摘要:
This disclosure provides systems, methods and apparatus related to an electromechanical display device. In one aspect, an analog interferometric modulator (AIMOD) includes a reflective display pixel having a movable reflective layer and a stationary absorber layer, the reflective layer and absorber layer defining a cavity therebetween. A color notch filter may be employed to produce an improved white state. In some implementations, the color notch filter is positioned on a side of the substrate opposite the absorber layer. In some other implementations, the color notch filter is positioned between the substrate and the movable reflective layer.
摘要:
This disclosure provides systems, methods and apparatus related to an electromechanical display device. In one aspect, an analog interferometric modulator (AIMOD) includes a reflective display pixel having a movable reflective layer and a stationary absorber layer, the reflective layer and absorber layer defining a cavity therebetween. A color notch filter may be employed to produce an improved white state. In some implementations, the color notch filter is positioned on a side of the substrate opposite the absorber layer. In some other implementations, the color notch filter is positioned between the substrate and the movable reflective layer.
摘要:
This disclosure provides systems, methods and apparatus related to an electromechanical display device. In one aspect, an analog interferometric modulator includes a reflective display pixel having a reflector, and a movable first absorbing layer positionable at a distance d1 from the reflector, the first absorbing layer and the reflector defining a first gap therebetween. The apparatus also includes a second absorbing layer disposed at a distance d2 from the first absorbing layer, the first absorbing layer disposed between the second absorbing layer and the reflector, the second absorbing layer and the first absorbing layer defining a second gap therebetween. In addition, at least two of the reflector, the first absorbing layer and second absorbing layer are movable to synchronously either increase or decrease the thickness dimension of the first gap and the second gap.
摘要:
This disclosure provides systems, methods and apparatus related to an electromechanical display device. In one aspect, an analog interferometric modulator includes a reflective display pixel having a reflector, and a movable first absorbing layer positionable at a distance d1 from the reflector, the first absorbing layer and the reflector defining a first gap therebetween. The apparatus also includes a second absorbing layer disposed at a distance d2 from the first absorbing layer, the first absorbing layer disposed between the second absorbing layer and the reflector, the second absorbing layer and the first absorbing layer defining a second gap therebetween. In addition, at least two of the reflector, the first absorbing layer and second absorbing layer are movable to synchronously either increase or decrease the thickness dimension of the first gap and the second gap.
摘要:
A plurality of MEMS devices are formed on a substrate, a sacrificial layer is formed to cover each of the MEMS devices and a protective cap layer is formed on the sacrificial layer. A release hole is formed through the protective cap layer to the underlying sacrificial layer, and a releasing agent is introduced through the release hole to remove the sacrificial layer under the protective cap layer and expose a MEMS device. Optionally, the MEMS device can be released with the same releasing agent or, optionally, with a secondary releasing agent. The release hole is solder sealed, to form a hermetic seal of the MEMS device. Optionally, release holes are formed at a plurality of locations, each over a MEMS device and the releasing forms a plurality of hermetic sealed MEMS devices on the wafer substrate, which are singulated to form separate hermetically sealed MEMS devices.
摘要:
This disclosure provides systems, methods and apparatus, including computer programs encoded on computer storage media, for measuring a distance. In one aspect, the method includes actuating or releasing an interferometric modulator having a first surface and a second surface and measuring a distance between the first and second surfaces at a plurality of times during the actuation or release. In another aspect, the method includes illuminating, with a first laser beam having a first wavelength and with a second laser beam having a second wavelength different from the first wavelength, an interferometric modulator having a distance between a first surface which is at least partially reflective and a second surface which is at least partially absorptive, measuring a first intensity of the first laser beam modulated by the interferometric modulator and a second intensity of the second laser beam modulated by the interferometric modulator, and determining the distance based on the measured intensities.
摘要:
A method is provided for reconstructing an image transmitted through a thick distorting medium. A remote source provides coherent light at the object plane, and a local source, typically derived from the remote source, provides corresponding light that is coherent with respect to the remote source. Light from the remote source is directed through the thick aberrator and into a holographic medium, such as a photorefractive crystal, to interact with corresponding light from the local source and produce a volume hologram. An angularly multiplexed volume hologram, which covers the entire object field, is written into the holographic medium by successive exposures of light from the remote and local sources for successive pixels of the object plane. Light from an object, which comprises two-dimensional information from the object plane, can be reconstructed by the volume hologram after being distorted by the thick aberrator. Light from each point of the object accesses the set of gratings in the volume hologram and reconstructs only the reference wave associated with it. Reconstructed waves emerging from the hologram are then focused by a following lens to form a high resolution image of the object at the image plane of the lens.
摘要:
Systems and methods for manufacturing and packaging electronic devices with light absorptive thin film stacks are provided. In one embodiment, a light is applied to a light absorptive thin film stack disposed between a substrate and a backplate to seal the substrate to the backplate. In another embodiment, the light absorptive thin film stack includes a plurality of thin film layers. In yet another embodiment, the light absorptive thin film stack includes a spacer layer over a reflective layer and an absorber layer over the spacer layer. In still another embodiment, the light absorptive thin film stack is less than 200 nanometers thick. In yet a further embodiment, a light absorptive thin film stack is used to seal a substrate having glass, plastic, metal, or silicon to a backplate having glass, plastic, metal, or silicon. Thus, the light absorptive thin film stack is used to seal similar or dissimilar materials through a bonding process.
摘要:
The present disclosure provides systems, methods and apparatus for producing holographic displays using an electromechanical systems device. In one aspect, the method can be implemented to allow for simultaneous modulation of phase and amplitude of light in a display device composed of a plurality of pixels. A light source can provide sufficiently coherent light to a light guide, which can direct the light to a plurality of reflective members. The reflective members can reflect the light to a pinhole-lenslet array. The combination of the pinhole-lenslet array and the reflective members can act as a spatial light modulator, modulating the phase and amplitude of the light reflected by the reflective members. The lenslet can focus the light to a plane at the opening of the pinhole, wherein the light can exit the pinhole to be viewed in combination with light from additional pixels, and can be viewed as a holographic image.
摘要:
Systems and methods for manufacturing and packaging electronic devices with light absorptive thin film stacks are provided. In one embodiment, a light is applied to a light absorptive thin film stack disposed between a substrate and a backplate to seal the substrate to the backplate. In another embodiment, the light absorptive thin film stack includes a plurality of thin film layers. In yet another embodiment, the light absorptive thin film stack includes a spacer layer over a reflective layer and an absorber layer over the spacer layer. In still another embodiment, the light absorptive thin film stack is less than 200 nanometers thick. In yet a further embodiment, a light absorptive thin film stack is used to seal a substrate having glass, plastic, metal, or silicon to a backplate having glass, plastic, metal, or silicon. Thus, the light absorptive thin film stack is used to seal similar or dissimilar materials through a bonding process.