Invention Grant
- Patent Title: Methods and apparatus for polarized wafer inspection
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Application No.: US15847249Application Date: 2017-12-19
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Publication No.: US10228331B2Publication Date: 2019-03-12
- Inventor: Sheng Liu , Guoheng Zhao
- Applicant: KLA-Tencor Corporation
- Applicant Address: US CA Milpitas
- Assignee: KLA-Tencor Corporation
- Current Assignee: KLA-Tencor Corporation
- Current Assignee Address: US CA Milpitas
- Agency: Kwan & Olynick LLP
- Main IPC: G01N21/88
- IPC: G01N21/88 ; G01N21/95 ; G01N21/21

Abstract:
This system comprises an illumination optics subsystem for generating and directing an incident beam towards a defect on a surface of a wafer. The illumination optics subsystem includes a light source for generating the incident beam and one or more polarization components for adjusting a ratio and/or a phase difference for the incident beam's electric field components. The system includes a collection optics subsystem for collecting scattered light from the defect and/or surface in response to the incident beam, and the collection optics subsystem comprises an adjustable aperture at the pupil plane, a rotatable waveplate for adjusting a phase difference of electric field components of the collected scattered light, and a rotatable analyzer. The system includes a controller for selecting a polarization of the incident beam, obtaining a defect scattering map from the defect, obtaining a surface scattering map from the background surface, and determining a configuration of the polarization components, aperture mask, rotatable waveplate, and analyzer based on analysis of the defect and surface scattering map to maximize a defect signal to noise ratio.
Public/Granted literature
- US20180364177A1 METHODS AND APPARATUS FOR POLARIZED WAFER INSPECTION Public/Granted day:2018-12-20
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