摘要:
An integrated circuit layout includes dense figures and at least one isolated figure. A plurality of dummy patterns are formed to surround the isolated figure, so as to reduce the difference in pattern density of the integrated circuit layout. A transmitted light of the dummy patterns provides a phase difference of 0 or 180 degrees relative to a transmitted light of the integrated circuit layout. The integrated circuit layout and the plurality of dummy patterns are formed on a photo-mask.
摘要:
An integrated circuit layout includes dense figures and at least one isolated figure. A plurality of dummy patterns are formed to surround the isolated figure, so as to reduce the difference in pattern density of the integrated circuit layout. A transmitted light of the dummy patterns provides a phase difference of 0 or 180 degrees relative to a transmitted light of the integrated circuit layout. The integrated circuit layout and the plurality of dummy patterns are formed on a photo-mask.
摘要:
The present invention is provided a method to use a pattern section without extra serif to correct the polygon feature pattern with at least one inner corner. Such that the polygon feature pattern with at least one inner corner can achieve effectively OPC (optical proximity correction) without adding any extra data point. Therefore, the present invention can instead of the conventional serif and achieves the effective OPC. In addition, the mask writing time is also improved since the original feature pattern is divided into a few rectangular-shaped mask writing units or trapeze-shaped mask writing units for regular mask writing, and the inner corner is/are not in the middle of each divided mask writing units. The mask inspection is also simplified and easier to calibration since a simple geometry other than complex serif is used.
摘要:
An integrated circuit layout includes dense figures and at least one isolated figure. A plurality of dummy patterns are formed to surround the isolated figure, so as to reduce the difference in pattern density of the integrated circuit layout. A transmitted light of the dummy patterns provides a phase difference of 0 or 180 degrees relative to a transmitted light of the integrated circuit layout. The integrated circuit layout and the plurality of dummy patterns are formed on a photo-mask.
摘要:
An integrated circuit layout includes dense figures and at least one isolated figure. A plurality of dummy patterns are formed to surround the isolated figure, so as to reduce the difference in pattern density of the integrated circuit layout. A transmitted light of the dummy patterns provides a phase difference of 0 or 180 degrees relative to a transmitted light of the integrated circuit layout. The integrated circuit layout and the plurality of dummy patterns are formed on a photo-mask.
摘要:
An optical proximity correction method for rectifying pattern on photoresist. Line pattern of integrated circuit is divided into L-shape regions or T-shaped regions. The L-shaped or T-shaped regions are further dissected into rectangular patches. Area of each rectangular patch is suitably reduced and reproduced onto a photomask. The photomask is used to form a corrected photoresist pattern.
摘要:
A method of relieving wafer stress is provided. A wafer is provided, wherein at least a dielectric layer has already formed over the wafer and the wafer has a first and a second area. At least no circuits are formed on the dielectric layer within the first area. Thereafter, openings are formed in the dielectric layer within the first area. A material layer is formed over the dielectric layer. Thus, pits are formed on the surface of the material layer at locations above the openings. Through the pits on the material layer, stress within the material layer is relieved and hence the amount of stress conferred to the wafer is reduced.
摘要:
A method for forming a semiconductor with overetched spacer is disclosed. The method includes firstly providing a semiconductor substrate with a gate oxide layer formed thereon, and forming a polysilicon layer on the gate oxide layer. Next, a photoresist layer is formed on the polysilicon layer to define a gate area, followed by anisotropically etching the polysilicon layer and the gate oxide layer. A first dielectric layer is conformably formed, and a second dielectric layer is then formed thereon. After anisotropically etching the second dielectric layer to form a first sidewall spacer on the sidewall of the first dielectric layer, a third dielectric layer is further formed over the exposed first dielectric layer and the first sidewall spacer. Finally, the third dielectric layer and the first sidewall spacer are anisotropically etched so that a second sidewall spacer is formed on the sidewall of the first sidewall spacer, wherein top surface of the first and the second sidewall spacer is below top surface of the first dielectric layer around the gate area.
摘要:
An electronic device having a touching function, including a touching region, a housing, a touch module, and a switch module is provided. The touching region is performing the touching function. The touching region is located over the housing. The touch module is disposed in the housing in correspondence with the touching region. The switch module includes at least one switch and is disposed under the touch module. The touch module is bent under force to turn on the switch when the touching region is touched.
摘要:
A method of forming an ultraviolet curable paint coating is provided. First, an ultraviolet curable paint composition is formed by mixing, based on 100 parts by weight of the ultraviolet curable paint composition, 1 to 10 parts by weight of a photo-initiator, 5 to 20 parts by weight of an organosilane compound, 5 to 30 parts by weight of a binding agent, 0.1 to 15 parts by weight of a catalyst, and an ultraviolet curable resin, wherein a number of the functional group of the binding agent is more than that of the organosilane compound. Thereafter, a sub coating is formed by using the ultraviolet curable paint composition, and an ultraviolet curable paint coating is then formed by contacting the sub coating with a paint, wherein the unreacted hydroxyls of the sub coating react with the paint to facilitate the paint to adhere to a surface of the sub coating.