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    LIGHT DETECTOR, LIGHT DETECTION SYSTEM, AND LIDAR DEVICE
    1.
    发明公开
    LIGHT DETECTOR, LIGHT DETECTION SYSTEM, AND LIDAR DEVICE 审中-公开

    公开(公告)号：US20240094349A1

    公开(公告)日：2024-03-21

    申请号：US18169514

    申请日：2023-02-15

    Applicant: Kabushiki Kaisha Toshiba

    Inventor： Keita SASAKI ,  Mariko SHIMIZU ,  Kazuhiro SUZUKI

    IPC: G01S7/481 ,  G01S17/08

    CPC classification number: G01S7/4816 ,  G01S17/08

    Abstract: A light detector according to one embodiment, includes a substrate. The substrate includes a first semiconductor layer, an insulating layer, and a second semiconductor layer. The insulating layer is located on the first semiconductor layer. The second semiconductor layer is located on the insulating layer. The second semiconductor layer includes a photoelectric conversion part. The photoelectric conversion part includes a first semiconductor region and a second semiconductor region. The substrate includes a void and a trench. The void is positioned below the photoelectric conversion part and between the first semiconductor layer and the second semiconductor layer. The trench surrounds the photoelectric conversion part. A lower end of the trench is positioned in the second semiconductor layer. The photoelectric conversion part is electrically connected with an upper surface side of the substrate via a portion below the trench.

    LIGHT DETECTOR, LIGHT DETECTION SYSTEM, LIDAR DEVICE, AND MOBILE BODY
    2.
    发明公开
    LIGHT DETECTOR, LIGHT DETECTION SYSTEM, LIDAR DEVICE, AND MOBILE BODY 审中-公开

    公开(公告)号：US20230299103A1

    公开(公告)日：2023-09-21

    申请号：US17822417

    申请日：2022-08-25

    Applicant: KABUSHIKI KAISHA TOSHIBA

    Inventor： Ryomo KANEKO ,  Mariko SHIMIZU ,  Keita SASAKI ,  Honam KWON ,  Ikuo FUJIWARA ,  Kazuhiro SUZUKI

    IPC: H01L27/146 ,  G01S17/89

    CPC classification number: H01L27/14623 ,  H01L27/1463 ,  G01S17/89 ,  H01L27/14649 ,  H01L27/14627

    Abstract: A light detector according to one embodiment, includes an element region, a light concentrator, a structure part and a light-shielding part. The element region includes a first semiconductor region of a first conductivity type, and a second semiconductor region of a second conductivity type. The light concentrator is separated from the element region in a first direction. The light concentrator is configured to concentrate light incident on the light concentrator. The structure part is arranged with the element region in a direction crossing the first direction. The structure part has a different refractive index from the element region. The light-shielding part is located between the element region and the light concentrator. The light-shielding part includes an opening. At least a portion of the light incident on the light concentrator is able to be incident on the element region by passing through the opening.

    LIGHT DETECTOR, LIGHT DETECTION SYSTEM, LIDAR DEVICE, AND VEHICLE
    3.
    发明申请
    LIGHT DETECTOR, LIGHT DETECTION SYSTEM, LIDAR DEVICE, AND VEHICLE 有权

    公开(公告)号：US20210293967A1

    公开(公告)日：2021-09-23

    申请号：US17015774

    申请日：2020-09-09

    Applicant: KABUSHIKI KAISHA TOSHIBA

    Inventor： Ikuo FUJIWARA ,  Honam KWON ,  Keita SASAKI ,  Kazuhiro SUZUKI ,  Masaki ATSUTA ,  Mariko SHIMIZU ,  Kazuaki OKAMOTO

    IPC: G01S17/931 ,  H01L31/107 ,  G01S17/89 ,  G01S7/481

    Abstract: According to one embodiment, a light detector includes an element, and a structure body. The element includes a first semiconductor region, a second semiconductor region, and a third semiconductor region. The second semiconductor region is provided on the first semiconductor region. The third semiconductor region is provided on the second semiconductor region. The structure body is provided around the element. The structure body includes first and second insulating portions and a metal-including portion. The metal-including portion is provided above the first insulating portion. A position in the first direction of a portion of the metal-including portion is same as a position in the first direction of the third semiconductor region. The second insulating portion is positioned between the metal-including portion and the element in the first plane. A thickness of the first insulating portion is greater than a thickness of the second insulating portion in the first plane.

    LIGHT DETECTOR, LIGHT DETECTION SYSTEM, LIDAR DEVICE, AND VEHICLE
    5.
    发明申请
    LIGHT DETECTOR, LIGHT DETECTION SYSTEM, LIDAR DEVICE, AND VEHICLE 有权

    公开(公告)号：US20210063545A1

    公开(公告)日：2021-03-04

    申请号：US16812435

    申请日：2020-03-09

    Applicant: KABUSHIKI KAISHA TOSHIBA

    Inventor： Honam KWON ,  Koichi ISHII ,  lkuo FUJIWARA ,  Kazuhiro SUZUKI

    IPC: G01S7/4863 ,  H01L31/02 ,  G01S17/931 ,  G01S7/4865

    Abstract: According to one embodiment, a light detector includes a conductive layer, a first element, a second element, a first member, a first insulating part, and a second insulating part. The conductive layer includes a first conductive portion and a second conductive portion. The first element includes a first semiconductor layer and a second semiconductor layer. The second element includes a fourth semiconductor layer and a fifth semiconductor layer. The first member is provided between the first element and the second element and electrically connected to the conductive layer. The first member is conductive. The first insulating part is provided between the first element and the first member. The second insulating part is provided between the second element and the first member.

    IMAGING DEVICE
    7.
    发明申请
    IMAGING DEVICE 审中-公开
    成像装置

    公开(公告)号：US20150241282A1

    公开(公告)日：2015-08-27

    申请号：US14693661

    申请日：2015-04-22

    Applicant: KABUSHIKI KAISHA TOSHIBA

    Inventor： Hiroto HONDA ,  Kazuhiro SUZUKI ,  Hideyuki FUNAKI ,  Masaki ATSUTA ,  Keita SASAKI ,  Koichi ISHII ,  Honam KWON

    IPC: G01J5/06 ,  G01J5/12 ,  G01J5/02 ,  H04N5/33 ,  G01J5/22

    CPC classification number: G01J5/12 ,  G01J5/023 ,  G01J5/20 ,  G01J5/22 ,  G01J2005/0077 ,  H01L27/14649 ,  H04N5/33

    Abstract: An imaging device according to an embodiment includes: a semiconductor substrate; a reference pixel with a first concave portion disposed in a first portion of a surface of the semiconductor substrate; and one or more infrared detection pixels each configured to detect light with a second concave portion disposed in a second portion of the surface of the semiconductor substrate, the reference pixel being directly connected to the semiconductor substrate at a position where the first concave portion is not present, and including a first thermoelectric conversion unit configured to convert heat to an electric signal, the first thermoelectric conversion unit being disposed in the first concave portion and including a first thermoelectric conversion element, each infrared detection pixel including a second thermoelectric conversion unit being disposed in the second concave portion and including a second thermoelectric conversion element.

    Abstract translation: 根据实施例的成像装置包括：半导体衬底; 参考像素，其具有设置在所述半导体衬底的表面的第一部分中的第一凹部; 以及一个或多个红外检测像素，每个红外检测像素被配置为利用设置在所述半导体衬底的表面的第二部分中的第二凹部来检测光，所述参考像素在所述第一凹部不在所述位置处直接连接到所述半导体衬底 存在并且包括被配置为将热量转换为电信号的第一热电转换单元，第一热电转换单元设置在第一凹部中并且包括第一热电转换元件，每个红外检测像素包括第二热电转换单元， 在第二凹部中并且包括第二热电转换元件。

    IMAGING LENS AND SOLID STATE IMAGING DEVICE
    8.
    发明申请
    IMAGING LENS AND SOLID STATE IMAGING DEVICE 有权
    成像镜头和固态成像装置

    公开(公告)号：US20150077622A1

    公开(公告)日：2015-03-19

    申请号：US14460862

    申请日：2014-08-15

    Applicant: Kabushiki Kaisha Toshiba

    Inventor： Risako UENO ,  Hiroto HONDA ,  Mitsuyoshi KOBAYASHI ,  Kazuhiro SUZUKI ,  Honam KWON ,  Hideyuki FUNAKI

    IPC: G02B3/00 ,  G02B13/00 ,  H04N5/225 ,  G02B13/18

    CPC classification number: G02B3/0056 ,  G02B5/005 ,  G02B9/34 ,  G02B13/001 ,  G02B13/0015 ,  G02B13/004 ,  G02B13/0055 ,  G02B13/16 ,  G02B13/18 ,  G03B9/02 ,  H04N5/2251 ,  H04N5/2254

    Abstract: According to one embodiment, an imaging lens includes a first optical system and a microlens array. The first optical system includes an optical axis. The microlens array is provided between the first optical system and an imaging element. The microlens array includes microlens units provided in a first plane. The imaging element includes pixel groups. Each of the pixel groups includes pixels. The microlens units respectively overlap the pixel groups when projected onto the first plane. The first optical system includes an aperture stop, a first lens, a second lens, a third lens, and a fourth lens. The first lens is provided between the aperture stop and the microlens array. The second lens is provided between the first lens and the microlens array. The third lens is provided between the second lens and the microlens array. The fourth lens is provided between the third lens and the microlens array.

    Abstract translation: 根据一个实施例，成像透镜包括第一光学系统和微透镜阵列。 第一光学系统包括光轴。 微透镜阵列设置在第一光学系统和成像元件之间。 微透镜阵列包括设置在第一平面中的微透镜单元。 成像元件包括像素组。 每个像素组包括像素。 当投影到第一平面上时，微透镜单元分别与像素组重叠。 第一光学系统包括孔径光阑，第一透镜，第二透镜，第三透镜​​和第四透镜。 第一透镜设置在孔径光阑和微透镜阵列之间。 第二透镜设置在第一透镜和微透镜阵列之间。 第三透镜设置在第二透镜和微透镜阵列之间。 第四透镜设置在第三透镜和微透镜阵列之间。

    MICROLENS ARRAY FOR SOLID-STATE IMAGE SENSING DEVICE, SOLID-STATE IMAGE SENSING DEVICE, IMAGING DEVICE, AND LENS UNIT
    9.
    发明申请
    MICROLENS ARRAY FOR SOLID-STATE IMAGE SENSING DEVICE, SOLID-STATE IMAGE SENSING DEVICE, IMAGING DEVICE, AND LENS UNIT 有权
    用于固态图像感测装置的微透镜阵列，固态图像感测装置，成像装置和透镜单元

    公开(公告)号：US20150077585A1

    公开(公告)日：2015-03-19

    申请号：US14481999

    申请日：2014-09-10

    Applicant: Kabushiki Kaisha Toshiba

    Inventor： Mitsuyoshi KOBAYASHI ,  Risako UENO ,  Kazuhiro SUZUKI ,  Hiroto HONDA ,  Honam KWON ,  Hideyuki FUNAKI

    IPC: G02B3/00 ,  H04N5/232 ,  H04N5/369

    CPC classification number: H04N5/23212 ,  G02B3/0037 ,  H04N5/2257

    Abstract: According to an embodiment, a microlens array for a solid-state image sensing device includes a plurality of microlenses and a state detector. The plurality of microlenses are disposed in an imaging microlens area and is configured to form two-dimensional images. The state detector is disposed on a periphery of the imaging microlens area and is configured to, on an image forming surface of the microlenses, generate images having a smaller diameter than images formed by the microlenses.

    Abstract translation: 根据实施例，用于固态图像感测装置的微透镜阵列包括多个微透镜和状态检测器。 多个微透镜设置在成像微透镜区域中并且被配置为形成二维图像。 状态检测器设置在成像微透镜区域的周边上，并且被配置为在微透镜的图像形成表面上产生具有比由微透镜形成的图像更小的直径的图像。

    LIGHT DETECTOR, LIGHT DETECTION SYSTEM, LIDAR DEVICE, AND MOVING BODY
    10.
    发明申请
    LIGHT DETECTOR, LIGHT DETECTION SYSTEM, LIDAR DEVICE, AND MOVING BODY 有权

    公开(公告)号：US20220223749A1

    公开(公告)日：2022-07-14

    申请号：US17446591

    申请日：2021-08-31

    Applicant: KABUSHIKI KAISHA TOSHIBA

    Inventor： Honam KWON ,  Mariko SHIMIZU ,  Kazuaki OKAMOTO ,  Kazuhiro SUZUKI

    IPC: H01L31/0232 ,  G01S7/4863 ,  G01S7/481 ,  H01L31/107

    Abstract: According to one embodiment, a light detector includes a junction region, a first insulating portion, and a quenching part. The junction region includes a first semiconductor region of a first conductivity type and a second semiconductor region of a second conductivity type. The second semiconductor region is provided on the first semiconductor region and forms a p-n junction surface with the first semiconductor region. The first insulating portion has an inclined surface inclined with respect to a first direction perpendicular to the p-n junction surface and includes void. The inclined surface is provided at a same height as at least a portion of the junction region and crosses the second direction from the junction region toward the first insulating portion. The quenching part is electrically connected to the second semiconductor region,

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