Analog IMOD having a color notch filter
    1.
    发明授权
    Analog IMOD having a color notch filter 有权
    具有色陷波滤波器的模拟IMOD

    公开(公告)号:US08760751B2

    公开(公告)日:2014-06-24

    申请号:US13358769

    申请日:2012-01-26

    IPC分类号: G02B26/00 G02B26/08

    摘要: This disclosure provides systems, methods and apparatus related to an electromechanical display device. In one aspect, an analog interferometric modulator (AIMOD) includes a reflective display pixel having a movable reflective layer and a stationary absorber layer, the reflective layer and absorber layer defining a cavity therebetween. A color notch filter may be employed to produce an improved white state. In some implementations, the color notch filter is positioned on a side of the substrate opposite the absorber layer. In some other implementations, the color notch filter is positioned between the substrate and the movable reflective layer.

    摘要翻译: 本公开提供了与机电显示装置相关的系统,方法和装置。 一方面,模拟干涉式调制器(AIMOD)包括具有可移动反射层和固定吸收层的反射显示像素,所述反射层和吸收层在其间限定空腔。 可以使用彩色陷波滤波器来产生改善的白色状态。 在一些实施方案中,色陷波滤波器位于与吸收层相对的基板的一侧。 在一些其他实现中,色陷波滤波器位于基板和可移动反射层之间。

    ANALOG IMOD HAVING A COLOR NOTCH FILTER
    2.
    发明申请
    ANALOG IMOD HAVING A COLOR NOTCH FILTER 有权
    具有彩色插槽过滤器的模拟IMOD

    公开(公告)号:US20130194653A1

    公开(公告)日:2013-08-01

    申请号:US13358769

    申请日:2012-01-26

    IPC分类号: G02B26/00 H05K3/10

    摘要: This disclosure provides systems, methods and apparatus related to an electromechanical display device. In one aspect, an analog interferometric modulator (AIMOD) includes a reflective display pixel having a movable reflective layer and a stationary absorber layer, the reflective layer and absorber layer defining a cavity therebetween. A color notch filter may be employed to produce an improved white state. In some implementations, the color notch filter is positioned on a side of the substrate opposite the absorber layer. In some other implementations, the color notch filter is positioned between the substrate and the movable reflective layer.

    摘要翻译: 本公开提供了与机电显示装置相关的系统,方法和装置。 一方面,模拟干涉式调制器(AIMOD)包括具有可移动反射层和固定吸收层的反射显示像素,所述反射层和吸收层在其间限定空腔。 可以使用彩色陷波滤波器来产生改善的白色状态。 在一些实施方案中,色陷波滤波器位于与吸收层相对的基板的一侧。 在一些其他实现中,色陷波滤波器位于基板和可移动反射层之间。

    INTERFEROMETRIC MODULATOR WITH DUAL ABSORBING LAYERS

    公开(公告)号:US20130135319A1

    公开(公告)日:2013-05-30

    申请号:US13306877

    申请日:2011-11-29

    CPC分类号: G02B26/00 G02B26/001

    摘要: This disclosure provides systems, methods and apparatus related to an electromechanical display device. In one aspect, an analog interferometric modulator includes a reflective display pixel having a reflector, and a movable first absorbing layer positionable at a distance d1 from the reflector, the first absorbing layer and the reflector defining a first gap therebetween. The apparatus also includes a second absorbing layer disposed at a distance d2 from the first absorbing layer, the first absorbing layer disposed between the second absorbing layer and the reflector, the second absorbing layer and the first absorbing layer defining a second gap therebetween. In addition, at least two of the reflector, the first absorbing layer and second absorbing layer are movable to synchronously either increase or decrease the thickness dimension of the first gap and the second gap.

    Interferometric modulator with dual absorbing layers
    4.
    发明授权
    Interferometric modulator with dual absorbing layers 有权
    具有双吸收层的干涉式调制器

    公开(公告)号:US08995043B2

    公开(公告)日:2015-03-31

    申请号:US13306877

    申请日:2011-11-29

    IPC分类号: G02B26/02

    CPC分类号: G02B26/00 G02B26/001

    摘要: This disclosure provides systems, methods and apparatus related to an electromechanical display device. In one aspect, an analog interferometric modulator includes a reflective display pixel having a reflector, and a movable first absorbing layer positionable at a distance d1 from the reflector, the first absorbing layer and the reflector defining a first gap therebetween. The apparatus also includes a second absorbing layer disposed at a distance d2 from the first absorbing layer, the first absorbing layer disposed between the second absorbing layer and the reflector, the second absorbing layer and the first absorbing layer defining a second gap therebetween. In addition, at least two of the reflector, the first absorbing layer and second absorbing layer are movable to synchronously either increase or decrease the thickness dimension of the first gap and the second gap.

    摘要翻译: 本公开提供了与机电显示装置相关的系统,方法和装置。 在一个方面,模拟干涉式调制器包括具有反射器的反射显示像素和与反射器定位在距离d1的可移动的第一吸收层,第一吸收层和反射器限定了它们之间的第一间隙。 该装置还包括与第一吸收层距离d2设置的第二吸收层,设置在第二吸收层和反射体之间的第一吸收层,第二吸收层和第一吸收层在其间限定第二间隙。 此外,反射器,第一吸收层和第二吸收层中的至少两个可移动以同步地增加或减小第一间隙和第二间隙的厚度尺寸。

    METHOD AND APPARATUS FOR WAFER-LEVEL SOLDER HERMETIC SEAL ENCAPSULATION OF MEMS DEVICES
    5.
    发明申请
    METHOD AND APPARATUS FOR WAFER-LEVEL SOLDER HERMETIC SEAL ENCAPSULATION OF MEMS DEVICES 审中-公开
    MEMS器件的水平焊缝密封封装的方法和装置

    公开(公告)号:US20130119489A1

    公开(公告)日:2013-05-16

    申请号:US13294831

    申请日:2011-11-11

    IPC分类号: H01L31/18 H01L31/0203

    CPC分类号: B81C1/00293 B81C2203/0145

    摘要: A plurality of MEMS devices are formed on a substrate, a sacrificial layer is formed to cover each of the MEMS devices and a protective cap layer is formed on the sacrificial layer. A release hole is formed through the protective cap layer to the underlying sacrificial layer, and a releasing agent is introduced through the release hole to remove the sacrificial layer under the protective cap layer and expose a MEMS device. Optionally, the MEMS device can be released with the same releasing agent or, optionally, with a secondary releasing agent. The release hole is solder sealed, to form a hermetic seal of the MEMS device. Optionally, release holes are formed at a plurality of locations, each over a MEMS device and the releasing forms a plurality of hermetic sealed MEMS devices on the wafer substrate, which are singulated to form separate hermetically sealed MEMS devices.

    摘要翻译: 在衬底上形成多个MEMS器件,形成牺牲层以覆盖每个MEMS器件,并且在牺牲层上形成保护帽层。 通过保护盖层形成释放孔到下面的牺牲层,并且通过释放孔引入脱模剂以除去保护盖层下面的牺牲层并暴露MEMS器件。 可选地,MEMS器件可以用相同的脱模剂或任选地与二次释放剂一起释放。 释放孔被焊接密封,以形成MEMS器件的气密密封。 可选地,在多个位置上形成释放孔,每个位置都在MEMS器件上,并且释放在晶片衬底上形成多个密封的MEMS器件,其被单个化以形成分开的密封的MEMS器件。

    SYSTEM AND METHOD FOR MEASURING A DISTANCE
    6.
    发明申请
    SYSTEM AND METHOD FOR MEASURING A DISTANCE 审中-公开
    用于测量距离的系统和方法

    公开(公告)号:US20120170047A1

    公开(公告)日:2012-07-05

    申请号:US12983527

    申请日:2011-01-03

    IPC分类号: G01B9/02

    摘要: This disclosure provides systems, methods and apparatus, including computer programs encoded on computer storage media, for measuring a distance. In one aspect, the method includes actuating or releasing an interferometric modulator having a first surface and a second surface and measuring a distance between the first and second surfaces at a plurality of times during the actuation or release. In another aspect, the method includes illuminating, with a first laser beam having a first wavelength and with a second laser beam having a second wavelength different from the first wavelength, an interferometric modulator having a distance between a first surface which is at least partially reflective and a second surface which is at least partially absorptive, measuring a first intensity of the first laser beam modulated by the interferometric modulator and a second intensity of the second laser beam modulated by the interferometric modulator, and determining the distance based on the measured intensities.

    摘要翻译: 本公开提供了用于测量距离的系统,方法和装置,包括在计算机存储介质上编码的计算机程序。 一方面,该方法包括致动或释放具有第一表面和第二表面的干涉式调制器,并且在致动或释放期间多次测量第一和第二表面之间的距离。 在另一方面,该方法包括用具有第一波长的第一激光束和具有不同于第一波长的第二波长的第二激光束照射干涉式调制器,该调制器具有至少部分反射的第一表面之间的距离 以及第二表面,其至少部分地吸收,测量由所述干涉式调制器调制的所述第一激光束的第一强度和由所述干涉式调制器调制的所述第二激光束的第二强度,以及基于所测量的强度来确定所述距离。

    Image transmission through thick aberrators
    7.
    发明授权
    Image transmission through thick aberrators 失效
    通过厚像差图像传输

    公开(公告)号:US5126862A

    公开(公告)日:1992-06-30

    申请号:US655525

    申请日:1991-02-13

    IPC分类号: G03H1/00 G03H1/12 G03H1/26

    CPC分类号: G03H1/26 G03H1/00 G03H1/12

    摘要: A method is provided for reconstructing an image transmitted through a thick distorting medium. A remote source provides coherent light at the object plane, and a local source, typically derived from the remote source, provides corresponding light that is coherent with respect to the remote source. Light from the remote source is directed through the thick aberrator and into a holographic medium, such as a photorefractive crystal, to interact with corresponding light from the local source and produce a volume hologram. An angularly multiplexed volume hologram, which covers the entire object field, is written into the holographic medium by successive exposures of light from the remote and local sources for successive pixels of the object plane. Light from an object, which comprises two-dimensional information from the object plane, can be reconstructed by the volume hologram after being distorted by the thick aberrator. Light from each point of the object accesses the set of gratings in the volume hologram and reconstructs only the reference wave associated with it. Reconstructed waves emerging from the hologram are then focused by a following lens to form a high resolution image of the object at the image plane of the lens.

    摘要翻译: 提供了一种用于重构通过粗变形介质传输的图像的方法。 远程源在对象平面提供相干光,并且通常从远程源导出的本地源提供相对于远程源一致的相应光。 来自远程源的光被引导通过厚度像差仪并进入诸如光折射晶体的全息介质,以与来自本地源的相应光相互作用并产生体积全息图。 覆盖整个物场的角度多路复用的体积全息图通过对来自对象平面的连续像素的远程和本地源的光的连续曝光而被写入全息介质。 来自物体的来自物体平面的二维信息的光可以通过体积全息图被厚像差器重构。 物体的每个点的光访问体积全息图中的一组光栅,并仅重建与其相关联的参考波。 然后,从全息图中出现的重构波通过随后的透镜聚焦,以在透镜的图像平面上形成物体的高分辨率图像。

    Light-based sealing and device packaging
    8.
    发明授权
    Light-based sealing and device packaging 失效
    轻型密封和装置包装

    公开(公告)号:US08379392B2

    公开(公告)日:2013-02-19

    申请号:US12605246

    申请日:2009-10-23

    摘要: Systems and methods for manufacturing and packaging electronic devices with light absorptive thin film stacks are provided. In one embodiment, a light is applied to a light absorptive thin film stack disposed between a substrate and a backplate to seal the substrate to the backplate. In another embodiment, the light absorptive thin film stack includes a plurality of thin film layers. In yet another embodiment, the light absorptive thin film stack includes a spacer layer over a reflective layer and an absorber layer over the spacer layer. In still another embodiment, the light absorptive thin film stack is less than 200 nanometers thick. In yet a further embodiment, a light absorptive thin film stack is used to seal a substrate having glass, plastic, metal, or silicon to a backplate having glass, plastic, metal, or silicon. Thus, the light absorptive thin film stack is used to seal similar or dissimilar materials through a bonding process.

    摘要翻译: 提供了制造和封装具有光吸收薄膜叠层的电子器件的系统和方法。 在一个实施例中,将光施加到设置在基板和背板之间的光吸收薄膜堆叠以将基板密封到背板。 在另一个实施例中,光吸收薄膜叠层包括多个薄膜层。 在另一个实施例中,光吸收薄膜堆叠包括反射层上的间隔层和间隔层上的吸收层。 在又一个实施例中,光吸收薄膜叠层小于200纳米厚。 在又一个实施例中,使用光吸收薄膜叠层将具有玻璃,塑料,金属或硅的衬底密封到具有玻璃,塑料,金属或硅的背板上。 因此,光吸收薄膜叠层用于通过粘接工艺密封类似的或不相似的材料。

    LIGHT-BASED SEALING AND DEVICE PACKAGING
    10.
    发明申请
    LIGHT-BASED SEALING AND DEVICE PACKAGING 失效
    基于光的密封和设备包装

    公开(公告)号:US20110096508A1

    公开(公告)日:2011-04-28

    申请号:US12605246

    申请日:2009-10-23

    摘要: Systems and methods for manufacturing and packaging electronic devices with light absorptive thin film stacks are provided. In one embodiment, a light is applied to a light absorptive thin film stack disposed between a substrate and a backplate to seal the substrate to the backplate. In another embodiment, the light absorptive thin film stack includes a plurality of thin film layers. In yet another embodiment, the light absorptive thin film stack includes a spacer layer over a reflective layer and an absorber layer over the spacer layer. In still another embodiment, the light absorptive thin film stack is less than 200 nanometers thick. In yet a further embodiment, a light absorptive thin film stack is used to seal a substrate having glass, plastic, metal, or silicon to a backplate having glass, plastic, metal, or silicon. Thus, the light absorptive thin film stack is used to seal similar or dissimilar materials through a bonding process.

    摘要翻译: 提供了制造和封装具有光吸收薄膜叠层的电子器件的系统和方法。 在一个实施例中,将光施加到设置在基板和背板之间的光吸收薄膜堆叠以将基板密封到背板。 在另一个实施例中,光吸收薄膜叠层包括多个薄膜层。 在另一个实施例中,光吸收薄膜堆叠包括反射层上的间隔层和间隔层上的吸收层。 在又一个实施例中,光吸收薄膜叠层小于200纳米厚。 在又一个实施例中,使用光吸收薄膜叠层将具有玻璃,塑料,金属或硅的衬底密封到具有玻璃,塑料,金属或硅的背板上。 因此,光吸收薄膜叠层用于通过粘接工艺密封类似的或不相似的材料。