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    Dark field imaging defect inspection system for repetitive pattern integrated circuits
    1.
    发明授权
    Dark field imaging defect inspection system for repetitive pattern integrated circuits 失效
    用于重复图案集成电路的暗场成像缺陷检查系统

    公开(公告)号：US5177559A

    公开(公告)日：1993-01-05

    申请号：US701936

    申请日：1991-05-17

    Applicant: John S. Batchelder ,  Marc A. Taubenblatt

    Inventor： John S. Batchelder ,  Marc A. Taubenblatt

    IPC: G01B11/24 ,  G01N21/88 ,  G01N21/94 ,  G01N21/956 ,  H01L21/66

    CPC classification number: G02B21/10 ,  G01N21/95623 ,  G01N2021/8822

    Abstract: An optical inspection system for patterned semiconductor wafers generates a dark field image of the wafer by applying a collimated beam of monochrome light at an incident angle with respect to the surface of the wafer of between 8.degree. and a maximum angle defined by the numerical aperture of the imaging system and collecting the light which is scattered at angles approximately normal to the surface of the wafer and within the numerical aperture of the imaging system. In addition, the incident light is at an angle of 45.degree. in the surface plane of the wafer with respect to the rectangular lines which predominate in the pattern. Before forming the dark field image, the collected light is passed through a Fourier transform filter which substantially attenuates spatial frequency components corresponding to the pattern. In the resultant dark field image, defects in the pattern and contaminating particles are accentuated relative to the pattern features.

    Abstract translation: 用于图案化半导体晶片的光学检查系统通过以相对于晶片表面的入射角施加8°的准直光束和由数字孔径的数值孔径限定的最大角度来施加晶片的暗视场图像 成像系统并收集以大致垂直于晶片表面并且在成像系统的数值孔径内散射的光。 此外，入射光在晶片的表面平面上相对于以图案为主的矩形线成45度的角度。 在形成暗场图像之前，所收集的光通过傅里叶变换滤波器，该滤波器基本上衰减对应于图案的空间频率分量。 在所得到的暗场图像中，图案和污染颗粒中的缺陷相对于图案特征被加强。

    System for automatic inspection of periodic patterns
    4.
    发明授权
    System for automatic inspection of periodic patterns 失效
    定期模式自动检查系统

    公开(公告)号：US4771468A

    公开(公告)日：1988-09-13

    申请号：US853100

    申请日：1986-04-17

    Applicant: John S. Batchelder ,  Raymond E. Bonner ,  Byron E. Dom ,  Robert S. Jaffe

    Inventor： John S. Batchelder ,  Raymond E. Bonner ,  Byron E. Dom ,  Robert S. Jaffe

    IPC: H01L21/66 ,  G01B11/24 ,  G01B11/25 ,  G01N21/88 ,  G01N21/956 ,  G06T1/00 ,  G06T7/00 ,  G06K9/00

    CPC classification number: G06T7/001 ,  G03F7/7065 ,  G06T2207/30141 ,  G06T2207/30148

    Abstract: A method and apparatus for automatic inspection of periodic patterns typically found on patterned silicon wafers, printed circuit board, and the like is disclosed herein. The method comprises an inspection algorithm of two parts: a low-level algorithm and a higher level algorithm which includes, therein the operation of the low-level algorithm. The low-level algorithm utilizes the known periodicity of the pattern to find defects by comparing identical cells in the periodic array. The high-level algorithm comprises applying the low-level algorithm, some number of times (N) in succession on the image. An accumulator image is formed by adding the results of the low-level algorithm to create a separate image array where the pixels relate to the number of times that the pixel in the original image was detected as defective by the low-level algorithm.The apparatus for implementing the above method comprises a parallel/pipeline architecture for high speed processing and RAM LUT's to implement a plurality of subtract and compare functions.

    Abstract translation: 本文公开了用于自动检查在图案化硅晶片，印刷电路板等上通常发现的周期性图案的方法和装置。 该方法包括两部分的检查算法：低级算法和较高级算法，其中包括低级算法的操作。 低级算法利用已知的周期性模式来通过比较周期性阵列中的相同单元来找到缺陷。 高级算法包括在图像上连续应用一些次数（N）的低级算法。 通过将低级算法的结果相加以产生单独的图像阵列形成累加器图像，其中像素与原始图像中的像素被低级算法检测为缺陷的次数相关。 用于实现上述方法的装置包括用于高速处理的并行/流水线架构和RAM LUT以实现多个减法和比较功能。

    Method for controlled porosity three-dimensional modeling
    5.
    发明授权
    Method for controlled porosity three-dimensional modeling 失效
    控制孔隙度三维建模方法

    公开(公告)号：US5653925A

    公开(公告)日：1997-08-05

    申请号：US533793

    申请日：1995-09-26

    Applicant: John S. Batchelder

    Inventor： John S. Batchelder

    IPC: B22C7/02 ,  B29C47/00 ,  B29C67/00 ,  B29C41/02

    CPC classification number: B29C67/0059 ,  B29K2105/04

    Abstract: A method of making a three dimensional object by depositing material in a predetermined pattern on a receiving surface, and introducing a predetermined porosity into the object being formed by positioning the deposited material so as to introduce pockets of air or other fluid into the part, and by adjusting the rate at which the material is dispensed from the dispenser. Optimal porosities in the object to be built depend upon the shape of the material when it is dispensed, but range generally from 1% to 26%.

    Abstract translation: 一种通过在接收表面上以预定图案沉积材料制成三维物体的方法，并通过定位沉积的材料将预定的孔隙率引入到形成的物体中，以将空气或其它流体的袋子引入到该部件中，以及 通过调节从分配器分配材料的速率。 待建造的物体中的最佳孔隙度取决于材料分配时的形状，但范围通常为1％至26％。

    Generation of ionized air for semiconductor chips
    6.
    发明授权
    Generation of ionized air for semiconductor chips 失效
    生成半导体芯片的电离空气

    公开(公告)号：US5316970A

    公开(公告)日：1994-05-31

    申请号：US895181

    申请日：1992-06-05

    Applicant: John S. Batchelder ,  Vaughn P. Gross ,  Robert A. Gruver ,  Philip C. D. Hobbs ,  Kenneth D. Murray

    Inventor： John S. Batchelder ,  Vaughn P. Gross ,  Robert A. Gruver ,  Philip C. D. Hobbs ,  Kenneth D. Murray

    IPC: B01J19/00 ,  B01J19/12 ,  H01L21/00 ,  H01L21/304 ,  H05F3/06

    CPC classification number: H01L21/67028 ,  H05F3/06 ,  Y10S430/138 ,  Y10S438/909

    Abstract: Ionization of air without the use of corona discharge tips, thereby to avoid the generation of particulates from corrosion of the corona tips, is accomplished by use of a laser beam focussed to a small focal volume of intense electric field adjacent a semiconductor chip. The electric field is sufficiently intense to ionize air. In the manufacture of a semiconductor circuit chip, during those steps which are conducted in an air environment, opportunity exists to remove from a surface of a chip, or wafer, charge acquired during the manufacturing process. The ionized air is passed along the chip surface. Ions in the air discharge local regions of the chip surface which have become charged by steps of a manufacturing process. By way of further embodiment of the invention, the ionization may be produced by injection of molecules of water into the air, which molecules are subsequently ionized by a laser beam and directed toward the chip via a light shield with the aid of a magnetic field.

    Abstract translation: 通过使用聚焦于与半导体芯片相邻的强电场的小焦点体积的激光束来实现空气的离子化，而不使用电晕放电尖端，从而避免由于电晕尖端的腐蚀而产生微粒。 电场足够强以使空气电离。 在半导体电路芯片的制造中，在空气环境中进行的那些步骤中，存在从制造过程中获取的芯片或晶片的表面去除电荷的机会。 电离空气沿芯片表面通过。 芯片表面的空气放电局部区域中的离子通过制造过程的步骤而被充电。 通过本发明的进一步的实施方式，电离可以通过将水分子注入到空气中来产生，该分子随后通过激光束被电离，并借助于磁场通过光屏指向芯片。

    Optical submicron aerosol particle detector
    7.
    发明授权
    Optical submicron aerosol particle detector 失效
    光学亚微米气溶胶颗粒检测器

    公开(公告)号：US5294806A

    公开(公告)日：1994-03-15

    申请号：US17214

    申请日：1993-02-12

    Applicant: John S. Batchelder ,  Donald M. DeCain ,  Philip C. D. Hobbs

    Inventor： John S. Batchelder ,  Donald M. DeCain ,  Philip C. D. Hobbs

    IPC: G01N15/10 ,  G01N15/02 ,  G01N15/14 ,  G01N21/21 ,  G01N21/47 ,  G01N21/94 ,  G01N15/06

    CPC classification number: G01N15/0205 ,  G01N21/94 ,  G01N15/1434 ,  G01N2015/0238 ,  G01N2015/145

    Abstract: A particle detector that determines the presence of particles in an enclosed volume includes a laser that directs an optical beam to a beam splitter that produces first and second beams. An optical system directs the first beam into the enclosed volume. A detector is positioned adjacent the volume in order to receive back scattered optical energy arising from a particle in the volume encountering the first beam. The back scattered optical energy and the second beam are optically combined so as to overlap in a region and in the overlap region the back scattered optical energy and second beam are in the same state of focus, of the same polarization and are substantially parallel. A detector located at the overlap region produces an electrical signal indicative of the intensity of the back scattered light. A signal processor analyzes the electrical signal to determine the presence of the particle.

    Abstract translation: 确定封闭体积中颗粒的存在的粒子检测器包括将光束引导到产生第一和第二光束的分束器的激光器。 光学系统将第一光束引导到封闭的体积中。 检测器邻近体积定位，以便接收从遇到第一光束的体积中的颗粒产生的反向散射的光能。 后散射光能和第二光束被光学组合以便在区域中重叠，并且在重叠区域中，后散射光能和第二光束处于相同偏振的相同聚焦状态并且基本平行。 位于重叠区域的检测器产生指示背散射光强度的电信号。 信号处理器分析电信号以确定颗粒的存在。

    Semiconductor wafer surface inspection apparatus and method
    8.
    发明授权
    Semiconductor wafer surface inspection apparatus and method 失效
    半导体晶圆表面检测装置及方法

    公开(公告)号：US4740708A

    公开(公告)日：1988-04-26

    申请号：US719

    申请日：1987-01-06

    Applicant: John S. Batchelder

    Inventor： John S. Batchelder

    IPC: H01L21/66 ,  G01N21/88 ,  G01N21/94 ,  G01N21/95 ,  G01N21/956

    CPC classification number: G01N21/94 ,  G01N2021/8867 ,  G01N21/9501 ,  G01N2201/0655

    Abstract: A system and procedure for the inspection of the surface of a semiconductor wafer ascertains that particulate contaminants have been adequately cleaned from the surface during the manufacture of integrated electric circuits. The wafer is advanced in a first direction and is optically scanned in a second direction, transverse to the first direction, for recording intensities of light reflected normally from the wafer surface as a function of location on the scan line. A high intensity reflection is indicative of a smooth flat surface suitable for inspection of particles by an integrating hemisphere with plural photodetectors therein. A weak reflection is indicative of undulations and patterned regions which are unfavorable for examination of particles on the wafer surface. A second scan is offset sideways to compensate for motion of the wafer so as to rescan the same line as the first scan. The photodetectors in the integrating sphere are gated on and off during the second scan at the locations of suitable inspection sites determined from the first scan.

    Volumetric feed control for flexible filament
    9.
    发明授权
    Volumetric feed control for flexible filament 失效
    柔性灯丝的体积进料控制

    公开(公告)号：US6085957A

    公开(公告)日：2000-07-11

    申请号：US629268

    申请日：1996-04-08

    Applicant: Robert L. Zinniel ,  John S. Batchelder

    Inventor： Robert L. Zinniel ,  John S. Batchelder

    IPC: B65H51/30 ,  B65H63/08 ,  G05D7/06 ,  B65H20/00 ,  B23Q15/00

    CPC classification number: B29C67/0055 ,  B65H51/30 ,  B65H63/08 ,  G05D7/0605 ,  B65H2511/14 ,  B65H2513/10 ,  B65H2701/31

    Abstract: A volumetric feed control apparatus for a build material element such as a filament used in a three-dimensional modeling machine having an application tip includes a pair of feed rollers feeding the filament to the application tip, and a sensor or sensor system feeding information to a central processing unit that continuously computes the effective cross section of the filament using the signals received from the sensor or sensor system. The central processing unit controls the speed of a DC servo or stepper motor which in turn rotates the feed rollers to advance the filament toward the application tip of the modeling machine. The central processing unit adjusts the speed of the feed rollers to supply a constant flow rate of material to the application tip. Alternatively, the sensor system can be incorporated into the feed rollers, eliminating the need for further space constraints.

    Abstract translation: 用于具有应用尖端的三维建模机中使用的诸如用于构造材料的构件材料元件的体积进料控制装置包括将丝线馈送到施加尖端的一对进给辊，以及将信息馈送到 中央处理单元，其使用从传感器或传感器系统接收的信号连续计算灯丝的有效截面。 中央处理单元控制直流伺服或步进电机的速度，该伺服或步进电机又使进给辊转动，以将纤维推向建模机的应用端。 中央处理单元调节进给辊的速度，以向应用尖端提供恒定的材料流速。 或者，传感器系统可以结合到进料辊中，从而不需要进一步的空间限制。

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