes a plurality of microlenses and a state detector. The plurality of microlenses are disposed in an imaging microlens area and is configured to form two-dimensional images. The state detector is disposed on a periphery of the imaging microlens area and is configured to, on an image forming surface of the microlenses, generate images having a smaller diameter than images formed by the microlenses.

Abstract translation: 根据实施例，用于固态图像感测装置的微透镜阵列包括多个微透镜和状态检测器。 多个微透镜设置在成像微透镜区域中并且被配置为形成二维图像。 状态检测器设置在成像微透镜区域的周边上，并且被配置为在微透镜的图像形成表面上产生具有比由微透镜形成的图像更小的直径的图像。

公开(公告)号：US20140285671A1

公开(公告)日：2014-09-25

申请号：US14204361

申请日：2014-03-11

Applicant: KABUSHIKI KAISHA TOSHIBA

Inventor： Koichi ISHII ,  Hideyuki FUNAKI ,  Ikuo FUJIWARA ,  Hiroto HONDA

IPC: H04N5/33

CPC classification number: H04N5/33 ,  H01L27/14618 ,  H01L27/14623 ,  H01L27/14625 ,  H01L27/14649 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L2924/00014

Abstract: An infrared imaging module according to an embodiment includes: an infrared imaging element including a semiconductor substrate having a recessed portion, and a pixel portion formed on the recessed portion, the pixel portion converting infrared rays to electrical signals; and a lid including a lens portion facing the pixel portion, and a flat plate portion surrounding the lens portion, the flat plate portion being bonded to the semiconductor substrate.

Abstract translation: 根据实施例的红外成像模块包括：红外成像元件，包括具有凹部的半导体基板和形成在凹部上的像素部分，像素部分将红外线转换为电信号; 以及包括与像素部分相对的透镜部分的盖子和围绕透镜部分的平板部分，平板部分粘合到半导体基板。

公开(公告)号：US20150077618A1

公开(公告)日：2015-03-19

申请号：US14460780

申请日：2014-08-15

Applicant: Kabushiki Kaisha Toshiba

Inventor： Risako UENO ,  Hiroto HONDA ,  Mitsuyoshi KOBAYASHI ,  Kazuhiro SUZUKI ,  Honam KWON ,  Hideyuki FUNAKI

IPC: H01L27/146 ,  H04N5/225 ,  G02B3/00

CPC classification number: H01L27/14627 ,  G02B3/0056 ,  G02B13/0035 ,  G02B15/173 ,  H04N5/2254 ,  H04N5/2257

Abstract: According to one embodiment, an imaging lens includes a first optical system and a microlens array. The first optical system includes an optical axis. The microlens array is provided between the first optical system and an imaging element. The microlens array includes microlens units provided in a first plane. The imaging element includes pixel groups. Each of the pixel groups includes pixels. The microlens units respectively overlap the pixel groups when projected onto the first plane. The first optical system includes an aperture stop, and first, second, and third lenses. The first lens is provided between the aperture stop and the microlens array, and has a positive refractive power. The second lens is provided between the first lens and the microlens array, and has a negative refractive power. The third lens is provided between the second lens and the microlens array, and has a positive refractive power.

Abstract translation: 根据一个实施例，成像透镜包括第一光学系统和微透镜阵列。 第一光学系统包括光轴。 微透镜阵列设置在第一光学系统和成像元件之间。 微透镜阵列包括设置在第一平面内的微透镜单元。 成像元件包括像素组。 每个像素组包括像素。 当投影到第一平面上时，微透镜单元分别与像素组重叠。 第一光学系统包括孔径光阑和第一，第二和第三透镜。 第一透镜设置在孔径光阑和微透镜阵列之间，并且具有正的屈光力。 第二透镜设置在第一透镜和微透镜阵列之间，并具有负折光力。 第三透镜设置在第二透镜和微透镜阵列之间，并且具有正的折射光焦度。

公开(公告)号：US20140285708A1

公开(公告)日：2014-09-25

申请号：US14197780

申请日：2014-03-05

Applicant: KABUSHIKI KAISHA TOSHIBA

Inventor： Honam KWON ,  Kazuhiro SUZUKI ,  Hiroto HONDA ,  Risako UENO ,  Mitsuyoshi KOBAYASHI ,  Yuko KIZU ,  Machiko ITO ,  Hideyuki FUNAKI

IPC: H04N5/225 ,  G02F1/1335

CPC classification number: H04N5/2254 ,  G02F1/134309 ,  G02F1/29 ,  G02F2001/294 ,  H01L27/14625 ,  H04N13/218 ,  H04N13/289

Abstract: A solid state imaging device according to an embodiment includes: a liquid crystal optical element including a first electrode having a first recess and a projecting portion surrounding the first recess on a first surface, a second electrode facing the first surface of the first electrode, a filling film located between the first recess of the first electrode and the second electrode, and a liquid crystal layer located between the filling film and the second electrode; an imaging lens facing the second electrode to form an image of a subject on an imaging plane; and an imaging element facing the first recess, the imaging element having a pixel block having a plurality of pixels.

Abstract translation: 根据实施例的固态成像装置包括：液晶光学元件，包括具有第一凹部的第一电极和围绕第一表面的第一凹部的突出部分，面对第一电极的第一表面的第二电极， 位于第一电极的第一凹部和第二电极之间的填充膜和位于填充膜和第二电极之间的液晶层; 成像透镜，面对第二电极以在成像平面上形成被摄体的图像; 以及面向所述第一凹部的成像元件，所述成像元件具有具有多个像素的像素块。

公开(公告)号：US20140285693A1

公开(公告)日：2014-09-25

申请号：US14165925

申请日：2014-01-28

Applicant: Kabushiki Kaisha Toshiba

Inventor： Mitsuyoshi KOBAYASHI ,  Risako UENO ,  Kazuhiro SUZUKI ,  Hiroto HONDA ,  Honam KWON ,  Hideyuki FUNAKI

IPC: H04N5/335 ,  G02B3/00

CPC classification number: H04N5/335 ,  G02B3/0043 ,  G02B3/0062 ,  G02B3/0068 ,  G02B13/0085 ,  H04N5/2254 ,  H04N5/232 ,  H04N5/23274

Abstract: A microlens array unit according to an embodiment includes: a substrate; a first group of microlenses including first microlenses having a convex shape and a first focal length, the first group of microlenses being arranged on the substrate; and a second group of microlenses including second microlenses having a convex shape and a second focal length different from the first focal length, the second group of microlenses being arranged on the substrate, a first imaging plane of the first group of microlenses and a second imaging plane of the second group of microlenses being parallel to each other, a distance between the first and second imaging planes in a direction perpendicular to the first imaging plane being 20% or less of the first focal length, and images of the first microlenses projected on the substrate not overlapping images of the second microlenses projected on the substrate.

Abstract translation: 根据实施例的微透镜阵列单元包括：衬底; 第一组微透镜，包括具有凸形形状和第一焦距的第一微透镜，所述第一组微透镜布置在所述衬底上; 以及第二组微透镜，包括具有凸形状和不同于第一焦距的第二焦距的第二微透镜，第二组微透镜布置在衬底上，第一组微透镜组的第一成像平面和第二成像 所述第二组微透镜的平面彼此平行，所述第一和第二成像平面之间在与所述第一成像面垂直的方向上的距离为所述第一焦距的20％或更小，并且所述第一微透镜的图像投射在 基板不重叠投影在基板上的第二微透镜的图像。