公开(公告)号：US08945657B2

公开(公告)日：2015-02-03

申请号：US12820535

申请日：2010-06-22

申请人： James J. Wang ,  Douglas A. Bippert

发明人： James J. Wang ,  Douglas A. Bippert

IPC分类号： A23L1/212 ,  A23L2/02 ,  A23L2/52

CPC分类号： A23L1/2128 ,  A23L2/02 ,  A23L2/52 ,  A23L19/09

摘要： The present invention relates to a process for making a dehydrated pulp slurry comprising the steps of de-sugaring a pulp slurry, said de-sugaring process producing a pulp slurry with substantially no sugar content, and dehydrating said pulp slurry. The dehydrated pulp slurry produced by this process is such that, when reconstituted, the color, shape, and texture of the pulp contained therein is substantially the same as it was prior to undergoing the dehydrating step.

摘要翻译： 本发明涉及一种制备脱水纸浆的方法，包括以下步骤：对纸浆进行脱糖，所述脱糖过程产生基本上不含糖含量的纸浆，并使所述纸浆脱水。 通过该方法生产的脱水浆浆使得当重新构成时，其中所含纸浆的颜色，形状和质地基本上与进行脱水步骤之前相同。

公开(公告)号：US20090004775A1

公开(公告)日：2009-01-01

申请号：US12207719

申请日：2008-09-10

申请人： James J. Wang ,  William G. McDonald

发明人： James J. Wang ,  William G. McDonald

IPC分类号： H01L21/56

CPC分类号： H01L23/4951 ,  H01L23/49541 ,  H01L23/49551 ,  H01L24/45 ,  H01L24/48 ,  H01L2224/06135 ,  H01L2224/06136 ,  H01L2224/32245 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/4826 ,  H01L2224/48465 ,  H01L2224/73215 ,  H01L2924/00014 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/1461 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/05599

摘要： Methods are provided for forming Quad Flat No-Lead (QFN) packages. An embodiment includes disposing an active side of a semiconductor chip on a plurality of leads, coupling a plurality of wire bonds to the active side of the semiconductor chip, coupling the plurality of wire bonds to the plurality of leads in a space between the active side and the plurality of leads, and encasing the semiconductor chip, at least a portion of each of the plurality of leads, and the plurality of wire bonds in a mold material to define a mounting side of the QFN package. The mounting side has a perimeter, the plurality of leads are oriented on and exposed on the mounting side within the perimeter, and the plurality of wire bonds are oriented between the active side and the mounting side within the mold material.

摘要翻译： 提供了用于形成四方扁平无铅（QFN）封装的方法。 一个实施例包括将半导体芯片的有源侧设置在多个引线上，将多个引线接合耦合到半导体芯片的有源侧，将多个引线接合耦合到多个引线之间的活动侧 以及多个引线，并且将所述多个引线中的每一个的至少一部分包围所述半导体芯片，并将所述多个引线接合在模具材料中以限定所述QFN封装的安装侧。 安装侧具有周边，多个引线定位在周边内的安装侧并且暴露在周边内的安装侧，并且多个引线接合在模具材料内的有源侧和安装侧之间取向。

公开(公告)号：US07713781B2

公开(公告)日：2010-05-11

申请号：US12207719

申请日：2008-09-10

申请人： James J. Wang ,  William G. McDonald

发明人： James J. Wang ,  William G. McDonald

IPC分类号： H01L23/02

CPC分类号： H01L23/4951 ,  H01L23/49541 ,  H01L23/49551 ,  H01L24/45 ,  H01L24/48 ,  H01L2224/06135 ,  H01L2224/06136 ,  H01L2224/32245 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/4826 ,  H01L2224/48465 ,  H01L2224/73215 ,  H01L2924/00014 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/1461 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/05599

摘要： Methods are provided for forming Quad Flat No-Lead (QFN) packages. An embodiment includes disposing an active side of a semiconductor chip on a plurality of leads, coupling a plurality of wire bonds to the active side of the semiconductor chip, coupling the plurality of wire bonds to the plurality of leads in a space between the active side and the plurality of leads, and encasing the semiconductor chip, at least a portion of each of the plurality of leads, and the plurality of wire bonds in a mold material to define a mounting side of the QFN package. The mounting side has a perimeter, the plurality of leads are oriented on and exposed on the mounting side within the perimeter, and the plurality of wire bonds are oriented between the active side and the mounting side within the mold material.

摘要翻译： 提供了用于形成四方扁平无铅（QFN）封装的方法。 一个实施例包括将半导体芯片的有源侧设置在多个引线上，将多个引线接合耦合到半导体芯片的有源侧，将多个引线接合耦合到多个引线之间的活动侧 以及多个引线，并且将所述多个引线中的每一个的至少一部分包围所述半导体芯片，并将所述多个引线接合在模具材料中以限定所述QFN封装的安装侧。 安装侧具有周边，多个引线定位在周边内的安装侧并且暴露在周边内的安装侧，并且多个引线接合在模具材料内的有源侧和安装侧之间取向。

公开(公告)号：US20080118537A1

公开(公告)日：2008-05-22

申请号：US11603269

申请日：2006-11-21

申请人： James J. Wang ,  Jin L. Hung

发明人： James J. Wang ,  Jin L. Hung

IPC分类号： A61K8/84 ,  A61Q19/00

CPC分类号： A61Q1/00 ,  A61K8/025 ,  A61K8/891 ,  A61K2800/412 ,  A61Q1/02 ,  A61Q1/12 ,  A61Q17/04 ,  A61Q19/00

摘要： A cosmetic composition is disclosed containing hydrophilic, spherical powder of polymethylsilsesquioxane having a particle size ranged from 1-20 microns with a narrow particle size distribution. The hydrophilic, spherical powder in the composition is prepared by a process comprising (1) hydrolyzing and condensing methyltrimethoxysilane in water in the presence of a thickener as suspending agent, an oil as surface tension modifier and an acid or base as catalyst to form spherical particles, (2) post-hydrolyzing the spherical particles in an aqueous NaOH solution and (3) purifying the spherical particles by repeated washing and vacuum stripping.

摘要翻译： 公开了一种化妆品组合物，其含有粒径范围为1-20微米，具有窄粒度分布的聚甲基倍半硅氧烷的亲水性球形粉末。 组合物中的亲水性球形粉末通过以下方法制备：（1）在作为悬浮剂的增稠剂，作为表面张力调节剂的油和作为催化剂的酸或碱作为催化剂存在下，将甲基三甲氧基硅烷水解和缩合，形成球形颗粒 ，（2）在NaOH水溶液中后水解球形颗粒，（3）通过反复洗涤和真空汽提纯化球形颗粒。

公开(公告)号：US5135714A

公开(公告)日：1992-08-04

申请号：US490209

申请日：1990-03-08

申请人： James J. Wang

发明人： James J. Wang

IPC分类号： B65B55/04 ,  B65B55/10

CPC分类号： B65B55/04 ,  B65B55/103 ,  Y10S422/906

摘要： A process is provided for sterlizing a web of packaging materials which is to be formed into containers for aseptic packaging. The process comprises contacting the web with aqueous solution of ozone and hydrogen peroxide and subsequently irradiating the surface with ultra-violet radiation.

公开(公告)号：US5056106A

公开(公告)日：1991-10-08

申请号：US561579

申请日：1990-08-02

申请人： James J. Wang ,  Robert M. Grayson

发明人： James J. Wang ,  Robert M. Grayson

IPC分类号： A63B57/00 ,  A63B71/06 ,  G01S5/12

CPC分类号： A63B57/00 ,  G01S5/12 ,  A63B2102/32 ,  A63B2220/13 ,  A63B2220/14

摘要： The invention disclosed herein is directed to a method and apparatus which employs a spread-spectrum based radiolocation system, using hand-held receiver units and fixed-position reference transmitters, to determine distance and direction between a golfer and key locations on a golf course, such as the distance and direction to a particular pin. The plurality of timing reference transmitters which are located throughout the vicinity of the golf course broadcast a spread-spectrum ranging signal consisting of a radio-frequency carrier directly modulated by a periodic pseudo-noise (PN) coded or similar sequence. Each transmitter broadcasts at the same RF signal but a unique PN-coded sequence is assigned to each transmitter. Golfers are provided with the hand-held receiving unit which receives the transmitter spread-spectrum signals and which synchronizes to the spread-spectrum signals in order to obtain range estimates to a selected set of reference transmitters. The hand-held receivers also include memory to store the coordinates of the reference transmitters and the pin positions and other reference points for each hole on the golf course, which are either pre-loaded into memory or transmitted (as modulating data) with the ranging signal. Each hand-held unit also includes a digital processor which incorporates a hyperbolic location algorithm to compute the hand-held unit position based on the estimated ranges to the selected transmitters and the reference transmitter coordinates. The distance and direction from the current position to the pin or other selected reference points is then displayed via an appropriate medium on the hand-held unit.

摘要翻译： 本文公开的本发明涉及使用基于扩频的无线电定位系统的方法和装置，其使用手持式接收机单元和固定位置参考发射机来确定高尔夫球手与高尔夫球场上的关键位置之间的距离和方向， 例如到特定引脚的距离和方向。 位于高尔夫球场附近的多个定时参考发射机广播由由周期性伪噪声（PN）编码或类似序列直接调制的射频载波组成的扩频测距信号。 每个发射机以相同的RF信号广播，但是将唯一的PN编码序列分配给每个发射机。 高尔夫球手设置有手持式接收单元，其接收发射机扩频信号并与扩频信号同步，以便获得对所选择的一组参考发射机的距离估计。 手持式接收器还包括用于存储参考发射器的坐标的存储器，以及高尔夫球场上的每个孔的引脚位置和其他参考点，其被预先加载到存储器中或被传送（作为调制数据）与测距 信号。 每个手持单元还包括数字处理器，该数字处理器包含双曲线位置算法，以基于所选发射机的估计范围和参考发射机坐标来计算手持单元位置。 然后通过手持单元上的适当介质显示从当前位置到针或其他选定参考点的距离和方向。

公开(公告)号：US20110311708A1

公开(公告)日：2011-12-22

申请号：US12820535

申请日：2010-06-22

申请人： James J. Wang

发明人： James J. Wang

IPC分类号： A23L1/212 ,  A23L1/29

CPC分类号： A23L1/2128 ,  A23L2/02 ,  A23L2/52 ,  A23L19/09

摘要： The present invention relates to a process for making a dehydrated pulp slurry comprising the steps of de-sugaring a pulp slurry, said de-sugaring process producing a pulp slurry with substantially no sugar content, and dehydrating said pulp slurry. The dehydrated pulp slurry produced by this process is such that, when reconstituted, the color, shape, and texture of the pulp contained therein is substantially the same as it was prior to undergoing the dehydrating step.

摘要翻译： 本发明涉及一种制备脱水纸浆的方法，包括以下步骤：对纸浆进行脱糖，所述脱糖过程产生基本上不含糖含量的纸浆，并使所述纸浆脱水。 通过该方法生产的脱水浆浆使得当重新构成时，其中所含纸浆的颜色，形状和质地基本上与进行脱水步骤之前相同。

公开(公告)号：US20090152710A1

公开(公告)日：2009-06-18

申请号：US12350547

申请日：2009-01-08

申请人： James J. Wang ,  William G. McDonald

发明人： James J. Wang ,  William G. McDonald

IPC分类号： H01L23/02

CPC分类号： H01L23/4951 ,  H01L23/49541 ,  H01L23/49551 ,  H01L24/45 ,  H01L24/48 ,  H01L2224/06135 ,  H01L2224/06136 ,  H01L2224/32245 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/4826 ,  H01L2224/48465 ,  H01L2224/73215 ,  H01L2924/00014 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/1461 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/05599

摘要： Quad Flat No-Lead (QFN) packages are provided. An embodiment of a QFN package includes a semiconductor chip including an active surface and an inactive surface, a plurality of leads, a plurality of wire bonds configured to couple the plurality of leads to the semiconductor chip, and a mold material including a mounting side and having a perimeter. The active surface is oriented toward the mounting side, the plurality of wire bonds are disposed between the active surface and the mounting side within the mold material, and the plurality of leads are exposed on the mounting side and are at least partially encapsulated within the perimeter of the mold material.

摘要翻译： 提供四方扁平无铅（QFN）封装。 QFN封装的一个实施例包括半导体芯片，其包括有源表面和非活性表面，多个引线，被配置为将多个引线耦合到半导体芯片的多个引线键合，以及包括安装侧和 有一个周长。 活性表面朝向安装侧定向，多个引线接合位于模具材料内的活性表面和安装侧之间，并且多个引线在安装侧暴露并且至少部分地封装在周边内 的模具材料。

公开(公告)号：US20080099899A1

公开(公告)日：2008-05-01

申请号：US11590327

申请日：2006-10-31

申请人： James J. Wang ,  William G. McDonald

发明人： James J. Wang ,  William G. McDonald

IPC分类号： H01L23/02

CPC分类号： H01L23/4951 ,  H01L23/49541 ,  H01L23/49551 ,  H01L24/45 ,  H01L24/48 ,  H01L2224/06135 ,  H01L2224/06136 ,  H01L2224/32245 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/4826 ,  H01L2224/48465 ,  H01L2224/73215 ,  H01L2924/00014 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/1461 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/05599

摘要： Methods and apparatus are provided for decreasing the size of Quad Flat No-Lead (QFN) packages (300, 400) down to chip-scale packages. Such QFN packages include a first semiconductor chip (310, 410), a plurality of recessed leads (306, 406, 408, 411) having mold lock features, and a mold material 340, 440 substantially encasing all sides of the semiconductor chip. An active surface (314, 414) of the semiconductor chip is oriented toward a mounting side (307, 407) of the QFN package, and a plurality of wire bonds 330, 430 disposed between the active surface and the mounting side couple the active side to the leads. The QFN packages may also include a second semiconductor chip (452) coupled to a plurality of leads (408) and to the first semiconductor chip via wire bonds (431, 432) in a manner similar to the first semiconductor chip.

摘要翻译： 提供了将Quad Flat No-Lead（QFN）封装（300,400）的尺寸缩小到芯片级封装的方法和装置。 这种QFN封装包括第一半导体芯片（310,410），具有模具锁定特征的多个凹陷引线（306,406,408,411）以及基本上封装半导体芯片的所有侧面的模具材料340,440。 半导体芯片的有源表面（314,414）朝向QFN封装的安装侧（307,407）取向，并且设置在有源表面和安装侧之间的多个引线接合330,430将活动侧 到线索 QFN封装还可以包括以类似于第一半导体芯片的方式通过引线键合（431,432）耦合到多个引线（408）的第二半导体芯片（452）和第一半导体芯片（431）。

公开(公告)号：US07132303B2

公开(公告)日：2006-11-07

申请号：US10739605

申请日：2003-12-18

申请人： James J. Wang ,  Alan J. Magnus ,  Justin E. Poarch

发明人： James J. Wang ,  Alan J. Magnus ,  Justin E. Poarch

IPC分类号： H01L21/00

CPC分类号： H01L24/10 ,  H01L22/32 ,  H01L24/13 ,  H01L24/81 ,  H01L24/94 ,  H01L2224/13 ,  H01L2224/1308 ,  H01L2224/13082 ,  H01L2224/131 ,  H01L2224/13111 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/16145 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/81011 ,  H01L2224/81801 ,  H01L2924/00013 ,  H01L2924/01013 ,  H01L2924/01022 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/04941 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/19043 ,  H01L2924/00014 ,  H01L2224/13099 ,  H01L2924/00 ,  H01L2924/00012

摘要： One embodiment relates to using a robust metal layer of a semiconductor device to form landing pads. In one embodiment, a sputterable, nonwettable refractory metal is used as a solder mask for the landing pads. A second device may then be coupled to the robust metal layer landing pads of the semiconductor device. In one embodiment, the landing pads are formed while the semiconductor device is in wafer form, and a second device is then coupled to the landing pads of each of the plurality of semiconductor devices within the wafer, such that each semiconductor device within the wafer is electrically coupled to a second device. In this manner, each semiconductor device within the wafer and its corresponding second device may be probed and tested as a system. After probing and testing, the wafer may be singulated into a plurality of individual device assemblies which may then be packaged.

摘要翻译： 一个实施例涉及使用半导体器件的坚固的金属层来形成着陆焊盘。 在一个实施例中，使用可溅射的不可润湿的难熔金属作为着陆焊盘的焊接掩模。 然后可以将第二器件耦合到半导体器件的坚固的金属层着陆焊盘。 在一个实施例中，在半导体器件处于晶片形式的同时形成着陆焊盘，然后将第二器件耦合到晶片内的多个半导体器件的每个的着陆焊盘，使得晶片内的每个半导体器件 电耦合到第二装置。 以这种方式，可以将晶片内的每个半导体器件及其对应的第二器件作为系统进行探测和测试。 在探测和测试之后，晶片可以被分成多个单独的器件组件，然后可以将其封装。