知搜-全球专利检索

  1. Login
  2. Sign Up

Search Results

4 records (took 0.012 seconds)

    IN-LINE WAFER EDGE INSPECTION, WAFER PRE-ALIGNMENT, AND WAFER CLEANING
    1.
    发明申请
    IN-LINE WAFER EDGE INSPECTION, WAFER PRE-ALIGNMENT, AND WAFER CLEANING 有权
    在线波形边缘检查，波形预排列和波形清洗

    公开(公告)号：US20150370175A1

    公开(公告)日：2015-12-24

    申请号：US14741866

    申请日：2015-06-17

    Applicant: KLA-Tencor Corporation

    Inventor： Lena Nicolaides ,  Ben-ming Benjamin Tsai ,  Prashant A. Aji ,  Michael Gasvoda ,  Stanley E. Stokowski ,  Guoheng Zhao ,  Youxian Wen ,  Mohan Mahadevan ,  Paul D. Horn ,  Wolfgang Vollrath ,  Isabella T. Lewis

    IPC: G03F7/20 ,  G01N21/95

    CPC classification number: G01N21/9503 ,  G01N2201/06113 ,  G03F7/7085 ,  H01L22/12

    Abstract: Disclosed are methods and apparatus for inspecting and processing semiconductor wafers. The system includes an edge detection system for receiving each wafer that is to undergo a photolithography process. The edge detection system comprises an illumination channel for directing one or more illumination beams towards a side, top, and bottom edge portion that are within a border region of the wafer. The edge detection system also includes a collection module for collecting and sensing output radiation that is scattered or reflected from the edge portion of the wafer and an analyzer module for locating defects in the edge portion and determining whether each wafer is within specification based on the sensed output radiation for such wafer. The photolithography system is configured for receiving from the edge detection system each wafer that has been found to be within specification. The edge detection system is coupled in-line with the photolithography system.

    Abstract translation: 公开了用于检查和处理半导体晶片的方法和装置。 该系统包括边缘检测系统，用于接收将进行光刻工艺的每个晶片。 边缘检测系统包括用于将一个或多个照明光束朝向位于晶片的边界区域内的侧面，顶部和底部边缘部分引导的照明通道。 边缘检测系统还包括用于收集和感测从晶片的边缘部分散射或反射的输出辐射的收集模块和用于定位边缘部分中的缺陷的分析器模块，并且基于所感测到的每个晶片是否在规格范围内 这种晶片的输出辐射。 光刻系统被配置为从边缘检测系统接收已发现在规格范围内的每个晶片。 边缘检测系统与光刻系统成对连接。

    Simultaneous multi-directional laser wafer inspection
    2.
    发明授权
    Simultaneous multi-directional laser wafer inspection 有权

    公开(公告)号：US10739275B2

    公开(公告)日：2020-08-11

    申请号：US15697386

    申请日：2017-09-06

    Applicant: KLA-Tencor Corporation

    Inventor： Guoheng Zhao ,  Sheng Liu ,  Ben-ming Benjamin Tsai

    IPC: G01N21/95 ,  G06T7/00 ,  G01N21/956 ,  G01N21/88 ,  H04N5/225 ,  H04N5/232 ,  H04N5/235

    Abstract: Disclosed is apparatus for inspecting a sample. The apparatus includes illumination optics for simultaneously directing a plurality of incident beams at a plurality of azimuth angles towards a sample and collection optics for directing a plurality of field portions of output light from two or more of the plurality of angles towards two or more corresponding sensors. The two or more sensors are arranged for receiving the field portions corresponding to two or more angles and generating two or more corresponding images. The apparatus further comprises a processor for analyzing the two or more images to detect defects on the sample.

Patent Agency Ranking