公开(公告)号：US20160077148A1

公开(公告)日：2016-03-17

申请号：US14846143

申请日：2015-09-04

Applicant: KABUSHIKI KAISHA TOSHIBA

Inventor： Shunsuke KIMURA ,  Hideyuki FUNAKI

IPC: G01R31/26 ,  G01T1/20

CPC classification number: G01R31/2635 ,  G01T1/171 ,  G01T1/20

Abstract: According to an embodiment, a signal processing device includes a first integrator, a second integrator, a switcher, and a calculator. The first integrator is configured to integrate a current represented by a reference waveform equivalent to a normal waveform in a case of no pileup phenomenon regarding the current to calculate a first electrical charge. The second integrator is configured to integrate a current output from a photoelectric converter to calculate a second electrical charge. The switcher is configured to, when a pileup phenomenon has occurred, perform switching either to a state in which the first and second electrical charges are output or to a state in which the first electrical charge and a reference charge are output. The calculator is configured to calculate a first difference charge between the first and second electrical charges, and calculate a second difference charge between the first electrical charge and the reference charge.

Abstract translation: 根据实施例，信号处理装置包括第一积分器，第二积分器，切换器和计算器。 在没有关于电流的堆积现象的情况下，第一积分器被配置为集成由与正常波形相当的参考波形表示的电流，以计算第一电荷。 第二积分器被配置为集成来自光电转换器的电流输出以计算第二电荷。 切换器被配置为当发生堆积现象时，执行切换到其中输出第一和第二电荷的状态或者输出第一电荷和参考电荷的状态。 计算器被配置为计算第一和第二电荷之间的第一差分电荷，并且计算第一电荷和参考电荷之间的第二差分电荷。

公开(公告)号：US20150270314A1

公开(公告)日：2015-09-24

申请号：US14555889

申请日：2014-11-28

Applicant: Kabushiki Kaisha Toshiba

Inventor： Takashi MIYAZAKI ,  Ikuo FUJIWARA ,  Hideyuki FUNAKI

IPC: H01L27/30 ,  H01L31/0376 ,  H01L27/146

CPC classification number: H01L27/307 ,  H01L27/14621 ,  H01L27/14629 ,  H01L27/14632 ,  H01L27/14647 ,  H01L31/03762

Abstract: According to one embodiment, a solid-state imaging device includes: a first inorganic photoelectric converter; a semiconductor substrate that includes a light-receiving face to which light is to be incident and a circuit-formed surface on which a circuit including a readout circuit is formed, the light-receiving face facing the first inorganic photoelectric converter, the semiconductor substrate including a second inorganic photoelectric converter thereinside; and a first part including a microstructure arranged between the first inorganic photoelectric converter and the second inorganic photoelectric converter.

Abstract translation: 根据一个实施例，固态成像装置包括：第一无机光电转换器; 包括光入射的受光面和形成有包括读出电路的电路的电路形成面的半导体基板，所述受光面朝向所述第一无机光电转换元件，所述半导体基板包括 第二无机光电转换器; 以及包括布置在第一无机光电转换器和第二无机光电转换器之间的微结构的第一部分。

公开(公告)号：US20150085985A1

公开(公告)日：2015-03-26

申请号：US14482096

申请日：2014-09-10

Applicant: KABUSHIKI KAISHA TOSHIBA

Inventor： Hideyuki FUNAKI ,  Shunsuke KIMURA ,  Go KAWATA ,  Tetsuro ITAKURA ,  Masanori FURUTA

IPC: H04N5/32 ,  H04N5/378

CPC classification number: H04N5/32 ,  H03M1/145 ,  H03M1/46 ,  H03M1/60 ,  H04N5/378

Abstract: According to an embodiment, a signal processing device includes an integrator, a first analog-to-digital converter, and a histogram creator. The integrator is configured to integrate an electrical charge corresponding to electromagnetic waves. The first analog-to-digital converter is configured to perform an analog-to-digital conversion operation that generates digital data of the electrical charge using an integration output from the integrator, on a parallel with an integration operation performed by the integrator. The histogram creator is configured to create a histogram that represents an energy distribution of the electromagnetic waves, from the digital data generated by the first analog-to-digital converter.

Abstract translation: 根据实施例，信号处理装置包括积分器，第一模数转换器和直方图创建器。 积分器被配置为集成对应于电磁波的电荷。 第一模数转换器被配置为执行使用来自积分器的积分输出的积分器的积分运算并行地进行电荷的数字数据的模数转换动作。 直方图创建器被配置为从由第一模数转换器产生的数字数据创建表示电磁波的能量分布的直方图。

公开(公告)号：US20150077618A1

公开(公告)日：2015-03-19

申请号：US14460780

申请日：2014-08-15

Applicant: Kabushiki Kaisha Toshiba

Inventor： Risako UENO ,  Hiroto HONDA ,  Mitsuyoshi KOBAYASHI ,  Kazuhiro SUZUKI ,  Honam KWON ,  Hideyuki FUNAKI

IPC: H01L27/146 ,  H04N5/225 ,  G02B3/00

CPC classification number: H01L27/14627 ,  G02B3/0056 ,  G02B13/0035 ,  G02B15/173 ,  H04N5/2254 ,  H04N5/2257

Abstract: According to one embodiment, an imaging lens includes a first optical system and a microlens array. The first optical system includes an optical axis. The microlens array is provided between the first optical system and an imaging element. The microlens array includes microlens units provided in a first plane. The imaging element includes pixel groups. Each of the pixel groups includes pixels. The microlens units respectively overlap the pixel groups when projected onto the first plane. The first optical system includes an aperture stop, and first, second, and third lenses. The first lens is provided between the aperture stop and the microlens array, and has a positive refractive power. The second lens is provided between the first lens and the microlens array, and has a negative refractive power. The third lens is provided between the second lens and the microlens array, and has a positive refractive power.

Abstract translation: 根据一个实施例，成像透镜包括第一光学系统和微透镜阵列。 第一光学系统包括光轴。 微透镜阵列设置在第一光学系统和成像元件之间。 微透镜阵列包括设置在第一平面内的微透镜单元。 成像元件包括像素组。 每个像素组包括像素。 当投影到第一平面上时，微透镜单元分别与像素组重叠。 第一光学系统包括孔径光阑和第一，第二和第三透镜。 第一透镜设置在孔径光阑和微透镜阵列之间，并且具有正的屈光力。 第二透镜设置在第一透镜和微透镜阵列之间，并具有负折光力。 第三透镜设置在第二透镜和微透镜阵列之间，并且具有正的折射光焦度。

公开(公告)号：US20170005667A1

公开(公告)日：2017-01-05

申请号：US15138667

申请日：2016-04-26

Applicant: Kabushiki Kaisha Toshiba

Inventor： Hirokatsu SHIRAHAMA ,  Shunsuke KIMURA ,  Tetsuro ITAKURA ,  Masanori FURUTA ,  Hideyuki FUNAKI ,  Go KAWATA

IPC: H03M1/34 ,  G01T1/20

CPC classification number: G01T1/20 ,  H03M1/52

Abstract: An integrator according to an embodiment includes first and second nodes, first to fifth switches, first and second main integration capacitors, and a first subsidiary integration capacitor. The first (second, third, fourth, fifth) switch has one end connected to a first (third, first, fourth, first) node and the other end connected to a third (second, fourth, second, fifth) node. The first main integration capacitor has one end connected to the third node and the other end connected to a standard voltage line. The second main integration capacitor has one end connected to the fourth node and the other end connected to the standard voltage line. The first subsidiary integration capacitor that has one end connected to the fifth node and the other end connected to the standard voltage line.

Abstract translation: 根据实施例的积分器包括第一和第二节点，第一至第五开关，第一和第二主积分电容器以及第一辅助积分电容器。 第一（第二，第三，第四，第五）开关的一端连接到第一（第三，第一，第四，第一）节点，另一端连接到第三（第二，第四，第二，第五）节点。 第一主集成电容器的一端连接到第三节点，另一端连接到标准电压线。 第二主积分电容器的一端连接到第四节点，另一端连接到标准电压线。 第一个辅助集成电容器，其一端连接到第五个节点，另一端连接到标准电压线。

公开(公告)号：US20160254309A1

公开(公告)日：2016-09-01

申请号：US14843499

申请日：2015-09-02

Applicant: KABUSHIKI KAISHA TOSHIBA

Inventor： Risako UENO ,  Koichi ISHll ,  Kazuhiro SUZUKI ,  Hideyuki FUNAKI

IPC: H01L27/146

CPC classification number: H01L27/14649 ,  H01L27/14621 ,  H01L27/14625 ,  H01L27/14627

Abstract: An imaging device includes a light source which irradiates an infrared light including one or more wavelength to a subject; a lens which forms an image of the infrared light transmitting the subject or being reflected from the subject; an infrared detection device including a plurality of pixels which are sensitive to the wavelength; and a filter array which is provided in proximity to the infrared detection device between the lens and the infrared detection device and including a plurality of wavelength filters having different transmission wavelengths.

Abstract translation: 成像装置包括将包含一个或多个波长的红外光照射到被摄体的光源; 透镜，其形成透射被摄体或被摄体反射的红外光的图像; 包括对波长敏感的多个像素的红外线检测装置; 以及滤波器阵列，其设置在所述透镜和所述红外线检测装置之间的红外线检测装置附近，并且包括具有不同透射波长的多个波长滤光器。

公开(公告)号：US20160211830A1

公开(公告)日：2016-07-21

申请号：US15000479

申请日：2016-01-19

Applicant: KABUSHIKI KAISHA TOSHIBA

Inventor： Tetsuro ITAKURA ,  Masanori FURUTA ,  Shunsuke KIMURA ,  Hideyuki FUNAKI ,  Go KAWATA ,  Hirokatsu SHIRAHAMA

IPC: H03H11/12 ,  G01T1/20 ,  G01T1/208

CPC classification number: H03H11/1213 ,  G01T1/2018 ,  G01T1/208

Abstract: A waveform shaping filter according to one embodiment includes a first resistor, a first transistor, a first capacitor, and a first amplifier. The first resistor includes one end to which a signal current is input and the other end. The first transistor includes a first terminal connected to the other end of the first resistor, a second terminal, and a control terminal. The first capacitor includes one end connected to the other end of the first resistor and the other end. The first amplifier includes an input terminal connected to the one end of the first resistor and an output terminal connected to the control terminal of the first transistor.

Abstract translation: 根据一个实施例的波形整形滤波器包括第一电阻器，第一晶体管，第一电容器和第一放大器。 第一电阻器包括输入信号电流的一端和另一端。 第一晶体管包括连接到第一电阻器的另一端的第一端子，第二端子和控制端子。 第一电容器包括连接到第一电阻器另一端的另一端和另一端。 第一放大器包括连接到第一电阻器的一端的输入端子和连接到第一晶体管的控制端子的输出端子。

公开(公告)号：US20150324992A1

公开(公告)日：2015-11-12

申请号：US14726052

申请日：2015-05-29

Applicant: KABUSHIKI KAISHA TOSHIBA

Inventor： Risako UENO ,  Hideyuki FUNAKI ,  Mitsuyoshi KOBAYASHI

IPC: G06T7/00 ,  H04N5/232 ,  H04N9/04 ,  G02B3/00

CPC classification number: H04N9/045 ,  G02B3/0037 ,  H01L27/14627 ,  H04N5/23229 ,  H04N2209/042

Abstract: A solid-state imaging device according to an embodiment includes: an imaging element formed on a semiconductor substrate, and comprising an imaging region including a plurality of pixel blocks each including a plurality of pixels; a first optical system forming an image of an object on an imaging plane; and a second optical system comprising a microlens array including a plurality of microlenses each corresponding to one of the pixel blocks, and reducing and re-forming the image to be formed on the imaging plane on the pixel blocks corresponding to the respective microlenses. The imaging plane of the first optical system is located further away from the first optical system than the imaging element when the object is located at an infinite distance.

Abstract translation: 根据实施例的固态成像装置包括：成像元件，形成在半导体衬底上，并且包括：成像区域，包括多个像素块，每个像素块包括多个像素; 第一光学系统，其在成像平面上形成物体的图像; 以及第二光学系统，其包括微透镜阵列，所述微透镜阵列包括多个微透镜，每个微透镜各自对应于所述像素块之一，并且在对应于所述各个微透镜的像素块上减小并重新形成将在所述成像平面上形成的图像。 当物体位于无限距离时，第一光学系统的成像平面位于比成像元件更远离第一光学系统的位置。

公开(公告)号：US20150304579A1

公开(公告)日：2015-10-22

申请号：US14714411

申请日：2015-05-18

Applicant: Kabushiki Kaisha Toshiba

Inventor： Hiroto HONDA ,  Kazuhiro SUZUKI ,  Mitsuyoshi KOBAYASHI ,  Risako UENO ,  Honam KWON ,  Hideyuki FUNAKI

IPC: H04N5/374 ,  H04N5/347 ,  H04N5/225 ,  H04N5/3745 ,  G02B3/00 ,  G02B13/00

CPC classification number: H04N5/374 ,  G02B3/0056 ,  G02B13/0085 ,  H01L27/14605 ,  H01L27/14625 ,  H01L27/14627 ,  H04N5/2254 ,  H04N5/2258 ,  H04N5/347 ,  H04N5/3745

Abstract: A solid-state imaging device according to an embodiment includes: an imaging element including an imaging area formed with a plurality of pixel blocks each including pixels; a first optical system forming an image of an object on an imaging surface; and a second optical system re-forming the image, which has been formed on the imaging surface, on the pixel blocks corresponding to microlenses, the second optical system including a microlens array formed with the microlenses provided in accordance with the pixel blocks. The microlenses are arranged in such a manner that an angle θ between a straight line connecting center points of adjacent microlenses and one of a row direction and a column direction in which the pixels are aligned is expressed as follows: θ>sin−1(2dp/Dml), where Dml represents microlens pitch, and dp represents pixel pitch.

Abstract translation: 根据实施例的固态成像装置包括：成像元件，包括形成有包括像素的多个像素块的成像区域; 第一光学系统，其在成像表面上形成物体的图像; 以及第二光学系统，其已经形成在成像表面上的图像对应于微透镜的像素块，第二光学系统包括由根据像素块设置的微透镜形成的微透镜阵列。 微透镜以角度和角度的方式排列; 在连接相邻微透镜的中心点的直线与像素排列的行方向和列方向之间的直线表示如下：＆eta; sin-1（2dp / Dml）其中Dml表示微透镜间距，以及 dp表示像素间距。

公开(公告)号：US20150084802A1

公开(公告)日：2015-03-26

申请号：US14482102

申请日：2014-09-10

Applicant: KABUSHIKI KAISHA TOSHIBA

Inventor： Shunsuke KIMURA ,  Hideyuki FUNAKI ,  Go KAWATA ,  Tetsuro ITAKURA ,  Masanori FURUTA

IPC: H03M1/12

CPC classification number: H03M1/124 ,  G01T1/2928 ,  H04N5/355 ,  H04N5/37455 ,  H04N5/378

Abstract: According to an embodiment, a signal processing device includes an integrator, a setting unit, and an analog-to-digital converter. The integrator is configured to integrate an electrical charge corresponding to electromagnetic waves. The integrator includes a capacitor configured to store the electrical charge corresponding to the electromagnetic waves and a discharging circuit configured to discharge the capacitor. The setting unit is configured to set a period of integration of the electrical charge with respect to the integrator. The analog-to-digital converter includes a comparator configured to compare an integration output and a threshold value and a counter configured to output, as digital data of the electrical charge, the number of times for which a value of the integration output becomes not less than the threshold value. The converter is configured to discharge the capacitor during the period of integration by supplying a comparison output of the comparator to the discharging circuit.

Abstract translation: 根据实施例，信号处理装置包括积分器，设定单元和模数转换器。 积分器被配置为集成对应于电磁波的电荷。 积分器包括：电容器，被配置为存储对应于电磁波的电荷;以及放电电路，被配置为放电电容器。 设置单元被配置为设置电荷相对于积分器的积分周期。 模数转换器包括：比较器，用于比较积分输出和阈值;以及计数器，被配置为输出作为电荷的数字数据的积分输出的值不小于 超过阈值。 转换器被配置为在积分期间通过将比较器的比较输出提供给放电电路来对电容器进行放电。