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公开(公告)号：US11287248B2
公开(公告)日：2022-03-29
申请号：US16806076
申请日：2020-03-02
Applicant: KLA-Tencor Corporation
Inventor： Guoheng Zhao , Maarten van der Burgt , Sheng Liu , Andy Hill , Johan De Greeve , Karel van Gils
Abstract: For three-dimensional topography measurement of a surface of an object patterned illumination is projected on the surface through an objective. A relative movement between the object and the objective is carried out, and plural images of the surface are recorded through the objective by a detector. The direction of the relative movement includes an oblique angle with an optical axis of the objective. Height information for a given position on the surface is derived from a variation of the intensity recorded from the respective position. Also, patterned illumination and uniform illumination may be projected alternatingly on the surface, while images of the surface are recorded during a relative movement of the object and the objective along an optical axis of the objective. Uniform illumination is used for obtaining height information for specular structures on the surface, patterned illumination is used for obtaining height information on other parts of the surface.
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公开(公告)号：US20200217651A1
公开(公告)日：2020-07-09
申请号：US16806076
申请日：2020-03-02
Applicant: KLA-Tencor Corporation
Inventor： Guoheng Zhao , Maarten van der Burgt , Sheng Liu , Andy Hill , Johan De Greeve , Karel van Gils
Abstract: For three-dimensional topography measurement of a surface of an object patterned illumination is projected on the surface through an objective. A relative movement between the object and the objective is carried out, and plural images of the surface are recorded through the objective by a detector. The direction of the relative movement includes an oblique angle with an optical axis of the objective. Height information for a given position on the surface is derived from a variation of the intensity recorded from the respective position. Also, patterned illumination and uniform illumination may be projected alternatingly on the surface, while images of the surface are recorded during a relative movement of the object and the objective along an optical axis of the objective. Uniform illumination is used for obtaining height information for specular structures on the surface, patterned illumination is used for obtaining height information on other parts of the surface.
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公开(公告)号：US09874526B2
公开(公告)日：2018-01-23
申请号：US15468608
申请日：2017-03-24
Applicant: KLA-Tencor Corporation
Inventor： Sheng Liu , Guoheng Zhao
CPC classification number: G01N21/8806 , G01N21/21 , G01N21/9501 , G01N2021/8848 , G01N2201/0683
Abstract: Disclosed are methods and apparatus for inspecting a semiconductor sample. This system comprises an illumination optics subsystem for generating and directing an incident beam towards a defect on a surface of a wafer. The illumination optics subsystem includes a light source for generating the incident beam and one or more polarization components for adjusting a ratio and/or a phase difference for the incident beam's electric field components. The system further includes a collection optics subsystem for collecting scattered light from the defect and/or surface in response to the incident beam, and the collection optics subsystem comprises an adjustable aperture at the pupil plane, followed by a rotatable waveplate for adjusting a phase difference of electric field components of the collected scattered light, followed by a rotatable analyzer. The system also includes a controller that is configured for (i) selecting a polarization of the incident beam, (ii) obtaining a defect scattering map, (iii) obtaining a surface scattering map, and (iv) determining a configuration of the one or more polarization components, aperture mask, and rotatable ¼ waveplate, and analyzer based on analysis of the defect and surface scattering map so as to maximize a defect signal to noise ratio,
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公开(公告)号：US10228331B2
公开(公告)日：2019-03-12
申请号：US15847249
申请日：2017-12-19
Applicant: KLA-Tencor Corporation
Inventor： Sheng Liu , Guoheng Zhao
Abstract: This system comprises an illumination optics subsystem for generating and directing an incident beam towards a defect on a surface of a wafer. The illumination optics subsystem includes a light source for generating the incident beam and one or more polarization components for adjusting a ratio and/or a phase difference for the incident beam's electric field components. The system includes a collection optics subsystem for collecting scattered light from the defect and/or surface in response to the incident beam, and the collection optics subsystem comprises an adjustable aperture at the pupil plane, a rotatable waveplate for adjusting a phase difference of electric field components of the collected scattered light, and a rotatable analyzer. The system includes a controller for selecting a polarization of the incident beam, obtaining a defect scattering map from the defect, obtaining a surface scattering map from the background surface, and determining a configuration of the polarization components, aperture mask, rotatable waveplate, and analyzer based on analysis of the defect and surface scattering map to maximize a defect signal to noise ratio.
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公开(公告)号：US20180073993A1
公开(公告)日：2018-03-15
申请号：US15697386
申请日：2017-09-06
Applicant: KLA-Tencor Corporation
Inventor： Guoheng Zhao , Sheng Liu , Ben-ming Benjamin Tsai
CPC classification number: G01N21/9501 , G01N21/8806 , G01N21/956 , G01N2021/8825 , G01N2021/8848 , G01N2201/0683 , G06T7/0004 , G06T7/001 , G06T2207/10152 , G06T2207/20212 , G06T2207/30148 , H04N5/2256 , H04N5/23229 , H04N5/2354
Abstract: Disclosed is apparatus for inspecting a sample. The apparatus includes illumination optics for simultaneously directing a plurality of incident beams at a plurality of azimuth angles towards a sample and collection optics for directing a plurality of field portions of output light from two or more of the plurality of angles towards two or more corresponding sensors. The two or more sensors are arranged for receiving the field portions corresponding to two or more angles and generating two or more corresponding images. The apparatus further comprises a processor for analyzing the two or more images to detect defects on the sample
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Patent Agency Ranking
公开(公告)号：US10739275B2
公开(公告)日：2020-08-11
申请号：US15697386
申请日：2017-09-06
Applicant: KLA-Tencor Corporation
Inventor： Guoheng Zhao , Sheng Liu , Ben-ming Benjamin Tsai
Abstract: Disclosed is apparatus for inspecting a sample. The apparatus includes illumination optics for simultaneously directing a plurality of incident beams at a plurality of azimuth angles towards a sample and collection optics for directing a plurality of field portions of output light from two or more of the plurality of angles towards two or more corresponding sensors. The two or more sensors are arranged for receiving the field portions corresponding to two or more angles and generating two or more corresponding images. The apparatus further comprises a processor for analyzing the two or more images to detect defects on the sample.
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公开(公告)号：US20180364177A1
公开(公告)日：2018-12-20
申请号：US15847249
申请日：2017-12-19
Applicant: KLA-Tencor Corporation
Inventor： Sheng Liu , Guoheng Zhao
CPC classification number: G01N21/8806 , G01N21/21 , G01N21/9501 , G01N2021/8848 , G01N2201/0683
Abstract: This system comprises an illumination optics subsystem for generating and directing an incident beam towards a defect on a surface of a wafer. The illumination optics subsystem includes a light source for generating the incident beam and one or more polarization components for adjusting a ratio and/or a phase difference for the incident beam's electric field components. The system includes a collection optics subsystem for collecting scattered light from the defect and/or surface in response to the incident beam, and the collection optics subsystem comprises an adjustable aperture at the pupil plane, a rotatable waveplate for adjusting a phase difference of electric field components of the collected scattered light, and a rotatable analyzer. The system includes a controller for selecting a polarization of the incident beam, obtaining a defect scattering map from the defect, obtaining a surface scattering map from the background surface, and determining a configuration of the polarization components, aperture mask, rotatable waveplate, and analyzer based on analysis of the defect and surface scattering map to maximize a defect signal to noise ratio.
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公开(公告)号：US20200333262A1
公开(公告)日：2020-10-22
申请号：US16946742
申请日：2020-07-02
Applicant: KLA-Tencor Corporation
Inventor： Guoheng Zhao , Sheng Liu , Ben-Ming Benjamin Tsai
IPC: G01N21/95 , G06T7/00 , G01N21/956 , G01N21/88
Abstract: Disclosed is apparatus for inspecting a sample. The apparatus includes illumination optics for simultaneously directing a plurality of incident beams at a plurality of azimuth angles towards a sample and collection optics for directing a plurality of field portions of output light from two or more of the plurality of angles towards two or more corresponding sensors. The two or more sensors are arranged for receiving the field portions corresponding to two or more angles and generating two or more corresponding images. The apparatus further comprises a processor for analyzing the two or more images to detect defects on the sample
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公开(公告)号：US09194811B1
公开(公告)日：2015-11-24
申请号：US14231412
申请日：2014-03-31
Applicant: KLA-Tencor Corporation
Inventor： Guoheng Zhao , Sheng Liu
CPC classification number: G01N21/9501 , G01N21/8806
Abstract: Disclosed are methods and apparatus for detecting defects in a semiconductor sample. The system includes an illumination optics module for simultaneously scanning two or more structured illumination (SI) patterns across the sample in a scan direction. The SI patterns have a phase shift with respect to each other, and the SI patterns are parallel to the scan direction. The system also includes a collection optics module for collecting output light from the sample in response to the SI patterns that are scanned across the sample and two or more detectors for individually detecting the output light collected for individual ones of the SI patterns. The system includes a controller to generate two or more SI images for the SI patterns based on the individually detected output light and detect defects on the sample by performing a comparison type inspection process based on the two or more SI images.
Abstract translation: 公开了用于检测半导体样品中的缺陷的方法和装置。 该系统包括照射光学模块，用于在扫描方向上同时扫描横跨样本的两个或多个结构化照明（SI）图案。 SI图案相对于彼此具有相移，SI图案与扫描方向平行。 该系统还包括收集光学模块，用于响应于在样本上扫描的SI图案和用于单独检测针对各个SI图案收集的输出光的两个或更多个检测器来收集来自样本的输出光。 该系统包括控制器，用于基于单独检测的输出光产生用于SI图案的两个或更多个SI图像，并且通过基于两个或更多个SI图像执行比较类型检查处理来检测样本上的缺陷。
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公开(公告)号：US11366069B2
公开(公告)日：2022-06-21
申请号：US16946742
申请日：2020-07-02
Applicant: KLA-Tencor Corporation
Inventor： Guoheng Zhao , Sheng Liu , Ben-Ming Benjamin Tsai
Abstract: Disclosed is apparatus for inspecting a sample. The apparatus includes illumination optics for simultaneously directing a plurality of incident beams at a plurality of azimuth angles towards a sample and collection optics for directing a plurality of field portions of output light from two or more of the plurality of angles towards two or more corresponding sensors. The two or more sensors are arranged for receiving the field portions corresponding to two or more angles and generating two or more corresponding images. The apparatus further comprises a processor for analyzing the two or more images to detect defects on the sample.
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