公开(公告)号：US09210813B2

公开(公告)日：2015-12-08

申请号：US13883672

申请日：2010-12-30

申请人： Jianyou Xie ,  Xiaowei Guo ,  Wenhai He ,  Wei Mu ,  Xin Chen

发明人： Jianyou Xie ,  Xiaowei Guo ,  Wenhai He ,  Wei Mu ,  Xin Chen

IPC分类号： H05K3/30 ,  H05K1/18 ,  H01L23/00 ,  H05K3/00 ,  H01L23/31 ,  H01L23/498 ,  H01L25/065

CPC分类号： H05K1/181 ,  H01L23/3121 ,  H01L23/49822 ,  H01L23/49855 ,  H01L24/16 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L24/85 ,  H01L25/0652 ,  H01L25/0657 ,  H01L2223/6677 ,  H01L2224/16225 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/4809 ,  H01L2224/48091 ,  H01L2224/48145 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2224/48644 ,  H01L2224/48647 ,  H01L2224/48655 ,  H01L2224/48664 ,  H01L2224/48744 ,  H01L2224/48747 ,  H01L2224/48755 ,  H01L2224/48764 ,  H01L2224/48844 ,  H01L2224/48847 ,  H01L2224/48855 ,  H01L2224/48864 ,  H01L2224/73265 ,  H01L2224/85444 ,  H01L2224/85447 ,  H01L2224/85455 ,  H01L2224/85464 ,  H01L2225/06506 ,  H01L2225/0651 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/0105 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/07802 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15313 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/19105 ,  H01L2924/30107 ,  H01L2924/3511 ,  H05K3/00 ,  Y10T29/49146 ,  H01L2924/00014 ,  H01L2924/00012 ,  H01L2924/00

摘要： A high-density Subscriber Identity Module (SIM) card package and a production method thereof are provided. The SIM card package includes a substrate, an Integrated Circuit (IC) chip, a bonding wire, and a mold cap. The substrate is a two-layer, a four-layer, a six-layer or an eight-layer high-density interlinked and packaged organic laminated substrate that is manufactured through an etching-back process, and a passive device and a crystal oscillator are provided on the organic laminated substrate. Two IC chips are provided side by side, or one of the IC chips is stacked with a third IC chip, the third IC chip being respectively connected to the organic laminated substrate and the IC chip under the third IC chip by the bonding wire. The IC chip, the passive device, and the crystal oscillator are adhered to the organic laminated substrate.

摘要翻译： 提供了一种高密度用户识别模块（SIM）卡包及其制作方法。 SIM卡封装包括基板，集成电路（IC）芯片，接合线和模具盖。 基板是通过蚀刻回复工艺制造的双层，四层，六层或八层高密度互连和封装的有机层叠基板，无源器件和晶体振荡器是 设置在有机层叠基板上。 并排设置两个IC芯片，或者将IC芯片中的一个与第三IC芯片堆叠，第三IC芯片通过接合线分别连接到有机层叠基板和第三IC芯片下方的IC芯片。 将IC芯片，无源器件和晶体振荡器粘附到有机层叠基板上。

公开(公告)号：US20130223018A1

公开(公告)日：2013-08-29

申请号：US13883672

申请日：2010-12-30

申请人： Jianyou Xie ,  Xiaowei Guo ,  Wenhai He ,  Wei Mu ,  Xin Chen

发明人： Jianyou Xie ,  Xiaowei Guo ,  Wenhai He ,  Wei Mu ,  Xin Chen

IPC分类号： H05K1/18 ,  H05K3/00

CPC分类号： H05K1/181 ,  H01L23/3121 ,  H01L23/49822 ,  H01L23/49855 ,  H01L24/16 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L24/85 ,  H01L25/0652 ,  H01L25/0657 ,  H01L2223/6677 ,  H01L2224/16225 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/4809 ,  H01L2224/48091 ,  H01L2224/48145 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2224/48644 ,  H01L2224/48647 ,  H01L2224/48655 ,  H01L2224/48664 ,  H01L2224/48744 ,  H01L2224/48747 ,  H01L2224/48755 ,  H01L2224/48764 ,  H01L2224/48844 ,  H01L2224/48847 ,  H01L2224/48855 ,  H01L2224/48864 ,  H01L2224/73265 ,  H01L2224/85444 ,  H01L2224/85447 ,  H01L2224/85455 ,  H01L2224/85464 ,  H01L2225/06506 ,  H01L2225/0651 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/0105 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/07802 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15313 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/19105 ,  H01L2924/30107 ,  H01L2924/3511 ,  H05K3/00 ,  Y10T29/49146 ,  H01L2924/00014 ,  H01L2924/00012 ,  H01L2924/00

摘要： A high-density Subscriber Identity Module (SIM) card package and a production method thereof are provided. The SIM card package includes a substrate, an Integrated Circuit (IC) chip, a bonding wire, and a mold cap. The substrate is a two-layer, a four-layer, a six-layer or an eight-layer high-density interlinked and packaged organic laminated substrate that is manufactured through an etching-back process, and a passive device and a crystal oscillator are provided on the organic laminated substrate. Two IC chips are provided side by side, or one of the IC chips is stacked with a third IC chip, the third IC chip being respectively connected to the organic laminated substrate and the IC chip under the third IC chip by the bonding wire. The IC chip, the passive device, and the crystal oscillator are adhered to the organic laminated substrate, and the IC chip is connected to the organic laminated substrate by the bonding wire; the height and the shape of a wire arc is controlled, an injection procedure is controller by using multi-stage injection model software; then, marking and cutting are performed to obtain the SIM card package. The dimension of the package of the present invention is 12 mm×18 mm×0.63 mm, devices of multiple kinds are molded, thereby meeting use requirements for multiple functions.

摘要翻译： 提供了一种高密度用户识别模块（SIM）卡包及其制作方法。 SIM卡封装包括基板，集成电路（IC）芯片，接合线和模具盖。 基板是通过蚀刻回复工艺制造的双层，四层，六层或八层高密度互连和封装的有机层叠基板，无源器件和晶体振荡器是 设置在有机层叠基板上。 并排设置两个IC芯片，或者将IC芯片中的一个与第三IC芯片堆叠，第三IC芯片通过接合线分别连接到有机层叠基板和第三IC芯片下方的IC芯片。 IC芯片，无源器件和晶体振荡器粘附到有机层叠基板上，IC芯片通过接合线连接到有机层叠基板; 控制线弧的高度和形状，注射程序是使用多级注射模型软件的控制器; 然后执行标记和切割以获得SIM卡封装。 本发明的包装尺寸为12mm×18mm×0.63mm，成型为多种装置，满足多种功能的使用要求。

公开(公告)号：US20130334686A1

公开(公告)日：2013-12-19

申请号：US13883936

申请日：2010-12-30

申请人： Xiaowei Guo ,  Wenhai He ,  Wei Mu ,  Xinjun Wang

发明人： Xiaowei Guo ,  Wenhai He ,  Wei Mu ,  Xinjun Wang

IPC分类号： H01L23/00

CPC分类号： H01L24/05 ,  H01L23/3107 ,  H01L23/4951 ,  H01L23/49541 ,  H01L23/49548 ,  H01L23/49575 ,  H01L24/03 ,  H01L24/32 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/85 ,  H01L24/92 ,  H01L24/97 ,  H01L2223/54486 ,  H01L2224/04042 ,  H01L2224/05554 ,  H01L2224/2919 ,  H01L2224/32145 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48145 ,  H01L2224/48247 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2224/85444 ,  H01L2224/92247 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15747 ,  H01L2924/15787 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/83 ,  H01L2224/85 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A carrier-free land grid array (LGA) Integrated Circuit (IC) chip package and a preparation method thereof are provided. The IC chip package includes: an inner pin, an IC chip, a pad, a bonding wire, and a mold cap. The inner pin is designed to be a multi-row matrix form at a front side of the package, and is designed to be an exposed multi-row approximate square-shaped circular gold-plated contacts at a back side; the IC chip is provided on the inner pin, the inner pin is adhered to the IC chip with an adhesive film sheet, the pad on the IC chip is connected to the inner pin by the bonding wire, and the mold cap encircles the adhesive film sheet, the IC chip, the bonding wire, and edges of the inner pin, so as to form a whole circuit. The present invention adopts approximate square-shaped spherical array contacts, thereby having a simple and flexible structure, and achieving a desirable heat-dissipation effect. A cooper lead frame (L/F) has a high yield, and reduces the material cost. The L/F is used to replace a ceramic substrate, PCB substrate, or BT substrate, thereby saving the complicated layout design, shortening the designing and manufacturing cycle, accelerating the trial production course, and enabling the product to be early listed to obtain market opportunities.

摘要翻译： 提供了一种无载波地栅阵列（LGA）集成电路（IC）芯片封装及其制备方法。 IC芯片封装包括：内部引脚，IC芯片，焊盘，接合线和模具盖。 内销被设计为在包装前侧的多排矩阵形式，并被设计为背面暴露的多排近似方形圆形镀金触点; IC芯片设置在内部引脚上，内部引脚用粘合膜片粘合到IC芯片上，IC芯片上的焊盘通过接合线连接到内部引脚，并且模具盖环绕粘合膜 片，IC芯片，接合线和内销的边缘，以形成整个电路。 本发明采用近似的方形球形阵列触点，从而具有简单而灵活的结构，并达到理想的散热效果。 铜杆引线框架（L / F）具有高产量，降低了材料成本。 L / F用于替代陶瓷基板，PCB基板或BT基板，从而节省复杂的布局设计，缩短设计和制造周期，加快试生产过程，使产品能够早日上市获得市场 机会。

公开(公告)号：US09136231B2

公开(公告)日：2015-09-15

申请号：US13883936

申请日：2010-12-30

申请人： Xiaowei Guo ,  Wenhai He ,  Wei Mu ,  Xinjun Wang

发明人： Xiaowei Guo ,  Wenhai He ,  Wei Mu ,  Xinjun Wang

IPC分类号： H01L23/00 ,  H01L23/495 ,  H01L23/31

CPC分类号： H01L24/05 ,  H01L23/3107 ,  H01L23/4951 ,  H01L23/49541 ,  H01L23/49548 ,  H01L23/49575 ,  H01L24/03 ,  H01L24/32 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/85 ,  H01L24/92 ,  H01L24/97 ,  H01L2223/54486 ,  H01L2224/04042 ,  H01L2224/05554 ,  H01L2224/2919 ,  H01L2224/32145 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48145 ,  H01L2224/48247 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2224/85444 ,  H01L2224/92247 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15747 ,  H01L2924/15787 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/83 ,  H01L2224/85 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A carrier-free land grid array (LGA) Integrated Circuit (IC) chip package and a preparation method thereof are provided. The IC chip package includes: an inner pin, an IC chip, a pad, a bonding wire, and a mold cap. The inner pin is designed to be a multi-row matrix form at a front side of the package, and is designed to be an exposed multi-row approximate square-shaped circular gold-plated contacts at a back side; the IC chip is provided on the inner pin, the inner pin is adhered to the IC chip with an adhesive film sheet, the pad on the IC chip is connected to the inner pin by the bonding wire, and the mold cap encircles the adhesive film sheet, the IC chip, the bonding wire, and edges of the inner pin, so as to form a whole circuit. The present invention adopts approximate square-shaped spherical array contacts, thereby having a simple and flexible structure, and achieving a desirable heat-dissipation effect. A cooper lead frame (L/F) has a high yield, and reduces the material cost. The L/F is used to replace a ceramic substrate, PCB substrate, or BT substrate, thereby saving the complicated layout design, shortening the designing and manufacturing cycle, accelerating the trial production course, and enabling the product to be early listed to obtain market opportunities.

摘要翻译： 提供了一种无载波地栅阵列（LGA）集成电路（IC）芯片封装及其制备方法。 IC芯片封装包括：内部引脚，IC芯片，焊盘，接合线和模具盖。 内销被设计为在包装前侧的多排矩阵形式，并被设计为背面暴露的多排近似方形圆形镀金触点; IC芯片设置在内部引脚上，内部引脚用粘合膜片粘合到IC芯片上，IC芯片上的焊盘通过接合线连接到内部引脚，并且模具盖环绕粘合膜 片，IC芯片，接合线和内销的边缘，以形成整个电路。 本发明采用近似的方形球形阵列触点，从而具有简单而灵活的结构，并达到理想的散热效果。 铜杆引线框架（L / F）具有高产量，降低了材料成本。 L / F用于替代陶瓷基板，PCB基板或BT基板，从而节省复杂的布局设计，缩短设计和制造周期，加快试生产过程，使产品能够早日上市获得市场 机会。

公开(公告)号：US20150102476A1

公开(公告)日：2015-04-16

申请号：US14367788

申请日：2012-08-31

申请人： Wenhui Zhu ,  Wei Mu ,  Zhaoming Xu ,  Xiaowei Guo

发明人： Wenhui Zhu ,  Wei Mu ,  Zhaoming Xu ,  Xiaowei Guo

IPC分类号： H01L23/495 ,  H01L23/00

CPC分类号： H01L23/49524 ,  H01L21/4832 ,  H01L23/3107 ,  H01L23/3121 ,  H01L23/49541 ,  H01L23/49579 ,  H01L23/49582 ,  H01L24/03 ,  H01L24/29 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L24/85 ,  H01L2224/0311 ,  H01L2224/03614 ,  H01L2224/0381 ,  H01L2224/29155 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/293 ,  H01L2224/32245 ,  H01L2224/32257 ,  H01L2224/43847 ,  H01L2224/4502 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2224/73265 ,  H01L2224/83855 ,  H01L2224/85181 ,  H01L2224/85455 ,  H01L2224/85464 ,  H01L2924/00014 ,  H01L2924/12042 ,  H01L2924/181 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/43

摘要： The present invention discloses a quad flat no lead package and a production method thereof. The quad flat no lead package comprises a lead frame carrier consisting of a carrier pit and three circles of leads arranged around the carrier pit, wherein the three circles of leads respectively consist of a plurality of leads that are disconnected mutually; an IC chip is adhered in the carrier pit; and an inner lead chemical nickel and porpezite plated layer is plated on all the leads; the inner lead chemical nickel and porpezite plated layer is arranged in the same direction as the IC chip; the IC chip is connected with the inner lead chemical nickel and porpezite plated layer through a bonding wire; and the IC chip, the ends of all the leads plated with the inner lead chemical plating nickel and palladium metal layers and the bonding wire are all packaged in a plastic package. The quad flat no lead package is manufactured through the following steps of: thinning and scribing a wafer; manufacturing a lead frame; loading the chip; performing pressure welding and plastic packaging; performing post-curing; printing; electroplating; separating the leads; separating a product; and testing/braiding. According to the package, the problems of few leads, long welding wire, high welding cost and limited frequency application during single-face packaging of the existing normal quad flat no lead package are solved.

摘要翻译： 本发明公开了一种四边形无铅封装及其制造方法。 四边形无铅封装包括由载体凹坑和布置在载体凹坑周围的三个引线组成的引线框载体，其中三个引线圈分别由相互断开的多个引线组成; IC芯片粘附在载体坑中; 并在所有的引线上镀上一个内引铅化学镍和斑铜矿镀层; 内部引线化学镍和长磷石镀层沿与IC芯片相同的方向排列; IC芯片通过接合线与内引线化学镍和卟啉镀层连接; 和IC芯片，镀有内引线化学镀镍和钯金属层的所有引线的端部和接合线全部封装在塑料封装中。 通过以下步骤制造四边形扁平无铅封装：薄片化和刻划晶片; 制造引线框架; 加载芯片; 执行压焊和塑料包装; 执行后固化; 打印; 电镀; 分离引线; 分离产品; 和测试/编织。 根据封装，解决了现有普通四边形无铅封装单面封装时引线少，焊丝长，焊接成本高，应用频率有限的问题。

公开(公告)号：US09275941B2

公开(公告)日：2016-03-01

申请号：US14367788

申请日：2012-08-31

申请人： Wenhui Zhu ,  Wei Mu ,  Zhaoming Xu ,  Xiaowei Guo

发明人： Wenhui Zhu ,  Wei Mu ,  Zhaoming Xu ,  Xiaowei Guo

IPC分类号： H01L21/00 ,  H01L23/495 ,  H01L21/48 ,  H01L23/31 ,  H01L23/00

CPC分类号： H01L23/49524 ,  H01L21/4832 ,  H01L23/3107 ,  H01L23/3121 ,  H01L23/49541 ,  H01L23/49579 ,  H01L23/49582 ,  H01L24/03 ,  H01L24/29 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L24/85 ,  H01L2224/0311 ,  H01L2224/03614 ,  H01L2224/0381 ,  H01L2224/29155 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/293 ,  H01L2224/32245 ,  H01L2224/32257 ,  H01L2224/43847 ,  H01L2224/4502 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2224/73265 ,  H01L2224/83855 ,  H01L2224/85181 ,  H01L2224/85455 ,  H01L2224/85464 ,  H01L2924/00014 ,  H01L2924/12042 ,  H01L2924/181 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/43

摘要： The present invention discloses a quad flat no lead package and a production method thereof. The quad flat no lead package comprises a lead frame carrier consisting of a carrier pit and three circles of leads arranged around the carrier pit, wherein the three circles of leads respectively consist of a plurality of leads that are disconnected mutually; an IC chip is adhered in the carrier pit; and an inner lead chemical nickel and porpezite plated layer is plated on all the leads; the inner lead chemical nickel and porpezite plated layer is arranged in the same direction as the IC chip; the IC chip is connected with the inner lead chemical nickel and porpezite plated layer through a bonding wire; and the IC chip, the ends of all the leads plated with the inner lead chemical plating nickel and palladium metal layers and the bonding wire are all packaged in a plastic package. The quad flat no lead package is manufactured through the following steps of: thinning and scribing a wafer; manufacturing a lead frame; loading the chip; performing pressure welding and plastic packaging; performing post-curing; printing; electroplating; separating the leads; separating a product; and testing/braiding. According to the package, the problems of few leads, long welding wire, high welding cost and limited frequency application during single-face packaging of the existing normal quad flat no lead package are solved.

摘要翻译： 本发明公开了一种四边形无铅封装及其制造方法。 四边形无铅封装包括由载体凹坑和布置在载体凹坑周围的三个引线组成的引线框载体，其中三个引线圈分别由相互断开的多个引线组成; IC芯片粘附在载体坑中; 并在所有的引线上镀上一个内引铅化学镍和斑铜矿镀层; 内部引线化学镍和长磷石镀层沿与IC芯片相同的方向排列; IC芯片通过接合线与内引线化学镍和卟啉镀层连接; 和IC芯片，镀有内引线化学镀镍和钯金属层的所有引线的端部和接合线全部封装在塑料封装中。 通过以下步骤制造四边形扁平无铅封装：薄片化和刻划晶片; 制造引线框架; 加载芯片; 执行压焊和塑料包装; 执行后固化; 打印; 电镀; 分离引线; 分离产品; 和测试/编织。 根据封装，解决了现有普通四边形无铅封装单面封装时引线少，焊丝长，焊接成本高，应用频率有限的问题。

公开(公告)号：USD1008475S1

公开(公告)日：2023-12-19

申请号：US29901192

申请日：2023-08-30

申请人： Xiaowei Guo

设计人： Xiaowei Guo

摘要： FIG. 1 is a top perspective view of a hand warmer showing my new design;
FIG. 2 is a front view thereof;
FIG. 3 is a rear view thereof;
FIG. 4 is a left side view thereof;
FIG. 5 is a right side view thereof;
FIG. 6 is a top plan view thereof; and,
FIG. 7 is a bottom plan view thereof.
The broken lines in the drawings depict portions of the hand warmer that form no part of the claimed design.

公开(公告)号：US20120031973A1

公开(公告)日：2012-02-09

申请号：US13263916

申请日：2010-04-12

申请人： Wei Shen ,  Jiabing Liu ,  Xiaowei Guo ,  Liduo Zhong

发明人： Wei Shen ,  Jiabing Liu ,  Xiaowei Guo ,  Liduo Zhong

IPC分类号： G06K19/06 ,  G06K7/14

CPC分类号： G06K9/3216

摘要： The present invention relates to a two-dimensional array code. The two-dimensional array code comprises a plurality of code characters arranged into a two-dimensional array, wherein each of the code characters corresponds to a bit group representing information; and a locating mechanism, for defining size and/or direction of the two-dimensional array arranged by the code characters, wherein each of the code characters belongs to one of a plurality of character groups, characters in each of the character groups have at least a identical or similar feature, and characters belong to a same character group are mapped to a same bit group. According to the present invention, at least one of the plurality of character groups comprises two or more code characters. The present invention greatly reduces the cost for issuing a two-dimensional code, and significantly increases the user convenience. This two-dimensional array code has high compatibility for user mobile terminals. In addition, the entire system apparently improves its safety and stability, and is suitable for the present network application environment.

摘要翻译： 本发明涉及一种二维阵列码。 二维阵列代码包括排列成二维阵列的多个代码字符，其中每个代码字符对应于表示信息的位组; 以及定位机构，用于定义由代码字符排列的二维阵列的大小和/或方向，其中每个代码字符属于多个字符组中的一个，每个字符组中的字符至少具有 相同或相似的特征，并且属于相同字符组的字符被映射到相同的位组。 根据本发明，多个字符组中的至少一个包括两个或更多个代码字符。 本发明大大降低了发行二维码的成本，显着提高了用户的便利性。 该二维阵列码对于用户移动终端具有高兼容性。 此外，整个系统显然提高了其安全性和稳定性，适用于当前的网络应用环境。

公开(公告)号：USD1014817S1

公开(公告)日：2024-02-13

申请号：US29901190

申请日：2023-08-30

申请人： Xiaowei Guo

设计人： Xiaowei Guo

摘要： FIG. 1 is a top perspective view of a cabinet light showing my new design;
FIG. 2 is a front view thereof;
FIG. 3 is a rear view thereof;
FIG. 4 is a left side view thereof;
FIG. 5 is a right side view thereof;
FIG. 6 is a top plan view thereof; and,
FIG. 7 is a bottom plan view thereof.
The broken lines in the drawings depict portions of the cabinet light that form no part of the claimed design.

公开(公告)号：USD1008517S1

公开(公告)日：2023-12-19

申请号：US29876759

申请日：2023-05-26

申请人： Xiaowei Guo

设计人： Xiaowei Guo

摘要： FIG. 1 is a front, right, bottom perspective view of a cabinet light, showing my new design;
FIG. 2 is a rear, left, top perspective view thereof;
FIG. 3 is a front elevation view thereof;
FIG. 4 is a rear elevation view thereof;
FIG. 5 is a left side elevation view thereof;
FIG. 6 is a right side elevation view thereof;
FIG. 7 is a top plan view thereof; and,
FIG. 8 is a bottom plan view thereof.
The broken lines in the figures illustrate portions of the cabinet light that form no part of the claimed design.