公开(公告)号：US20100168061A1

公开(公告)日：2010-07-01

申请号：US12524182

申请日：2007-05-09

申请人： Jin Hee Park ,  Sang Hoon Song ,  Kang Pyo Lee

发明人： Jin Hee Park ,  Sang Hoon Song ,  Kang Pyo Lee

IPC分类号： A61K31/718 ,  C12P19/18 ,  A61P3/04 ,  A61P3/10

CPC分类号： C12P19/04 ,  C12P19/16 ,  C12P19/18 ,  C12P19/22

摘要： The present invention relates to a method for preparing enzymatically highly branched-amylose and amylopectin cluster. Alpha-glucanotransferase or branching enzyme hydrolyzes the linkage of the segment between amylopectin clusters in starch, producing amylopectin cluster, and simultaneously branching enzyme attaches the branched side-chain to amylose, producing branched amylose, and subsequently treating the amylopectin cluster or branched amylose with maltogenic amylase for cleaving long side chain into short side chain and for transferring glucose to the side chain, generating highly branched amylopectin cluster, highly branched amylose or branched oligosaccharide from starch effectively.

摘要翻译： 本发明涉及一种制备高分支直链淀粉和支链淀粉簇的方法。 α-葡聚糖转移酶或分支酶水解淀粉中支链淀粉簇之间的连接，产生支链淀粉簇，同时分支酶将支链侧链连接成直链淀粉，产生支链直链淀粉，随后用产麦芽糖处理支链淀粉簇或支链直链淀粉 用于将长侧链切割成短侧链并将葡萄糖转移到侧链的淀粉酶，有效地从淀粉中产生高度支链的支链淀粉簇，高度支化的直链淀粉或支链寡糖。

公开(公告)号：US20120132197A1

公开(公告)日：2012-05-31

申请号：US13388954

申请日：2010-06-11

申请人： Jin Hee Park ,  Ah Jin Kim ,  Sung Bae Byun ,  Sang Hoon Song

发明人： Jin Hee Park ,  Ah Jin Kim ,  Sung Bae Byun ,  Sang Hoon Song

IPC分类号： C08B30/00

CPC分类号： A23L1/308 ,  A23D7/0056 ,  A23L33/21

摘要： The present invention relates to a fibrous starch with enhanced emulsifying capacity and emulsifying stability, and low-fat mayonnaise and margarine compositions using the same. More specifically, disclosed are fibrous starch which has an increased starch particle size and exhibits improved emulsifying capacity and emulsion stability, prepared by heat-treating starch at a temperature lower than a gelatinization temperature, phosphorylating the starch and further heat-treating the starch sample at a high temperature, and low-fat mayonnaise and margarine compositions in which the content of cooking oil is reduced by 50% or more by adding the fibrous starch with enhanced emulsifying capacity thereto.

摘要翻译： 本发明涉及具有增强的乳化能力和乳化稳定性的纤维状淀粉，以及使用其的低脂蛋黄酱和人造黄油组合物。 更具体地，公开了具有增加的淀粉粒度的纤维状淀粉，并且表现出改善的乳化能力和乳液稳定性，其通过在低于糊化温度的温度下热处理淀粉制备，磷酸化淀粉并进一步热处理淀粉样品 高温和低脂蛋黄酱和人造黄油组合物，其中烹饪油的含量通过添加具有增强的乳化能力的纤维状淀粉而降低50％或更多。

公开(公告)号：US09232816B2

公开(公告)日：2016-01-12

申请号：US13388954

申请日：2010-06-11

申请人： Jin Hee Park ,  Ah Jin Kim ,  Sung Bae Byun ,  Sang Hoon Song

发明人： Jin Hee Park ,  Ah Jin Kim ,  Sung Bae Byun ,  Sang Hoon Song

IPC分类号： C08B30/00 ,  A23L1/308 ,  A23D7/005

CPC分类号： A23L1/308 ,  A23D7/0056 ,  A23L33/21

摘要： The present invention relates to a fibrous starch with enhanced emulsifying capacity and emulsifying stability, and low-fat mayonnaise and margarine compositions using the same. More specifically, disclosed are fibrous starch which has an increased starch particle size and exhibits improved emulsifying capacity and emulsion stability, prepared by heat-treating starch at a temperature lower than a gelatinization temperature, phosphorylating the starch and further heat-treating the starch sample at a high temperature, and low-fat mayonnaise and margarine compositions in which the content of cooking oil is reduced by 50% or more by adding the fibrous starch with enhanced emulsifying capacity thereto.

摘要翻译： 本发明涉及具有增强的乳化能力和乳化稳定性的纤维状淀粉，以及使用其的低脂蛋黄酱和人造黄油组合物。 更具体地，公开了具有增加的淀粉粒度的纤维状淀粉，并且表现出改善的乳化能力和乳液稳定性，其通过在低于糊化温度的温度下热处理淀粉制备，磷酸化淀粉并进一步热处理淀粉样品 高温和低脂蛋黄酱和人造黄油组合物，其中烹饪油的含量通过添加具有增强的乳化能力的纤维状淀粉而降低50％或更多。

公开(公告)号：US20150014830A1

公开(公告)日：2015-01-15

申请号：US14063394

申请日：2013-10-25

申请人： Jong Sik Paek ,  Doo Hyun Park ,  Seong Min Seo ,  Won Chul Do ,  Pil Je Sung ,  Jin Hee Park ,  Do Hyung Kim ,  In Bae Park ,  Chang Min Lee ,  Yong Song ,  SungGeun Kang

发明人： Jong Sik Paek ,  Doo Hyun Park ,  Seong Min Seo ,  Won Chul Do ,  Pil Je Sung ,  Jin Hee Park ,  Do Hyung Kim ,  In Bae Park ,  Chang Min Lee ,  Yong Song ,  SungGeun Kang

IPC分类号： H01L23/538 ,  H01L25/00

CPC分类号： H01L24/03 ,  H01L21/563 ,  H01L23/3114 ,  H01L23/5386 ,  H01L23/5389 ,  H01L24/11 ,  H01L24/24 ,  H01L24/81 ,  H01L24/82 ,  H01L25/0657 ,  H01L25/50 ,  H01L2224/02317 ,  H01L2224/0401 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/16225 ,  H01L2224/24146 ,  H01L2224/24226 ,  H01L2224/24227 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/73209 ,  H01L2224/73217 ,  H01L2224/73267 ,  H01L2224/92244 ,  H01L2224/94 ,  H01L2225/06517 ,  H01L2225/06524 ,  H01L2225/06568 ,  H01L2924/15311 ,  H01L2224/82 ,  H01L2224/83

摘要： A semiconductor device utilizing redistribution layers to couple stacked die is disclosed and may include a first semiconductor die with a first surface comprising bond pads, a second surface opposite the first surface, and sloped side surfaces between the first and second surfaces, such that a cross-section of the first die is trapezoidal in shape. A second semiconductor die with a first surface may be bonded to the second surface of the first die, wherein the first surface of the second die may comprise bond pads. A passivation layer may be formed on the first surface and sloped side surfaces of the first die and the first surface of the second die. A redistribution layer may be formed on the passivation layer, electrically coupling bond pads on the first and second die. A conductive pillar may extend from a bond pad on the second die to the second redistribution layer.

摘要翻译： 公开了一种利用再分配层耦合堆叠管芯的半导体器件，其可以包括第一半导体管芯，其具有包括接合焊盘的第一表面，与第一表面相对的第二表面以及第一和第二表面之间的倾斜侧表面， 第一个模具的截面形状为梯形。 具有第一表面的第二半导体管芯可以结合到第一管芯的第二表面，其中第二管芯的第一表面可以包括接合焊盘。 钝化层可以形成在第一模具的第一表面和倾斜的侧表面上以及第二模具的第一表面上。 可以在钝化层上形成再分配层，电耦合第一和第二裸片上的接合焊盘。 导电柱可以从第二管芯上的焊盘延伸到第二再分布层。

公开(公告)号：US20090117287A1

公开(公告)日：2009-05-07

申请号：US12190764

申请日：2008-08-13

申请人： Jong-Hoon Hahn ,  Jin Hee Park ,  Miok Shin

发明人： Jong-Hoon Hahn ,  Jin Hee Park ,  Miok Shin

IPC分类号： B05D3/06

CPC分类号： B01J19/0093 ,  B01J2219/00783 ,  B01J2219/00831 ,  B01J2219/00837 ,  B01L3/502707 ,  G01N27/44752

摘要： The present invention provides a method for modification of microchannels of a polydimethylsiloxane (PDMS) microchip, which includes the steps of: a) mixing an alkoxysilane precursor, an alkyl alkoxysilane precursor, and a solvent to prepare a sol-gel solution; b) oxidizing microchannels of the PDMS microchip; and c) coating the oxidized microchannels with the sol-gel solution prepared in step a). The PDMS microchip modified according to the method of the present invention shows higher hydrophilicity than an unmodified PDMS microchip. And, when the modified PDMS channels are filled with an organic solvent, channel swelling can be reduced, and thus various organic solvents can be used for the modified PDMS microchip compared to an unmodified PDMS microchip. Further, it can be widely applied for various fields because absorptivity of non-polar substances can be reduced.

摘要翻译： 本发明提供了一种用于改性聚二甲基硅氧烷（PDMS）微芯片的微通道的方法，其包括以下步骤：a）将烷氧基硅烷前体，烷基烷氧基硅烷前体和溶剂混合以制备溶胶 - 凝胶溶液; b）氧化PDMS微芯片的微通道; 和c）用步骤a）中制备的溶胶 - 凝胶溶液涂覆氧化的微通道。 根据本发明的方法修改的PDMS微芯片比未改性的PDMS微芯片显示出更高的亲水性。 并且，当修饰的PDMS通道填充有机溶剂时，与未改性的PDMS微芯片相比，可以减少通道膨胀，因此各种有机溶剂可用于改性PDMS微芯片。 此外，可以广泛地应用于各种领域，因为可以降低非极性物质的吸收性。

公开(公告)号：US20080211986A1

公开(公告)日：2008-09-04

申请号：US11968545

申请日：2008-01-02

申请人： Hyun Chul Bae ,  Jin Ho Ha ,  Jin Hee Park

发明人： Hyun Chul Bae ,  Jin Ho Ha ,  Jin Hee Park

IPC分类号： G02F1/1333 ,  H01R13/66 ,  F21V21/00

CPC分类号： F21V19/0085 ,  G02F1/133604

摘要： A liquid crystal display equipped with a backlight assembly having a lamp socket comprising, a lamp lead seating portion on which a lamp lead is seated, and a contact terminal fastened to the lamp lead seating portion to fix the lamp lead.

摘要翻译： 一种液晶显示器，其配备有具有灯座的背光组件，所述灯座包括灯座，所述灯引线座部分位于所述灯座上，所述接触端子固定在所述灯引线座部上以固定所述灯引线。

公开(公告)号：USD569789S1

公开(公告)日：2008-05-27

申请号：US29258141

申请日：2006-04-17

申请人： Jin Hee Park

设计人： Jin Hee Park

公开(公告)号：US09048241B2

公开(公告)日：2015-06-02

申请号：US14063394

申请日：2013-10-25

申请人： Jong Sik Paek ,  Doo Hyun Park ,  Seong Min Seo ,  Won Chul Do ,  Pil Je Sung ,  Jin Hee Park ,  Do Hyung Kim ,  In Bae Park ,  Chang Min Lee ,  Yong Song ,  SungGeun Kang

发明人： Jong Sik Paek ,  Doo Hyun Park ,  Seong Min Seo ,  Won Chul Do ,  Pil Je Sung ,  Jin Hee Park ,  Do Hyung Kim ,  In Bae Park ,  Chang Min Lee ,  Yong Song ,  SungGeun Kang

IPC分类号： H01L23/02 ,  H01L23/538 ,  H01L25/00

CPC分类号： H01L24/03 ,  H01L21/563 ,  H01L23/3114 ,  H01L23/5386 ,  H01L23/5389 ,  H01L24/11 ,  H01L24/24 ,  H01L24/81 ,  H01L24/82 ,  H01L25/0657 ,  H01L25/50 ,  H01L2224/02317 ,  H01L2224/0401 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/16225 ,  H01L2224/24146 ,  H01L2224/24226 ,  H01L2224/24227 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/73209 ,  H01L2224/73217 ,  H01L2224/73267 ,  H01L2224/92244 ,  H01L2224/94 ,  H01L2225/06517 ,  H01L2225/06524 ,  H01L2225/06568 ,  H01L2924/15311 ,  H01L2224/82 ,  H01L2224/83

摘要： A semiconductor device utilizing redistribution layers to couple stacked die is disclosed and may include a first semiconductor die with a first surface comprising bond pads, a second surface opposite the first surface, and sloped side surfaces between the first and second surfaces, such that a cross-section of the first die is trapezoidal in shape. A second semiconductor die with a first surface may be bonded to the second surface of the first die, wherein the first surface of the second die may comprise bond pads. A passivation layer may be formed on the first surface and sloped side surfaces of the first die and the first surface of the second die. A redistribution layer may be formed on the passivation layer, electrically coupling bond pads on the first and second die. A conductive pillar may extend from a bond pad on the second die to the second redistribution layer.

摘要翻译： 公开了一种利用再分配层耦合堆叠管芯的半导体器件，其可以包括第一半导体管芯，其具有包括接合焊盘的第一表面，与第一表面相对的第二表面以及第一和第二表面之间的倾斜侧表面， 第一个模具的截面形状为梯形。 具有第一表面的第二半导体管芯可以结合到第一管芯的第二表面，其中第二管芯的第一表面可以包括接合焊盘。 钝化层可以形成在第一模具的第一表面和倾斜的侧表面上以及第二模具的第一表面上。 可以在钝化层上形成再分配层，电耦合第一和第二裸片上的接合焊盘。 导电柱可以从第二管芯上的焊盘延伸到第二再分布层。

公开(公告)号：USD597023S1

公开(公告)日：2009-07-28

申请号：US29258107

申请日：2006-04-17

申请人： Jin Hee Park

设计人： Jin Hee Park

公开(公告)号：US20090046462A1

公开(公告)日：2009-02-19

申请号：US12044506

申请日：2008-03-07

申请人： Jin Hee Park ,  Bong-Hyun You ,  Jae-Sung Bae ,  Yong-Hwi Kim

发明人： Jin Hee Park ,  Bong-Hyun You ,  Jae-Sung Bae ,  Yong-Hwi Kim

IPC分类号： F21V21/00 ,  H01J9/00

CPC分类号： H01R33/02 ,  G02F1/133604 ,  G02F1/133608 ,  G02F2001/133612 ,  H01R31/085

摘要： A lamp socket includes a socket housing and a power supply member. The socket housing has a connecting hole. The power supply member includes a first lamp and a second lamp connecting terminal. The first lamp connecting terminal is inserted into the connecting hole, and includes a securing member for preventing a lamp from secession from the lamp socket. The second lamp connecting terminal is inserted into the connecting hole, and includes securing member opening inserted by the securing member. Therefore, the number of elements may be decreased and the stability of lamp socket may be increased.

摘要翻译： 灯座包括插座壳体和电源构件。 插座外壳有一个连接孔。 电源构件包括第一灯和第二灯连接端子。 第一灯连接端子被插入连接孔中，并且包括用于防止灯从灯座分离的固定构件。 第二灯连接端子被插入到连接孔中，并且包括由固定构件插入的固定构件开口。 因此，可以减少元件的数量，并且可以增加灯座的稳定性。