摘要:
Methods are provided for forming Quad Flat No-Lead (QFN) packages. An embodiment includes disposing an active side of a semiconductor chip on a plurality of leads, coupling a plurality of wire bonds to the active side of the semiconductor chip, coupling the plurality of wire bonds to the plurality of leads in a space between the active side and the plurality of leads, and encasing the semiconductor chip, at least a portion of each of the plurality of leads, and the plurality of wire bonds in a mold material to define a mounting side of the QFN package. The mounting side has a perimeter, the plurality of leads are oriented on and exposed on the mounting side within the perimeter, and the plurality of wire bonds are oriented between the active side and the mounting side within the mold material.
摘要:
A cosmetic composition is disclosed containing hydrophilic, spherical powder of polymethylsilsesquioxane having a particle size ranged from 1-20 microns with a narrow particle size distribution. The hydrophilic, spherical powder in the composition is prepared by a process comprising (1) hydrolyzing and condensing methyltrimethoxysilane in water in the presence of a thickener as suspending agent, an oil as surface tension modifier and an acid or base as catalyst to form spherical particles, (2) post-hydrolyzing the spherical particles in an aqueous NaOH solution and (3) purifying the spherical particles by repeated washing and vacuum stripping.
摘要:
A process is provided for sterlizing a web of packaging materials which is to be formed into containers for aseptic packaging. The process comprises contacting the web with aqueous solution of ozone and hydrogen peroxide and subsequently irradiating the surface with ultra-violet radiation.
摘要:
The invention disclosed herein is directed to a method and apparatus which employs a spread-spectrum based radiolocation system, using hand-held receiver units and fixed-position reference transmitters, to determine distance and direction between a golfer and key locations on a golf course, such as the distance and direction to a particular pin. The plurality of timing reference transmitters which are located throughout the vicinity of the golf course broadcast a spread-spectrum ranging signal consisting of a radio-frequency carrier directly modulated by a periodic pseudo-noise (PN) coded or similar sequence. Each transmitter broadcasts at the same RF signal but a unique PN-coded sequence is assigned to each transmitter. Golfers are provided with the hand-held receiving unit which receives the transmitter spread-spectrum signals and which synchronizes to the spread-spectrum signals in order to obtain range estimates to a selected set of reference transmitters. The hand-held receivers also include memory to store the coordinates of the reference transmitters and the pin positions and other reference points for each hole on the golf course, which are either pre-loaded into memory or transmitted (as modulating data) with the ranging signal. Each hand-held unit also includes a digital processor which incorporates a hyperbolic location algorithm to compute the hand-held unit position based on the estimated ranges to the selected transmitters and the reference transmitter coordinates. The distance and direction from the current position to the pin or other selected reference points is then displayed via an appropriate medium on the hand-held unit.
摘要:
Methods are provided for forming Quad Flat No-Lead (QFN) packages. An embodiment includes disposing an active side of a semiconductor chip on a plurality of leads, coupling a plurality of wire bonds to the active side of the semiconductor chip, coupling the plurality of wire bonds to the plurality of leads in a space between the active side and the plurality of leads, and encasing the semiconductor chip, at least a portion of each of the plurality of leads, and the plurality of wire bonds in a mold material to define a mounting side of the QFN package. The mounting side has a perimeter, the plurality of leads are oriented on and exposed on the mounting side within the perimeter, and the plurality of wire bonds are oriented between the active side and the mounting side within the mold material.
摘要:
The present invention relates to a process for making a dehydrated pulp slurry comprising the steps of de-sugaring a pulp slurry, said de-sugaring process producing a pulp slurry with substantially no sugar content, and dehydrating said pulp slurry. The dehydrated pulp slurry produced by this process is such that, when reconstituted, the color, shape, and texture of the pulp contained therein is substantially the same as it was prior to undergoing the dehydrating step.
摘要:
Quad Flat No-Lead (QFN) packages are provided. An embodiment of a QFN package includes a semiconductor chip including an active surface and an inactive surface, a plurality of leads, a plurality of wire bonds configured to couple the plurality of leads to the semiconductor chip, and a mold material including a mounting side and having a perimeter. The active surface is oriented toward the mounting side, the plurality of wire bonds are disposed between the active surface and the mounting side within the mold material, and the plurality of leads are exposed on the mounting side and are at least partially encapsulated within the perimeter of the mold material.
摘要:
A valve assembly for filling containers with metered quantities of materials includes a valve body having a chamber therein, the valve body having open-top and bottom ends with substantially smooth interior sidewalls defining the chamber. A valve element for opening and closing the openable bottom end of the valve body is disposed in the chamber adjacent to the openable bottom end. An actuator device, including a pair of air cylinders, provides for relative movement between a lower portion of the valve body in which the openable bottom end is disposed and the valve element in order to open and close the openable bottom end. A concentric sleeve is telescopically connected to the bottom portion of the main valve body, and is reciprocably movable in response to actuation of the air cylinders to open and close the valve.
摘要:
A wax (13) dissolved in solvent is placed on a semiconductor wafer (12) and made uniform. An assembly is formed by bonding the semiconductor wafer (12) to a submount (17) with a uniform wax layer (14). The submount (17) supports and allows handling of the semiconductor wafer (12) during wafer process steps. The assembly is heated in a vacuum to remove solvent and air trapped in the uniform wax layer (14) thereby minimizing air voids which can cause a non-uniform bond. The assembly is then annealed to reduce stress on the semiconductor wafer (12) induced by differing material thermal expansion rates of the semiconductor wafer (12), the uniform wax layer (14), and the submount (17).
摘要:
The present invention relates to a process for making a dehydrated pulp slurry comprising the steps of de-sugaring a pulp slurry, said de-sugaring process producing a pulp slurry with substantially no sugar content, and dehydrating said pulp slurry. The dehydrated pulp slurry produced by this process is such that, when reconstituted, the color, shape, and texture of the pulp contained therein is substantially the same as it was prior to undergoing the dehydrating step.