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    Dicing technique for flip-chip USP wafers
    1.
    发明授权
    Dicing technique for flip-chip USP wafers 失效
    倒装芯片USP晶片的切割技术

    公开(公告)号：US07491581B2

    公开(公告)日：2009-02-17

    申请号：US11615712

    申请日：2006-12-22

    申请人： Jon B. DCamp ,  Harlan L. Curtis

    发明人： Jon B. DCamp ,  Harlan L. Curtis

    IPC分类号： H01L21/00

    CPC分类号： B81C1/00873 ,  B81C2203/0118

    摘要： A method and a fused compound wafer including at least one first MEMS sensor and at least second MEMS sensor includes a first wafer. The first wafer includes at least one first MEMS sensor first subassembly and at least one second MEMS sensor first subassembly. A second wafer includes at least one first MEMS sensor second subassembly, at least one second MEMS sensor second assembly, and a fusing matrix. The fusing matrix includes a first joint configured to encapsulate each of the at least one first MEMS sensor first assembly and each of the at least one first MEMS sensor second assembly forming each at least one first MEMS sensor. A second joint is configured to encapsulate each of the at least one second MEMS first subassembly and each of the at least one second MEMS second subassembly forming each at least one second MEMS sensor.

    摘要翻译： 包括至少一个第一MEMS传感器和至少第二MEMS传感器的方法和融合复合晶片包括第一晶片。 第一晶片包括至少一个第一MEMS传感器第一子组件和至少一个第二MEMS传感器第一子组件。 第二晶片包括至少一个第一MEMS传感器第二子组件，至少一个第二MEMS传感器第二组件和熔丝矩阵。 定影矩阵包括第一接头，其被配置为封装所述至少一个第一MEMS传感器第一组件中的每一个，并且所述至少一个第一MEMS传感器第二组件中的每一个形成每个至少一个第一MEMS传感器。 第二接头被配置为封装所述至少一个第二MEMS第一子组件中的每一个，并且至少一个第二MEMS第二子组件中的每一个形成每个至少一个第二MEMS传感器。

    Injection-molded package for MEMS inertial sensor
    2.
    发明授权
    Injection-molded package for MEMS inertial sensor 失效
    用于MEMS惯性传感器的注塑包装

    公开(公告)号：US07482193B2

    公开(公告)日：2009-01-27

    申请号：US11017521

    申请日：2004-12-20

    申请人： Jon B. DCamp ,  Harlan L. Curtis

    发明人： Jon B. DCamp ,  Harlan L. Curtis

    IPC分类号： H01L21/00

    CPC分类号： B81B7/0038 ,  B81C2203/0154 ,  H01L2224/48091 ,  H01L2224/8592 ,  H01L2924/00014

    摘要： Methods of packaging devices such as MEMS devices are disclosed. An illustrative method of packaging a device in accordance with an illustrative embodiment of the present invention can include the steps of providing a substrate having an device provided therein or thereon, attaching a cap to the substrate and sealing the device within an interior cavity of the capped substrate, inserting the capped substrate into a vacuum chamber and evacuating gasses and/or contaminants contained within the interior cavity, and then injection molding a package about the capped substrate in the vacuum chamber. A number of small-sized openings disposed through the cap can be utilized to create a controlled vacuum pressure within the interior cavity of the device when the device is in the vacuum chamber, prior to injection molding the package about the capped substrate. In some embodiments, an inert gas can be injected into the evacuated interior cavity to create a partial pressure for the inertial sensor, prior to injection molding the package about the capped substrate.

    摘要翻译： 公开了诸如MEMS器件的封装装置的方法。 根据本发明的说明性实施例的包装装置的说明性方法可以包括以下步骤：提供具有设置在其中或其上的装置的基板，将盖附接到基板并将该装置密封在封盖的内部空腔内 衬底，将封盖的衬底插入真空室中并抽空包含在内部空腔内的气体和/或污染物，然后在真空室中围绕封盖的衬底注射成型封装。 当在封装围绕封盖的基板注射成型之前，当装置在真空室中时，可以利用设置穿过盖子的许多小尺寸开口来在装置的内部空腔内产生受控的真空压力。 在一些实施例中，在将封装围绕封盖的衬底注射成型之前，可以将惰性气体注入到抽空的内部空腔中以产生用于惯性传感器的分压。

    DICING TECHNIQUE FOR FLIP-CHIP USP WAFERS
    3.
    发明申请
    DICING TECHNIQUE FOR FLIP-CHIP USP WAFERS 失效
    FLIP-CHIP USP WAFERS的定制技术

    公开(公告)号：US20080150160A1

    公开(公告)日：2008-06-26

    申请号：US11615712

    申请日：2006-12-22

    申请人： Jon B. DCamp ,  Harlan L. Curtis

    发明人： Jon B. DCamp ,  Harlan L. Curtis

    IPC分类号： H01L23/00 ,  H01L21/82

    CPC分类号： B81C1/00873 ,  B81C2203/0118

    摘要： A method and a fused compound wafer including at least one first MEMS sensor and at least second MEMS sensor includes a first wafer. The first wafer includes at least one first MEMS sensor first subassembly and at least one second MEMS sensor first subassembly. A second wafer includes at least one first MEMS sensor second subassembly, at least one second MEMS sensor second assembly, and a fusing matrix. The fusing matrix includes a first joint configured to encapsulate each of the at least one first MEMS sensor first assembly and each of the at least one first MEMS sensor second assembly forming each at least one first MEMS sensor. A second joint is configured to encapsulate each of the at least one second MEMS first subassembly and each of the at least one second MEMS second subassembly forming each at least one second MEMS sensor.

    摘要翻译： 包括至少一个第一MEMS传感器和至少第二MEMS传感器的方法和融合复合晶片包括第一晶片。 第一晶片包括至少一个第一MEMS传感器第一子组件和至少一个第二MEMS传感器第一子组件。 第二晶片包括至少一个第一MEMS传感器第二子组件，至少一个第二MEMS传感器第二组件和熔丝矩阵。 定影矩阵包括第一接头，其被配置为封装所述至少一个第一MEMS传感器第一组件中的每一个，并且所述至少一个第一MEMS传感器第二组件中的每一个形成每个至少一个第一MEMS传感器。 第二接头被配置为封装所述至少一个第二MEMS第一子组件中的每一个，并且至少一个第二MEMS第二子组件中的每一个形成每个至少一个第二MEMS传感器。

    Package for MEMS devices
    4.
    发明授权
    Package for MEMS devices 有权
    MEMS器件封装

    公开(公告)号：US07370530B2

    公开(公告)日：2008-05-13

    申请号：US10931653

    申请日：2004-09-01

    申请人： Jon B. DCamp ,  Harlan L. Curtis

    发明人： Jon B. DCamp ,  Harlan L. Curtis

    IPC分类号： G01N9/12 ,  H01L21/00

    CPC分类号： G01P1/00 ,  B81B7/0074 ,  B81B2201/025 ,  G01C19/56 ,  G01P1/023 ,  H01L2224/16225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2924/1461 ,  H01L2924/00014

    摘要： A package for packaging one or more MEMS devices is disclosed. A package in accordance with an illustrative embodiment of the present invention can include a packaging structure having a base section, a top section, and an interior cavity adapted to contain a number of MEMS devices therein. In some embodiments, the packaging structure can include a first side, a second side, a third side, and a top end, which, in certain embodiments, may form a pinout plane surface that can be used to connect the packaging structure to other external components. In some embodiments, a number of MEMS-type inertial sensors contained within the interior cavity of the packaging structure can be used to detect and measure motion in multiple dimensions, if desired.

    摘要翻译： 公开了一种用于封装一个或多个MEMS器件的封装。 根据本发明的说明性实施例的封装可以包括具有基部，顶部和适于在其中容纳多个MEMS器件的内部空腔的封装结构。 在一些实施例中，包装结构可以包括第一侧，第二侧，第三侧和顶端，在某些实施例中，该顶端可以形成可用于将包装结构连接到其他外部的引脚分布平面 组件。 在一些实施例中，如果需要，包含在包装结构的内部空腔内的多个MEMS型惯性传感器可用于检测和测量多个维度的运动。

    Chip packaging systems and methods
    5.
    发明授权
    Chip packaging systems and methods 有权
    芯片封装系统和方法

    公开(公告)号：US07314777B2

    公开(公告)日：2008-01-01

    申请号：US10988799

    申请日：2004-11-15

    申请人： Jon B. DCamp ,  Harlan L. Curtis ,  Lori A. Dunaway ,  Max C. Glenn

    发明人： Jon B. DCamp ,  Harlan L. Curtis ,  Lori A. Dunaway ,  Max C. Glenn

    IPC分类号： H01L21/50 ,  H01L21/48 ,  H01L21/44 ,  H01L23/12 ,  H05K3/30

    CPC分类号： B81C1/00333 ,  H01L21/50 ,  H01L21/67121 ,  H01L21/67126 ,  Y10T29/53178 ,  Y10T29/53183

    摘要： An automated process for performing MEMS packaging including automatically attaching a die to a chip carrier, resulting in a chip carrier assembly, automatically moving the chip carrier assembly into a vacuum chamber, wherein the vacuum chamber includes one or more lids therein, automatically securing a lid to the chip carrier assembly within the vacuum chamber, thereby forming a packaged die, and automatically removing the packaged die from the vacuum chamber. Unique vacuum chambers suitable for MEMS packaging are also disclosed.

    摘要翻译： 一种用于执行MEMS封装的自动化过程，包括将芯片自动附接到芯片载体，导致芯片载体组件，自动将芯片载体组件移动到真空室中，其中真空室包括一个或多个盖，自动固定盖 到真空室内的芯片载体组件，从而形成封装的模具，并自动从真空室中移除封装的模具。 还公开了适用于MEMS封装的独特真空室。

    Methods and apparatus for particle reduction in MEMS devices
    6.
    发明授权
    Methods and apparatus for particle reduction in MEMS devices 失效
    MEMS器件中颗粒减少的方法和装置

    公开(公告)号：US07297573B2

    公开(公告)日：2007-11-20

    申请号：US11280040

    申请日：2005-11-16

    申请人： Jon B. DCamp ,  Harlan L. Curtis ,  Lori A. Dunaway ,  Max C. Glenn

    发明人： Jon B. DCamp ,  Harlan L. Curtis ,  Lori A. Dunaway ,  Max C. Glenn

    IPC分类号： H01L23/12

    CPC分类号： B81B7/0038 ,  G01C19/5719 ,  G01P1/023

    摘要： A method for assembling a micro-electromechanical system (MEMS) device that includes a micro-machine is described. The method comprises forming the micro-machine on a die, the die having a top surface and a bottom surface, providing a plurality of die bonding pedestals on a surface of a housing, and mounting at least one of the top surface of the die and components of the micro-machine to the die bonding pedestals such that a bottom surface of the die at least partially shields components of the micro-machine from loose gettering material.

    摘要翻译： 描述了一种用于组装包括微型机器的微机电系统（MEMS）装置的方法。 该方法包括在模具上形成微机器，模具具有顶表面和底表面，在壳体的表面上提供多个芯片接合基座，并且安装模具的顶表面中的至少一个和 微型机器的组件到模具接合基座，使得模具的底表面至少部分地将微机器的部件屏蔽松散的吸气材料。

    SYSTEM AND METHOD FOR SEALING A MEMS DEVICE
    8.
    发明申请
    SYSTEM AND METHOD FOR SEALING A MEMS DEVICE 有权
    用于密封MEMS器件的系统和方法

    公开(公告)号：US20080188035A1

    公开(公告)日：2008-08-07

    申请号：US11672348

    申请日：2007-02-07

    申请人： Bryan R. Seppala ,  Harlan L. Curtis ,  Jon B. DCamp ,  Richard K. Spielberger

    发明人： Bryan R. Seppala ,  Harlan L. Curtis ,  Jon B. DCamp ,  Richard K. Spielberger

    IPC分类号： H01L21/00

    CPC分类号： B81B7/0041 ,  B81C2203/0109 ,  B81C2203/019 ,  B81C2203/036 ,  H01L2224/48227 ,  H01L2924/01322 ,  H01L2924/1461 ,  H01L2924/15153 ,  H01L2924/15321 ,  H01L2924/16195 ,  H01L2924/00

    摘要： A method for assembling a hermetically sealed package to contain a MEMS die and the hermetically sealed package are presented. The method includes selectively applying a glass mixture to a dome. The dome is heated to a first temperature sufficient to flow the glass mixture. The dome is pressed into contact with a carrier containing the MEMS device, the pressing being maintained at a pressure and for a temporal interval sufficient to flow the glass mixture onto the carrier. The dome is cooled while maintaining contact with the carrier, to a second temperature sufficient to allow the glass mixture to harden into a glass frit thereby to seal the carrier to the dome. The glass frit has a seal width.

    摘要翻译： 提出了一种用于组装气密封装以容纳MEMS管芯和密封封装的方法。 该方法包括选择性地将玻璃混合物施加到圆顶。 将圆顶加热至足以使玻璃混合物流动的第一温度。 将圆顶压制成与包含MEMS器件的载体接触，该压制保持在足以将玻璃混合物流动到载体上的压力和时间间隔。 圆顶被冷却，同时保持与载体的接触，达到足以使玻璃混合物硬化到玻璃料中的第二温度，从而将载体密封到圆顶。 玻璃料具有密封宽度。

    MEMS device packaging methods
    10.
    发明授权
    MEMS device packaging methods 有权
    MEMS器件封装方法

    公开(公告)号：US07491567B2

    公开(公告)日：2009-02-17

    申请号：US11164449

    申请日：2005-11-22

    申请人： Jon B. DCamp ,  Harlan L. Curtis

    发明人： Jon B. DCamp ,  Harlan L. Curtis

    IPC分类号： H01L21/00 ,  H01L21/50 ,  H01L21/48 ,  H01L21/44 ,  H01L29/84 ,  H01L29/82 ,  H01L27/14

    CPC分类号： B81C1/00285 ,  B81B2201/0235 ,  B81C2203/019 ,  H01L2924/15192

    摘要： A method of packaging a MEMS device that includes, for example, the steps of providing a MEMS die that has a MEMS device, a seal ring and bond pads disposed thereon, providing a MEMS package that has a recess, a seal ring and bond pads disposed thereon, positioning the MEMS die over the MEMS package to align the seal rings and bond pads, inserting the MEMS die and MEMS package into a vacuum chamber and evacuating gasses therefrom to form a controlled vacuum pressure therein, sealing the MEMS package and the MEMS die together at the seal rings to form a package having a hermitically sealed interior chamber and simultaneously forming electrical connections between the corresponding bond pads.

    摘要翻译： 一种封装MEMS器件的方法，其包括例如提供具有MEMS器件的MEMS管芯，密封环和设置在其上的接合焊盘的步骤，提供具有凹部，密封环和接合焊盘的MEMS封装 将MEMS管芯定位在MEMS封装上以使密封环和接合焊盘对准，将MEMS管芯和MEMS封装插入真空室并从其中排出气体以在其中形成受控的真空压力，密封MEMS封装和MEMS 在密封环处一起模制，以形成具有密封密封的内部腔室并且同时形成相应接合垫之间的电连接的包装。