-
1.发明授权Encapsulated metal microtip microplasma devices, arrays and fabrication methods 有权封装的金属微尖端微型器件，阵列和制造方法公开(公告)号：US08547004B2
公开(公告)日：2013-10-01
申请号：US13188715
申请日：2011-07-22
Applicant: J. Gary Eden , Sung-Jin Park , JeKwon Yoon , Brian Chung
Inventor： J. Gary Eden , Sung-Jin Park , JeKwon Yoon , Brian Chung
CPC classification number: H01T21/00 , B01D53/32 , B01D2257/104 , B01D2257/91 , B01D2258/06 , B01D2259/818 , C01B13/10 , C02F1/32 , C02F1/4608 , C02F1/46109 , C02F1/48 , C02F1/78 , C02F2001/46133 , C02F2001/46152 , C02F2303/04 , H05H1/2406 , H05H2001/2418 , H05H2245/121
Abstract: An embodiment of the invention is a microtip microplasma device having a first metal microtip opposing a second metal microtip with a gap therebetween. The first and second metal microtips are encapsulated in metal oxide that electrically isolates and physically connects the first and second metal microtips. In preferred devices, the first and second metal microtips and metal oxide comprise a monolithic, unitary structure. Arrays can be flexible, can be arranged in stacks, and can be formed into cylinders, for example, for gas and liquid processing devices, air filters and other applications. A preferred method of to forming an array of microtip microplasma devices provides a metal mesh with an array of micro openings therein. Electrode areas of the metal mesh are masked leaving planned connecting metal oxide areas of the metal mesh unmasked. Planned connecting metal oxide areas are electrochemically etched to convert the planned connecting metal oxide areas to metal oxide that encapsulates opposing metal microtips therein. The mask is removed. The electrode areas are electrochemically etched to encapsulate the electrode areas in metal oxide.
Abstract translation: 本发明的一个实施例是一种微尖端微型装置，其具有与第二金属微尖端相对的第一金属微尖端，其间具有间隙。 第一和第二金属微尖端被封装在金属氧化物中，其电隔离并物理地连接第一和第二金属微尖端。 在优选的装置中，第一和第二金属微尖端和金属氧化物包括整体的单一结构。 阵列可以是柔性的，可以堆叠布置，并且可以形成为气缸，例如用于气体和液体处理装置，空气过滤器等应用。 形成微尖锐微量器件阵列的优选方法提供了金属网，其中具有微孔开口阵列。 金属网的电极区域被掩蔽，留下金属网的计划连接的金属氧化物区域未被掩蔽。 计算的连接金属氧化物区域进行电化学蚀刻，以将计划的连接金属氧化物区域转换成在其中封装相对的金属微尖端的金属氧化物。 去除面具。 电化学蚀刻电极区域以将电极区域包封在金属氧化物中。
-
2.发明申请ENCAPSULATED METAL MICROTIP MICROPLASMA DEVICES, ARRAYS AND FABRICATION METHODS 有权包埋金属微孔微波器件，阵列和制造方法公开(公告)号：US20120074830A1
公开(公告)日：2012-03-29
申请号：US13188715
申请日：2011-07-22
Applicant: J. Gary Eden , Sung-Jin Park , JeKwon Yoon , Brian Chung
Inventor： J. Gary Eden , Sung-Jin Park , JeKwon Yoon , Brian Chung
CPC classification number: H01T21/00 , B01D53/32 , B01D2257/104 , B01D2257/91 , B01D2258/06 , B01D2259/818 , C01B13/10 , C02F1/32 , C02F1/4608 , C02F1/46109 , C02F1/48 , C02F1/78 , C02F2001/46133 , C02F2001/46152 , C02F2303/04 , H05H1/2406 , H05H2001/2418 , H05H2245/121
Abstract: An embodiment of the invention is a microtip microplasma device having a first metal microtip opposing a second metal microtip with a gap therebetween. The first and second metal microtips are encapsulated in metal oxide that electrically isolates and physically connects the first and second metal microtips. In preferred devices, the first and second metal microtips and metal oxide comprise a monolithic, unitary structure. Arrays can be flexible, can be arranged in stacks, and can be formed into cylinders, for example, for gas and liquid processing devices, air filters and other applications. A preferred method of to forming an array of microtip microplasma devices provides a metal mesh with an array of micro openings therein. Electrode areas of the metal mesh are masked leaving planned connecting metal oxide areas of the metal mesh unmasked. Planned connecting metal oxide areas are electrochemically etched to convert the planned connecting metal oxide areas to metal oxide that encapsulates opposing metal microtips therein. The mask is removed. The electrode areas are electrochemically etched to encapsulate the electrode areas in metal oxide.
Abstract translation: 本发明的一个实施例是一种微尖端微型装置，其具有与第二金属微尖端相对的第一金属微尖端，其间具有间隙。 第一和第二金属微尖端被封装在金属氧化物中，其电隔离并物理地连接第一和第二金属微尖端。 在优选的装置中，第一和第二金属微尖端和金属氧化物包括整体的单一结构。 阵列可以是柔性的，可以堆叠布置，并且可以形成为气缸，例如用于气体和液体处理装置，空气过滤器等应用。 形成微尖锐微量器件阵列的优选方法提供了金属网，其中具有微孔开口阵列。 金属网的电极区域被掩蔽，留下金属网的计划连接的金属氧化物区域未被掩蔽。 计算的连接金属氧化物区域进行电化学蚀刻，以将计划的连接金属氧化物区域转换成在其中封装相对的金属微尖端的金属氧化物。 去除面具。 电化学蚀刻电极区域以将电极区域包封在金属氧化物中。
-
3.发明申请VARIABLE ELECTRIC FIELD STRENGTH METAL AND METAL OXIDE MICROPLASMA LAMPS AND FABRICATION 有权可变电场强度金属和金属氧化物微波炉和制造公开(公告)号：US20110148282A1
公开(公告)日：2011-06-23
申请号：US12640884
申请日：2009-12-17
Applicant: J. Gary Eden , Sung-Jin Park , Jason D. Readle , Jekwon Yoon , Andrew Price , Jeffrey Putney
Inventor： J. Gary Eden , Sung-Jin Park , Jason D. Readle , Jekwon Yoon , Andrew Price , Jeffrey Putney
CPC classification number: H01J17/49 , H01J17/16 , H01J65/046
Abstract: Preferred embodiments of the invention provide microcavity plasma lamps having a plurality of metal and metal oxide layers defining a plurality of arrays of microcavities and encapsulated thin metal electrodes. Packaging encloses the plurality of metal and metal oxide layers in plasma medium. The metal and metal oxide layers are configured and arranged to vary the electric field strength and total gas pressure (E/p) in the lamp. The invention also provides methods of manufacturing a microcavity plasma lamp that simultaneously evacuate the volume within the packaging and a volume surrounding the packaging to maintain an insignificant or zero pressure differential across the packaging. The packaging is backfilled with a plasma medium while also maintaining an insignificant or zero pressure differential across the packaging.
Abstract translation: 本发明的优选实施例提供了具有限定多个微腔阵列和封装的薄金属电极的多个金属和金属氧化物层的微腔等离子体灯。 包装在等离子体介质中包围多个金属和金属氧化物层。 金属和金属氧化物层被配置和布置成改变灯中的电场强度和总气体压力（E / p）。 本发明还提供了制造微腔等离子体灯的方法，其同时抽空包装内的体积和围绕包装的体积，以保持整个包装上的微不足道或零压差。 包装用等离子体介质回填，同时在整个包装上保持不显着或零压差。
-
公开(公告)号：US09659737B2
公开(公告)日：2017-05-23
申请号：US13183255
申请日：2011-07-14
Applicant: J. Gary Eden , Sung-Jin Park , JeKwon Yoon , Kwang-Soo Kim
Inventor： J. Gary Eden , Sung-Jin Park , JeKwon Yoon , Kwang-Soo Kim
CPC classification number: H01J29/20 , H01J9/222 , H01J61/44 , Y10T428/24421
Abstract: Microstructured, irregular surfaces pose special challenges but coatings of the invention can uniformly coat irregular and microstructured surfaces with one or more thin layers of phosphor. Preferred embodiment coatings are used in microcavity plasma devices and the substrate is, for example, a device electrode with a patterned and microstructured dielectric surface. A method for forming a thin encapsulated phosphor coating of the invention applies a uniform paste of metal or polymer layer to the substrate. In another embodiment, a low temperature melting point metal is deposited on the substrate. Polymer particles are deposited on a metal layer, or a mixture of a phosphor particles and a solvent are deposited onto the uniform glass, metal or polymer layer. Sequential soft and hard baking with temperatures controlled to drive off the solvent will then soften or melt the lowest melting point constituents of the glass, metal or polymer layer, partially or fully embed the phosphor particles into glass, polymer, or metal layers, which partially or fully encapsulate the phosphor particles and/or serve to anchor the particles to a surface.
-
5.发明授权Variable electric field strength metal and metal oxide microplasma lamps and fabrication 有权可变电场强度金属和金属氧化物微米灯和制造公开(公告)号：US08541946B2
公开(公告)日：2013-09-24
申请号：US12640884
申请日：2009-12-17
Applicant: J. Gary Eden , Sung-Jin Park , Jason D. Readle , Jekwon Yoon , Andrew Price , Jeffrey Putney
Inventor： J. Gary Eden , Sung-Jin Park , Jason D. Readle , Jekwon Yoon , Andrew Price , Jeffrey Putney
IPC: H01J17/04
CPC classification number: H01J17/49 , H01J17/16 , H01J65/046
Abstract: Preferred embodiments of the invention provide microcavity plasma lamps having a plurality of metal and metal oxide layers defining a plurality of arrays of microcavities and encapsulated thin metal electrodes. Packaging encloses the plurality of metal and metal oxide layers in plasma medium. The metal and metal oxide layers are configured and arranged to vary the electric field strength and total gas pressure (E/p) in the lamp. The invention also provides methods of manufacturing a microcavity plasma lamp that simultaneously evacuate the volume within the packaging and a volume surrounding the packaging to maintain an insignificant or zero pressure differential across the packaging. The packaging is backfilled with a plasma medium while also maintaining an insignificant or zero pressure differential across the packaging.
Abstract translation: 本发明的优选实施例提供了具有限定多个微腔阵列和封装的薄金属电极的多个金属和金属氧化物层的微腔等离子体灯。 包装在等离子体介质中包围多个金属和金属氧化物层。 金属和金属氧化物层被配置和布置成改变灯中的电场强度和总气体压力（E / p）。 本发明还提供了制造微腔等离子体灯的方法，其同时抽空包装内的体积和围绕包装的体积，以保持整个包装上的微不足道或零压差。 包装用等离子体介质回填，同时在整个包装上保持不显着或零压差。
-
Patent Agency Ranking
6.发明申请PHOSPHOR COATING FOR IRREGULAR SURFACES AND METHOD FOR CREATING PHOSPHOR COATINGS 有权用于非正式表面的磷光涂料和创建磷酸盐涂层的方法公开(公告)号：US20120025696A1
公开(公告)日：2012-02-02
申请号：US13183255
申请日：2011-07-14
Applicant: J. Gary Eden , Sung-Jin Park , JeKwon Yoon , Kwang-Soo Kim
Inventor： J. Gary Eden , Sung-Jin Park , JeKwon Yoon , Kwang-Soo Kim
CPC classification number: H01J29/20 , H01J9/222 , H01J61/44 , Y10T428/24421
Abstract: Microstructured, irregular surfaces pose special challenges but coatings of the invention can uniformly coat irregular and microstructured surfaces with one or more thin layers of phosphor. Preferred embodiment coatings are used in microcavity plasma devices and the substrate is, for example, a device electrode with a patterned and microstructured dielectric surface. A method for forming a thin encapsulated phosphor coating of the invention applies a uniform paste of metal or polymer layer to the substrate. In another embodiment, a low temperature melting point metal is deposited on the substrate. Polymer particles are deposited on a metal layer, or a mixture of a phosphor particles and a solvent are deposited onto the uniform glass, metal or polymer layer. Sequential soft and hard baking with temperatures controlled to drive off the solvent will then soften or melt the lowest melting point constituents of the glass, metal or polymer layer, partially or fully embed the phosphor particles into glass, polymer, or metal layers, which partially or fully encapsulate the phosphor particles and/or serve to anchor the particles to a surface.
Abstract translation: 微结构化的不规则表面构成特殊挑战，但是本发明的涂层可以用一层或多层磷光体均匀地涂覆不规则和微结构化的表面。 优选的实施方案涂层用于微腔等离子体装置，并且衬底是例如具有图案化和微结构化电介质表面的器件电极。 用于形成本发明的薄封装磷光体涂层的方法将均匀的金属或聚合物层糊料施加到基底上。 在另一个实施方案中，低温熔点金属沉积在基底上。 聚合物颗粒沉积在金属层上，或者将荧光体颗粒和溶剂的混合物沉积在均匀的玻璃，金属或聚合物层上。 随后温度控制以驱除溶剂的顺序软和硬烘烤将使玻璃，金属或聚合物层的最低熔点成分软化或熔化，部分或完全将磷光体颗粒嵌入玻璃，聚合物或金属层中，部分 或完全包封荧光体颗粒和/或用于将颗粒锚定到表面。
-
7.发明授权Arrays of metal and metal oxide microplasma devices with defect free oxide 有权具有缺陷氧化物的金属和金属氧化物微质体装置阵列公开(公告)号：US08968668B2
公开(公告)日：2015-03-03
申请号：US13527842
申请日：2012-06-20
Applicant: J. Gary Eden , Sung-Jin Park , Jin Hoon Cho , Seung Hoon Sung , Min Hwan Kim
Inventor： J. Gary Eden , Sung-Jin Park , Jin Hoon Cho , Seung Hoon Sung , Min Hwan Kim
CPC classification number: B01J19/0093 , B01J2219/00783 , B01J2219/00842 , B01J2219/00853 , B01J2219/00891 , C01B13/115 , C25D11/02 , C25D11/022 , C25D11/026 , C25D11/12 , C25D11/18 , C25D11/26 , H01J11/18 , H01J11/22 , H01J11/34 , H01J17/066 , H01J17/16 , H01J37/32055 , H05H2001/2412 , H05H2001/2418
Abstract: A microplasma device of the invention includes a microcavity or microchannel defined at least partially within a thick metal oxide layer consisting essentially of defect free oxide. Electrodes are arranged with respect to the microcavity or microchannel to stimulate plasma generation in said microcavity or microchannel upon application of suitable voltage and at least one of the electrodes is encapsulated within the thick metal oxide layer. Large arrays can be formed and are highly robust as lack of microcracks in the oxide avoid dielectric breakdown.
Abstract translation: 本发明的微血管装置包括至少部分地限定在基本上由无缺氧氧化物组成的厚金属氧化物层内的微腔或微通道。 电极相对于微腔或微通道布置，以在施加适当电压时刺激所述微腔或微通道中的等离子体产生，并且至少一个电极被封装在厚金属氧化物层内。 可以形成大阵列，并且由于在氧化物中缺少微裂纹以避免电介质击穿，因此它们具有很强的鲁棒性。
-
8.发明申请公开(公告)号：US20110181169A1
公开(公告)日：2011-07-28
申请号：US12991237
申请日：2009-05-14
Applicant: J. Gary Eden , Sung-Jin Park , Taek-Lim Kim , Kwang-Soo Kim
Inventor： J. Gary Eden , Sung-Jin Park , Taek-Lim Kim , Kwang-Soo Kim
CPC classification number: H05H1/24 , H01J11/36 , H01J61/86 , H05H1/2406 , H05H2001/2418
Abstract: An array of microcavity plasma devices is formed in a unitary sheet of oxide with embedded microcavities or microchannels and embedded metal driving electrodes isolated by oxide from the microcavities or microchannels and arranged so as to generate sustain a plasma in the embedded microcavities or microchannels upon application of time-varying voltage when a plasma medium is contained in the microcavities or microchannels.
Abstract translation: 微腔等离子体装置的阵列形成在具有嵌入的微腔或微通道的一体的氧化物片和由微腔或微通道中的氧化物隔离的嵌入的金属驱动电极中，并且被布置成在施加了微腔或微通道时在嵌入的微腔或微通道中产生维持等离子体 当等离子体介质包含在微通道或微通道中时，具有时变电压。
-
公开(公告)号：US20100296978A1
公开(公告)日：2010-11-25
申请号：US12682977
申请日：2008-10-27
Applicant: Sung-Jin Park , J. Gary Eden , Paoyei Chen , Paul A. Tchertchian , Thomas M. Spinka
Inventor： Sung-Jin Park , J. Gary Eden , Paoyei Chen , Paul A. Tchertchian , Thomas M. Spinka
CPC classification number: H01S3/05 , H01S3/03 , H01S3/063 , H01S3/09 , H01S3/0971
Abstract: The invention provides microchannel lasers having a microplasma gain medium. Lasers of the invention can be formed in semiconductor materials, and can also be formed in polymer materials. In a microlaser of the invention, high density plasmas are produced in microchannels. The microplasma acts as a gain medium with the electrodes sustaining the plasma in the microchannel. Reflectors are used with the microchannel for obtaining optical feedback to obtain lasing in the microplasma gain medium in devices of the invention for a wide range of atomic and molecular species. Several atomic and molecular gain media will produce sufficiently high gain coefficients that reflectors (mirrors) are not necessary. Microlasers of the invention are based on microplasma generation in channels of various geometries. Preferred embodiment microlaser designs can be fabricated in semiconductor materials, such as Si wafers, by standard photolithographic techniques, or in polymers by replica molding.
Abstract translation: 本发明提供了具有微质增益介质的微通道激光器。 本发明的激光器可以形成在半导体材料中，也可以形成在聚合物材料中。 在本发明的微型激光器中，在微通道中产生高密度等离子体。 微量体作为增益介质，其中电极在微通道中维持等离子体。 反射器与微通道一起使用以获得光学反馈，以在广泛的原子和分子物种的本发明装置中的微量级增益介质中获得激光。 几个原子和分子增益介质将产生足够高的增益系数，反射器（反射镜）不是必需的。 本发明的微型扫描器基于各种几何形状的通道中的微量生成。 优选实施例微激光器设计可以通过标准光刻技术在半导体材料（例如Si晶片）中或通过复制成型制成聚合物。
-
10.发明授权Addressable microplasma devices and arrays with buried electrodes in ceramic 有权可寻址微型器件和阵列，其中埋置电极在陶瓷中公开(公告)号：US07642720B2
公开(公告)日：2010-01-05
申请号：US11337969
申请日：2006-01-23
Applicant: J. Gary Eden , Sung-Jin Park
Inventor： J. Gary Eden , Sung-Jin Park
CPC classification number: H01J11/18 , H05H1/2406 , H05H2001/2418 , H05H2001/2437
Abstract: An array of microcavity plasma devices is formed in a ceramic substrate that provides structure for and isolation of an array of microcavities that are defined in the ceramic substrate. The ceramic substrate isolates the microcavities from electrodes disposed within the ceramic substrate. The electrodes are disposed to ignite a discharge in microcavities in the array of microcavities upon application of a time-varying potential between the electrodes. Embodiments of the invention include electrode and microcavity arrangements that permit addressing of individual microcavities or groups of microcavities. The contour of the microcavity wall allows for the electric field within the microcavity to be shaped.
Abstract translation: 在陶瓷衬底中形成微腔等离子体器件的阵列，其提供在陶瓷衬底中限定的微腔阵列的结构和隔离。 陶瓷衬底将微腔与设置在陶瓷衬底内的电极隔离。 电极被设置成在施加电极之间的时变电位时，以微腔阵列中的微腔中点燃放电。 本发明的实施例包括允许寻址单个微腔或微腔组的电极和微腔布置。 微腔壁的轮廓允许微腔内的电场成形。
-
-
-
-
-
-
-
-
-
Search Results
73
records
(took 0.046 seconds)
