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    LIGHT DETECTOR, LIGHT DETECTION SYSTEM, LIDAR DEVICE, AND MOBILE BODY
    1.
    发明申请
    LIGHT DETECTOR, LIGHT DETECTION SYSTEM, LIDAR DEVICE, AND MOBILE BODY 有权

    公开(公告)号：US20220352219A1

    公开(公告)日：2022-11-03

    申请号：US17680184

    申请日：2022-02-24

    Applicant: KABUSHIKI KAISHA TOSHIBA

    Inventor： Mariko SHIMIZU ,  Ikuo FUJIWARA ,  Keita SASAKI ,  Kazuaki OKAMOTO ,  Honam KWON ,  Kazuhiro SUZUKI

    IPC: H01L27/146 ,  G01S7/481

    Abstract: According to one embodiment, a light detector includes a plurality of elements, a plurality of separation parts, a fourth semiconductor region, a fifth semiconductor region, a first interconnect, a first quenching part, and a second interconnect. The elements are located in a cell region and arranged. Each of the elements includes first, second, and third semiconductor regions. The second semiconductor region is located on the first semiconductor region. The third semiconductor region is located on the second semiconductor region. The separation parts are located respectively around the elements. The fourth semiconductor region is located around each of the separation parts. The fifth semiconductor region is located on the fourth semiconductor region. The first interconnect is electrically connected to the third semiconductor regions. The first quenching part is electrically connected to the first interconnect. The second interconnect is electrically connected to the fifth semiconductor region.

    PHOTODETECTOR, OPTICAL DETECTION SYSTEM, LIDAR DEVICE, AND MOVABLE BODY
    2.
    发明申请
    PHOTODETECTOR, OPTICAL DETECTION SYSTEM, LIDAR DEVICE, AND MOVABLE BODY 有权

    公开(公告)号：US20210296381A1

    公开(公告)日：2021-09-23

    申请号：US17005498

    申请日：2020-08-28

    Applicant: KABUSHIKI KAISHA TOSHIBA

    Inventor： Masaki ATSUTA ,  Kazuhiro SUZUKI ,  Ikuo FUJIWARA ,  Honam KWON ,  Yuki NOBUSA

    IPC: H01L27/146 ,  G01S7/481

    Abstract: A photodetector includes a first semiconductor layer including a light detection region and a peripheral region on a first surface on which light is incident. The light detection region is a region in which light detecting units are arrayed. The peripheral region is a semiconductor region disposed on the periphery of the light detection region and not including a light detecting unit. A density of a lattice defect or a concentration of impurity in a first layer region that is at least a part in a thickness direction of the peripheral region is higher than a density of a lattice defect or a concentration of impurity in a second layer region adjacent to the first layer region in a direction intersecting the thickness direction in the light detection region.

    LIGHT DETECTOR, LIGHT DETECTION SYSTEM, LIDAR DEVICE, AND MOBILE BODY
    5.
    发明公开
    LIGHT DETECTOR, LIGHT DETECTION SYSTEM, LIDAR DEVICE, AND MOBILE BODY 审中-公开

    公开(公告)号：US20230299103A1

    公开(公告)日：2023-09-21

    申请号：US17822417

    申请日：2022-08-25

    Applicant: KABUSHIKI KAISHA TOSHIBA

    Inventor： Ryomo KANEKO ,  Mariko SHIMIZU ,  Keita SASAKI ,  Honam KWON ,  Ikuo FUJIWARA ,  Kazuhiro SUZUKI

    IPC: H01L27/146 ,  G01S17/89

    CPC classification number: H01L27/14623 ,  H01L27/1463 ,  G01S17/89 ,  H01L27/14649 ,  H01L27/14627

    Abstract: A light detector according to one embodiment, includes an element region, a light concentrator, a structure part and a light-shielding part. The element region includes a first semiconductor region of a first conductivity type, and a second semiconductor region of a second conductivity type. The light concentrator is separated from the element region in a first direction. The light concentrator is configured to concentrate light incident on the light concentrator. The structure part is arranged with the element region in a direction crossing the first direction. The structure part has a different refractive index from the element region. The light-shielding part is located between the element region and the light concentrator. The light-shielding part includes an opening. At least a portion of the light incident on the light concentrator is able to be incident on the element region by passing through the opening.

    LIGHT DETECTOR, LIGHT DETECTION SYSTEM, LIDAR DEVICE, AND VEHICLE
    6.
    发明申请
    LIGHT DETECTOR, LIGHT DETECTION SYSTEM, LIDAR DEVICE, AND VEHICLE 有权

    公开(公告)号：US20210293967A1

    公开(公告)日：2021-09-23

    申请号：US17015774

    申请日：2020-09-09

    Applicant: KABUSHIKI KAISHA TOSHIBA

    Inventor： Ikuo FUJIWARA ,  Honam KWON ,  Keita SASAKI ,  Kazuhiro SUZUKI ,  Masaki ATSUTA ,  Mariko SHIMIZU ,  Kazuaki OKAMOTO

    IPC: G01S17/931 ,  H01L31/107 ,  G01S17/89 ,  G01S7/481

    Abstract: According to one embodiment, a light detector includes an element, and a structure body. The element includes a first semiconductor region, a second semiconductor region, and a third semiconductor region. The second semiconductor region is provided on the first semiconductor region. The third semiconductor region is provided on the second semiconductor region. The structure body is provided around the element. The structure body includes first and second insulating portions and a metal-including portion. The metal-including portion is provided above the first insulating portion. A position in the first direction of a portion of the metal-including portion is same as a position in the first direction of the third semiconductor region. The second insulating portion is positioned between the metal-including portion and the element in the first plane. A thickness of the first insulating portion is greater than a thickness of the second insulating portion in the first plane.

    INFRARED IMAGING DEVICE AND INFRARED IMAGING MODULE
    8.
    发明申请
    INFRARED IMAGING DEVICE AND INFRARED IMAGING MODULE 审中-公开
    红外成像装置和红外成像模块

    公开(公告)号：US20140285671A1

    公开(公告)日：2014-09-25

    申请号：US14204361

    申请日：2014-03-11

    Applicant: KABUSHIKI KAISHA TOSHIBA

    Inventor： Koichi ISHII ,  Hideyuki FUNAKI ,  Ikuo FUJIWARA ,  Hiroto HONDA

    IPC: H04N5/33

    CPC classification number: H04N5/33 ,  H01L27/14618 ,  H01L27/14623 ,  H01L27/14625 ,  H01L27/14649 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L2924/00014

    Abstract: An infrared imaging module according to an embodiment includes: an infrared imaging element including a semiconductor substrate having a recessed portion, and a pixel portion formed on the recessed portion, the pixel portion converting infrared rays to electrical signals; and a lid including a lens portion facing the pixel portion, and a flat plate portion surrounding the lens portion, the flat plate portion being bonded to the semiconductor substrate.

    Abstract translation: 根据实施例的红外成像模块包括：红外成像元件，包括具有凹部的半导体基板和形成在凹部上的像素部分，像素部分将红外线转换为电信号; 以及包括与像素部分相对的透镜部分的盖子和围绕透镜部分的平板部分，平板部分粘合到半导体基板。

    LIGHT DETECTOR, LIGHT DETECTION SYSTEM, LIDAR DEVICE, AND VEHICLE
    9.
    发明申请
    LIGHT DETECTOR, LIGHT DETECTION SYSTEM, LIDAR DEVICE, AND VEHICLE 有权

    公开(公告)号：US20210293937A1

    公开(公告)日：2021-09-23

    申请号：US17015325

    申请日：2020-09-09

    Applicant: KABUSHIKI KAISHA TOSHIBA

    Inventor： Ikuo FUJIWARA ,  Honam KWON ,  Keita SASAKI ,  Kazuhiro SUZUKI ,  Masaki ATSUTA ,  Mariko SHIMIZU ,  Kazuaki OKAMOTO

    IPC: G01S7/4863 ,  G01S17/931 ,  H01L31/02 ,  H01L25/04

    Abstract: According to one embodiment, a light detector includes a first semiconductor region of a first conductivity type, a first element, a second element, an insulating body, a first interconnect, and a second interconnect. The second semiconductor region of the first element is provided on the first semiconductor region. The third semiconductor region of the first element is provided on the second semiconductor region. The fourth semiconductor region of the second element is provided on the first semiconductor region, and has an impurity concentration of a first conductivity type less than in the second semiconductor region. The fifth semiconductor region of the second element is provided on the fourth semiconductor region. The insulating body is provided between the first element and the second element. The first interconnect is electrically connected to the third semiconductor region. The second interconnect is electrically connected to the fifth semiconductor region.

    SOLID-STATE IMAGING DEVICE
    10.
    发明申请
    SOLID-STATE IMAGING DEVICE 有权
    固态成像装置

    公开(公告)号：US20150270314A1

    公开(公告)日：2015-09-24

    申请号：US14555889

    申请日：2014-11-28

    Applicant: Kabushiki Kaisha Toshiba

    Inventor： Takashi MIYAZAKI ,  Ikuo FUJIWARA ,  Hideyuki FUNAKI

    IPC: H01L27/30 ,  H01L31/0376 ,  H01L27/146

    CPC classification number: H01L27/307 ,  H01L27/14621 ,  H01L27/14629 ,  H01L27/14632 ,  H01L27/14647 ,  H01L31/03762

    Abstract: According to one embodiment, a solid-state imaging device includes: a first inorganic photoelectric converter; a semiconductor substrate that includes a light-receiving face to which light is to be incident and a circuit-formed surface on which a circuit including a readout circuit is formed, the light-receiving face facing the first inorganic photoelectric converter, the semiconductor substrate including a second inorganic photoelectric converter thereinside; and a first part including a microstructure arranged between the first inorganic photoelectric converter and the second inorganic photoelectric converter.

    Abstract translation: 根据一个实施例，固态成像装置包括：第一无机光电转换器; 包括光入射的受光面和形成有包括读出电路的电路的电路形成面的半导体基板，所述受光面朝向所述第一无机光电转换元件，所述半导体基板包括 第二无机光电转换器; 以及包括布置在第一无机光电转换器和第二无机光电转换器之间的微结构的第一部分。

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