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    Dicing technique for flip-chip USP wafers
    1.
    发明授权
    Dicing technique for flip-chip USP wafers 失效
    倒装芯片USP晶片的切割技术

    公开(公告)号：US07491581B2

    公开(公告)日：2009-02-17

    申请号：US11615712

    申请日：2006-12-22

    申请人： Jon B. DCamp ,  Harlan L. Curtis

    发明人： Jon B. DCamp ,  Harlan L. Curtis

    IPC分类号： H01L21/00

    CPC分类号： B81C1/00873 ,  B81C2203/0118

    摘要： A method and a fused compound wafer including at least one first MEMS sensor and at least second MEMS sensor includes a first wafer. The first wafer includes at least one first MEMS sensor first subassembly and at least one second MEMS sensor first subassembly. A second wafer includes at least one first MEMS sensor second subassembly, at least one second MEMS sensor second assembly, and a fusing matrix. The fusing matrix includes a first joint configured to encapsulate each of the at least one first MEMS sensor first assembly and each of the at least one first MEMS sensor second assembly forming each at least one first MEMS sensor. A second joint is configured to encapsulate each of the at least one second MEMS first subassembly and each of the at least one second MEMS second subassembly forming each at least one second MEMS sensor.

    摘要翻译： 包括至少一个第一MEMS传感器和至少第二MEMS传感器的方法和融合复合晶片包括第一晶片。 第一晶片包括至少一个第一MEMS传感器第一子组件和至少一个第二MEMS传感器第一子组件。 第二晶片包括至少一个第一MEMS传感器第二子组件，至少一个第二MEMS传感器第二组件和熔丝矩阵。 定影矩阵包括第一接头，其被配置为封装所述至少一个第一MEMS传感器第一组件中的每一个，并且所述至少一个第一MEMS传感器第二组件中的每一个形成每个至少一个第一MEMS传感器。 第二接头被配置为封装所述至少一个第二MEMS第一子组件中的每一个，并且至少一个第二MEMS第二子组件中的每一个形成每个至少一个第二MEMS传感器。

    MEMS device packaging methods
    2.
    发明授权
    MEMS device packaging methods 有权
    MEMS器件封装方法

    公开(公告)号：US07491567B2

    公开(公告)日：2009-02-17

    申请号：US11164449

    申请日：2005-11-22

    申请人： Jon B. DCamp ,  Harlan L. Curtis

    发明人： Jon B. DCamp ,  Harlan L. Curtis

    IPC分类号： H01L21/00 ,  H01L21/50 ,  H01L21/48 ,  H01L21/44 ,  H01L29/84 ,  H01L29/82 ,  H01L27/14

    CPC分类号： B81C1/00285 ,  B81B2201/0235 ,  B81C2203/019 ,  H01L2924/15192

    摘要： A method of packaging a MEMS device that includes, for example, the steps of providing a MEMS die that has a MEMS device, a seal ring and bond pads disposed thereon, providing a MEMS package that has a recess, a seal ring and bond pads disposed thereon, positioning the MEMS die over the MEMS package to align the seal rings and bond pads, inserting the MEMS die and MEMS package into a vacuum chamber and evacuating gasses therefrom to form a controlled vacuum pressure therein, sealing the MEMS package and the MEMS die together at the seal rings to form a package having a hermitically sealed interior chamber and simultaneously forming electrical connections between the corresponding bond pads.

    摘要翻译： 一种封装MEMS器件的方法，其包括例如提供具有MEMS器件的MEMS管芯，密封环和设置在其上的接合焊盘的步骤，提供具有凹部，密封环和接合焊盘的MEMS封装 将MEMS管芯定位在MEMS封装上以使密封环和接合焊盘对准，将MEMS管芯和MEMS封装插入真空室并从其中排出气体以在其中形成受控的真空压力，密封MEMS封装和MEMS 在密封环处一起模制，以形成具有密封密封的内部腔室并且同时形成相应接合垫之间的电连接的包装。

    SYSTEM AND METHOD FOR SEALING A MEMS DEVICE
    4.
    发明申请
    SYSTEM AND METHOD FOR SEALING A MEMS DEVICE 有权
    用于密封MEMS器件的系统和方法

    公开(公告)号：US20080188035A1

    公开(公告)日：2008-08-07

    申请号：US11672348

    申请日：2007-02-07

    申请人： Bryan R. Seppala ,  Harlan L. Curtis ,  Jon B. DCamp ,  Richard K. Spielberger

    发明人： Bryan R. Seppala ,  Harlan L. Curtis ,  Jon B. DCamp ,  Richard K. Spielberger

    IPC分类号： H01L21/00

    CPC分类号： B81B7/0041 ,  B81C2203/0109 ,  B81C2203/019 ,  B81C2203/036 ,  H01L2224/48227 ,  H01L2924/01322 ,  H01L2924/1461 ,  H01L2924/15153 ,  H01L2924/15321 ,  H01L2924/16195 ,  H01L2924/00

    摘要： A method for assembling a hermetically sealed package to contain a MEMS die and the hermetically sealed package are presented. The method includes selectively applying a glass mixture to a dome. The dome is heated to a first temperature sufficient to flow the glass mixture. The dome is pressed into contact with a carrier containing the MEMS device, the pressing being maintained at a pressure and for a temporal interval sufficient to flow the glass mixture onto the carrier. The dome is cooled while maintaining contact with the carrier, to a second temperature sufficient to allow the glass mixture to harden into a glass frit thereby to seal the carrier to the dome. The glass frit has a seal width.

    摘要翻译： 提出了一种用于组装气密封装以容纳MEMS管芯和密封封装的方法。 该方法包括选择性地将玻璃混合物施加到圆顶。 将圆顶加热至足以使玻璃混合物流动的第一温度。 将圆顶压制成与包含MEMS器件的载体接触，该压制保持在足以将玻璃混合物流动到载体上的压力和时间间隔。 圆顶被冷却，同时保持与载体的接触，达到足以使玻璃混合物硬化到玻璃料中的第二温度，从而将载体密封到圆顶。 玻璃料具有密封宽度。

    MEMS SENSOR WITH INTEGRATED ASIC PACKAGING
    6.
    发明申请
    MEMS SENSOR WITH INTEGRATED ASIC PACKAGING 审中-公开
    具有集成ASIC封装的MEMS传感器

    公开(公告)号：US20110227173A1

    公开(公告)日：2011-09-22

    申请号：US12848666

    申请日：2010-08-02

    申请人： Bryan R. Seppala ,  Jon B. DCamp ,  Harlan L. Curtis ,  Chad Buss

    发明人： Bryan R. Seppala ,  Jon B. DCamp ,  Harlan L. Curtis ,  Chad Buss

    IPC分类号： H01L29/84

    CPC分类号： B81C1/0023 ,  B81B2207/096 ,  B81C2203/0109 ,  H01L2224/16225 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/00012

    摘要： A sensor assembly comprises an integrated circuit (IC) substrate having an upper surface and operating circuitry, and a micro-electro-mechanical systems (MEMS) sensor die attached to the upper surface of the IC substrate in a stacked configuration. The MEMS sensor die in operative communication with the operating circuitry of the IC substrate. A seal ring surrounds an outer periphery of the upper surface of the IC substrate, and a seal cap is secured to the seal ring over the MEMS sensor die.

    摘要翻译： 传感器组件包括具有上表面和操作电路的集成电路（IC）基板和以堆叠配置附接到IC基板的上表面的微机电系统（MEMS）传感器芯片。 MEMS传感器芯片与IC基板的操作电路可操作地通信。 密封环围绕IC基板的上表面的外周，密封盖固定在MEMS传感器芯片上的密封环上。

    AUTOMATED PREFORM ATTACH FOR VACUUM PACKAGING
    8.
    发明申请
    AUTOMATED PREFORM ATTACH FOR VACUUM PACKAGING 审中-公开
    自动包装的真空包装

    公开(公告)号：US20090014499A1

    公开(公告)日：2009-01-15

    申请号：US11776486

    申请日：2007-07-11

    申请人： Bryan R. Seppala ,  Jon B. DCamp ,  Harlan L. Curtis ,  David W. Schaefer ,  Gary L. Deering

    发明人： Bryan R. Seppala ,  Jon B. DCamp ,  Harlan L. Curtis ,  David W. Schaefer ,  Gary L. Deering

    IPC分类号： B23K31/02 ,  B23K20/00 ,  B23K37/04

    CPC分类号： H01L21/67144

    摘要： Systems and methods for automatically attaching preforms to substrates. An example system includes a nest, a first component that places a substrate into the nest, a second component that places a preform on the substrate in the nest, a tacking device that tacks the preform to the substrate, a plurality of sensors that sense operational states of the components and the tacking device, and a controller that automatically controls operations of the components and the tacking device based on the sensed operational states.

    摘要翻译： 将预成型件自动连接到基材的系统和方法。 示例性系统包括嵌套，将基板放置在嵌套中的第一部件，将预成型件放置在嵌套中的基板上的第二部件，将预型件固定到基板上的固定装置，感测操作的多个传感器 组件和固定装置的状态，以及基于感测的操作状态自动控制部件和固定装置的操作的控制器。

    Methods and apparatus for attaching getters to MEMS device housings
    9.
    发明授权
    Methods and apparatus for attaching getters to MEMS device housings 失效
    将吸气剂连接到MEMS器件外壳的方法和设备

    公开(公告)号：US07074636B2

    公开(公告)日：2006-07-11

    申请号：US11127388

    申请日：2005-05-12

    申请人： Harlan L. Curtis ,  Max C. Glenn ,  Jon B. DCamp ,  Lori A. Dunaway

    发明人： Harlan L. Curtis ,  Max C. Glenn ,  Jon B. DCamp ,  Lori A. Dunaway

    IPC分类号： H01L21/00

    CPC分类号： B81B7/0038 ,  H01L2224/48091 ,  H01L2924/10253 ,  H01L2924/00014 ,  H01L2924/00

    摘要： A method for reducing occurrences of loose gettering material particles within micro-electromechanical system (MEMS) devices is described. The MEMS devices include a micro-machine within a substantially sealed cavity formed by a housing and a cover for the housing. The cavity containing a getter mounted on a getter substrate which is to be attached to the cover. The method includes providing an area between a portion of the cover and a portion of the getter substrate, positioning the getter within the area, and attaching the getter substrate to the cover.

    摘要翻译： 描述了一种减少微机电系统（MEMS）装置中松散的吸气材料颗粒的发生的方法。 MEMS器件包括由壳体和用于壳体的盖形成的基本上密封的腔内的微型机器。 所述空腔包含安装在吸附剂基底上的吸气剂，所述吸气剂将附着到盖子上。 该方法包括在盖的一部分和吸气剂基底的一部分之间提供区域，将吸气剂定位在该区域内，以及将吸气剂衬底附接到盖上。