OPTICAL PROXIMITY CORRECTION METHOD
    1.
    发明申请
    OPTICAL PROXIMITY CORRECTION METHOD 有权
    光临近度校正方法

    公开(公告)号:US20060183031A1

    公开(公告)日:2006-08-17

    申请号:US11380192

    申请日:2006-04-25

    IPC分类号: G03C5/00 G03F1/00

    CPC分类号: G03F1/36 G03F1/26

    摘要: An integrated circuit layout includes dense figures and at least one isolated figure. A plurality of dummy patterns are formed to surround the isolated figure, so as to reduce the difference in pattern density of the integrated circuit layout. A transmitted light of the dummy patterns provides a phase difference of 0 or 180 degrees relative to a transmitted light of the integrated circuit layout. The integrated circuit layout and the plurality of dummy patterns are formed on a photo-mask.

    摘要翻译: 集成电路布局包括密集图形和至少一个独立的图形。 形成多个虚拟图形以围绕隔离图,以便减小集成电路布局的图案密度的差异。 伪图案的透射光相对于集成电路布局的透射光提供0或180度的相位差。 集成电路布局和多个虚拟图案形成在光掩模上。

    Optical proximity correction method
    2.
    发明授权
    Optical proximity correction method 有权
    光学邻近校正方法

    公开(公告)号:US07063923B2

    公开(公告)日:2006-06-20

    申请号:US10711198

    申请日:2004-09-01

    IPC分类号: G03F9/00

    CPC分类号: G03F1/36 G03F1/26

    摘要: An integrated circuit layout includes dense figures and at least one isolated figure. A plurality of dummy patterns are formed to surround the isolated figure, so as to reduce the difference in pattern density of the integrated circuit layout. A transmitted light of the dummy patterns provides a phase difference of 0 or 180 degrees relative to a transmitted light of the integrated circuit layout. The integrated circuit layout and the plurality of dummy patterns are formed on a photo-mask.

    摘要翻译: 集成电路布局包括密集图形和至少一个独立的图形。 形成多个虚拟图形以围绕隔离图,以便减小集成电路布局的图案密度的差异。 伪图案的透射光相对于集成电路布局的透射光提供0或180度的相位差。 集成电路布局和多个虚拟图案形成在光掩模上。

    Correcting the polygon feature pattern with an optical proximity correction method
    3.
    发明授权
    Correcting the polygon feature pattern with an optical proximity correction method 有权
    用光学邻近校正方法校正多边形特征图案

    公开(公告)号:US06767679B2

    公开(公告)日:2004-07-27

    申请号:US10037132

    申请日:2002-01-02

    IPC分类号: G03F900

    摘要: The present invention is provided a method to use a pattern section without extra serif to correct the polygon feature pattern with at least one inner corner. Such that the polygon feature pattern with at least one inner corner can achieve effectively OPC (optical proximity correction) without adding any extra data point. Therefore, the present invention can instead of the conventional serif and achieves the effective OPC. In addition, the mask writing time is also improved since the original feature pattern is divided into a few rectangular-shaped mask writing units or trapeze-shaped mask writing units for regular mask writing, and the inner corner is/are not in the middle of each divided mask writing units. The mask inspection is also simplified and easier to calibration since a simple geometry other than complex serif is used.

    摘要翻译: 本发明提供了一种使用没有额外内衬的图案部分来校正具有至少一个内角的多边形特征图案的方法。 使得具有至少一个内角的多边形特征图案可以有效地实现OPC(光学邻近校正),而不增加任何额外的数据点。 因此,本发明可以代替常规的衬线并实现有效的OPC。 此外,由于原始特征图案被分成几个矩形掩模写入单元或用于规则掩模写入的四叶形掩模写入单元,并且内角不在中间 每个划分面具书写单位。 掩模检查也被简化并且更容易校准,因为使用除了复杂衬线之外的简单几何形状。

    Optical proximity correction method
    4.
    发明授权
    Optical proximity correction method 有权
    光学邻近校正方法

    公开(公告)号:US07297450B2

    公开(公告)日:2007-11-20

    申请号:US11380192

    申请日:2006-04-25

    IPC分类号: G03F9/00

    CPC分类号: G03F1/36 G03F1/26

    摘要: An integrated circuit layout includes dense figures and at least one isolated figure. A plurality of dummy patterns are formed to surround the isolated figure, so as to reduce the difference in pattern density of the integrated circuit layout. A transmitted light of the dummy patterns provides a phase difference of 0 or 180 degrees relative to a transmitted light of the integrated circuit layout. The integrated circuit layout and the plurality of dummy patterns are formed on a photo-mask.

    摘要翻译: 集成电路布局包括密集图形和至少一个独立的图形。 形成多个虚拟图形以围绕隔离图,以便减小集成电路布局的图案密度的差异。 伪图案的透射光相对于集成电路布局的透射光提供0或180度的相位差。 集成电路布局和多个虚拟图案形成在光掩模上。

    OPTICAL PROXIMITY CORRECTION METHOD
    5.
    发明申请
    OPTICAL PROXIMITY CORRECTION METHOD 有权
    光临近度校正方法

    公开(公告)号:US20050009344A1

    公开(公告)日:2005-01-13

    申请号:US10711198

    申请日:2004-09-01

    CPC分类号: G03F1/36 G03F1/26

    摘要: An integrated circuit layout includes dense figures and at least one isolated figure. A plurality of dummy patterns are formed to surround the isolated figure, so as to reduce the difference in pattern density of the integrated circuit layout. A transmitted light of the dummy patterns provides a phase difference of 0 or 180 degrees relative to a transmitted light of the integrated circuit layout. The integrated circuit layout and the plurality of dummy patterns are formed on a photo-mask.

    摘要翻译: 集成电路布局包括密集图形和至少一个独立的图形。 形成多个虚拟图形以围绕隔离图,以便减小集成电路布局的图案密度的差异。 伪图案的透射光相对于集成电路布局的透射光提供0或180度的相位差。 集成电路布局和多个虚拟图案形成在光掩模上。

    Optical proximity correction of pattern on photoresist through spacing of sub patterns
    6.
    发明授权
    Optical proximity correction of pattern on photoresist through spacing of sub patterns 有权
    通过子图案的间隔对光致抗蚀剂上的图案进行光学邻近校正

    公开(公告)号:US06613485B2

    公开(公告)日:2003-09-02

    申请号:US10045432

    申请日:2002-01-11

    IPC分类号: G03F900

    CPC分类号: G03F1/36 Y10S430/143

    摘要: An optical proximity correction method for rectifying pattern on photoresist. Line pattern of integrated circuit is divided into L-shape regions or T-shaped regions. The L-shaped or T-shaped regions are further dissected into rectangular patches. Area of each rectangular patch is suitably reduced and reproduced onto a photomask. The photomask is used to form a corrected photoresist pattern.

    摘要翻译: 一种用于在光致抗蚀剂上整流图案的光学邻近校正方法。 集成电路的线路图案分为L形区域或T形区域。 L形或T形区域进一步分解成矩形斑块。 每个矩形贴片的面积被适当地减小并再现到光掩模上。 光掩模用于形成校正的光致抗蚀剂图案。

    [METHOD OF RELIEVING WAFER STRESS]
    7.
    发明申请
    [METHOD OF RELIEVING WAFER STRESS] 有权
    [消除压应力的方法]

    公开(公告)号:US20060024921A1

    公开(公告)日:2006-02-02

    申请号:US10710662

    申请日:2004-07-27

    申请人: Jui-Tsen Huang

    发明人: Jui-Tsen Huang

    IPC分类号: H01L21/46

    摘要: A method of relieving wafer stress is provided. A wafer is provided, wherein at least a dielectric layer has already formed over the wafer and the wafer has a first and a second area. At least no circuits are formed on the dielectric layer within the first area. Thereafter, openings are formed in the dielectric layer within the first area. A material layer is formed over the dielectric layer. Thus, pits are formed on the surface of the material layer at locations above the openings. Through the pits on the material layer, stress within the material layer is relieved and hence the amount of stress conferred to the wafer is reduced.

    摘要翻译: 提供了一种减轻晶片应力的方法。 提供晶片,其中已经在晶片上形成至少一个电介质层,并且晶片具有第一和第二区域。 在第一区域内的电介质层上至少不形成电路。 此后,在第一区域内的电介质层中形成开口。 在电介质层上形成材料层。 因此,在开口上方的位置处,在材料层的表面上形成凹坑。 通过材料层上的凹坑,材料层内的应力得以缓解,因此赋予晶片的应力量减少。

    Multi-step spacer formation of semiconductor devices
    8.
    发明授权
    Multi-step spacer formation of semiconductor devices 有权
    半导体器件的多步间隔物形成

    公开(公告)号:US06242334B1

    公开(公告)日:2001-06-05

    申请号:US09274597

    申请日:1999-03-23

    IPC分类号: H01L213205

    摘要: A method for forming a semiconductor with overetched spacer is disclosed. The method includes firstly providing a semiconductor substrate with a gate oxide layer formed thereon, and forming a polysilicon layer on the gate oxide layer. Next, a photoresist layer is formed on the polysilicon layer to define a gate area, followed by anisotropically etching the polysilicon layer and the gate oxide layer. A first dielectric layer is conformably formed, and a second dielectric layer is then formed thereon. After anisotropically etching the second dielectric layer to form a first sidewall spacer on the sidewall of the first dielectric layer, a third dielectric layer is further formed over the exposed first dielectric layer and the first sidewall spacer. Finally, the third dielectric layer and the first sidewall spacer are anisotropically etched so that a second sidewall spacer is formed on the sidewall of the first sidewall spacer, wherein top surface of the first and the second sidewall spacer is below top surface of the first dielectric layer around the gate area.

    摘要翻译: 公开了一种用椭圆形间隔物形成半导体的方法。 该方法包括首先提供其上形成有栅极氧化物层的半导体衬底,并在栅极氧化物层上形成多晶硅层。 接下来,在多晶硅层上形成光致抗蚀剂层以限定栅极区域,然后各向异性蚀刻多晶硅层和栅极氧化物层。 顺应地形成第一电介质层,然后在其上形成第二电介质层。 在各向异性蚀刻第二电介质层以在第一介电层的侧壁上形成第一侧壁间隔物之后,在暴露的第一介电层和第一侧壁间隔物上进一步形成第三电介质层。 最后,第三介电层和第一侧壁间隔物被各向异性地蚀刻,使得第二侧壁间隔物形成在第一侧壁间隔物的侧壁上,其中第一和第二侧壁间隔物的顶表面在第一电介质的顶表面下方 层围绕门区。

    ELECTRONIC DEVICE
    9.
    发明申请
    ELECTRONIC DEVICE 审中-公开
    电子设备

    公开(公告)号:US20100103611A1

    公开(公告)日:2010-04-29

    申请号:US12534859

    申请日:2009-08-04

    IPC分类号: H05K7/00

    摘要: An electronic device having a touching function, including a touching region, a housing, a touch module, and a switch module is provided. The touching region is performing the touching function. The touching region is located over the housing. The touch module is disposed in the housing in correspondence with the touching region. The switch module includes at least one switch and is disposed under the touch module. The touch module is bent under force to turn on the switch when the touching region is touched.

    摘要翻译: 提供具有触摸功能的电子设备,包括触摸区域,外壳,触摸模块和开关模块。 触摸区域正在执行触摸功能。 触摸区域位于外壳上方。 触摸模块与触摸区域对应地设置在壳体中。 开关模块包括至少一个开关并设置在触摸模块下方。 当触摸区域被触摸时,触摸模块在力下弯曲以打开开关。

    METHOD OF FORMING AN ULTRAVIOLET CURABLE PAINT COATING AND COATING METHOD USING AN ULTRAVIOLET CURABLE PAINT
    10.
    发明申请
    METHOD OF FORMING AN ULTRAVIOLET CURABLE PAINT COATING AND COATING METHOD USING AN ULTRAVIOLET CURABLE PAINT 审中-公开
    使用超紫外线固化涂料形成超紫外线固化涂料和涂料方法的方法

    公开(公告)号:US20090317560A1

    公开(公告)日:2009-12-24

    申请号:US12549342

    申请日:2009-08-27

    IPC分类号: C08J7/18 C08J3/28

    CPC分类号: C09D1/00 C08K5/5419 C09D7/63

    摘要: A method of forming an ultraviolet curable paint coating is provided. First, an ultraviolet curable paint composition is formed by mixing, based on 100 parts by weight of the ultraviolet curable paint composition, 1 to 10 parts by weight of a photo-initiator, 5 to 20 parts by weight of an organosilane compound, 5 to 30 parts by weight of a binding agent, 0.1 to 15 parts by weight of a catalyst, and an ultraviolet curable resin, wherein a number of the functional group of the binding agent is more than that of the organosilane compound. Thereafter, a sub coating is formed by using the ultraviolet curable paint composition, and an ultraviolet curable paint coating is then formed by contacting the sub coating with a paint, wherein the unreacted hydroxyls of the sub coating react with the paint to facilitate the paint to adhere to a surface of the sub coating.

    摘要翻译: 提供了形成紫外线固化涂料的方法。 首先,通过将100重量份的紫外线固化性涂料组合物,1〜10重量份的光引发剂,5〜20重量份的有机硅烷化合物,5〜5重量份, 30重量份的粘合剂,0.1〜15重量份的催化剂和紫外线固化性树脂,其中粘合剂的官能团数多于有机硅烷化合物的官能团数。 此后,通过使用紫外线固化涂料组合物形成副涂层,然后通过使副涂层与涂料接触而形成紫外线固化涂料涂层,其中副涂层的未反应羟基与涂料反应以促进涂料 粘附在底层的表面上。