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公开(公告)号：US20130284495A1
公开(公告)日：2013-10-31
申请号：US13932070
申请日：2013-07-01
发明人： Charles L. Arvin , Alexandre Blander , Peter J. Brofman , Donald W. Henderson , Gareth G. Hougham , Hsichang Liu , Eric D. Perfecto , Srinivasa S.N. Reddy , Krystyna W. Semkow , Kamalesh K. Srivastava , Brian R. Sundlof , Julien Sylvestre , Renee L. Weisman
CPC分类号： H01B1/02 , B23K35/0244 , B23K35/262 , B23K35/36 , B23K35/3602 , B82Y30/00 , C22C13/00 , H01B13/00 , H01L23/49866 , H01L2924/0002 , H05K3/3436 , H05K3/3463 , H05K2201/0209 , H05K2201/0257 , Y10T29/49117 , H01L2924/00
摘要： In one embodiment of the present invention, inert nano-sized particles having dimensions from 1 nm to 1,000 nm are added into a solder ball. The inert nano-sized particles may comprise metal oxides, metal nitrides, metal carbides, metal borides, etc. The inert nano-sized particles may be a single compound, or may be a metallic material having a coating of a different material. In another embodiment of the present invention, a small quantity of at least one elemental metal that forms stable high melting intermetallic compound with tin is added to a solder ball. The added at least one elemental metal forms precipitates of intermetallic compounds with tin, which are dispersed as fine particles in the solder.
摘要翻译： 在本发明的一个实施方案中，将尺寸为1nm至1000nm的惰性纳米尺寸颗粒加入到焊球中。 惰性纳米尺寸颗粒可以包括金属氧化物，金属氮化物，金属碳化物，金属硼化物等。惰性纳米尺寸颗粒可以是单一化合物，或者可以是具有不同材料的涂层的金属材料。 在本发明的另一个实施方案中，将少量与锡形成稳定的高熔点金属间化合物的元素金属添加到焊料球中。 添加的至少一种元素金属与锡形成金属间化合物的沉淀物，其作为细颗粒分散在焊料中。
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公开(公告)号：US09373559B2
公开(公告)日：2016-06-21
申请号：US14197280
申请日：2014-03-05
IPC分类号： H01L21/56 , H01L23/31 , H01L23/498 , H01L25/065 , H01L23/00
CPC分类号： H01L23/3142 , H01L21/563 , H01L23/49838 , H01L24/13 , H01L24/16 , H01L24/17 , H01L24/27 , H01L24/29 , H01L24/73 , H01L24/81 , H01L24/83 , H01L24/92 , H01L25/0657 , H01L2224/0401 , H01L2224/131 , H01L2224/14131 , H01L2224/16145 , H01L2224/16148 , H01L2224/16225 , H01L2224/16227 , H01L2224/1703 , H01L2224/17181 , H01L2224/2732 , H01L2224/2755 , H01L2224/29036 , H01L2224/2919 , H01L2224/3201 , H01L2224/32145 , H01L2224/32225 , H01L2224/73104 , H01L2224/73204 , H01L2224/81191 , H01L2224/81203 , H01L2224/81801 , H01L2224/81815 , H01L2224/83102 , H01L2224/83191 , H01L2224/83947 , H01L2224/83951 , H01L2224/83986 , H01L2224/92125 , H01L2225/06513 , H01L2225/06517 , H01L2924/1431 , H01L2924/1434 , H01L2924/152 , H01L2924/15311 , H01L2924/182 , H01L2924/183 , H01L2924/351 , H01L2924/014 , H01L2924/00 , H01L2924/00012 , H01L2924/00014
摘要： The present invention relates generally to flip chip technology and more particularly, to a method and structure for reducing internal packaging stresses, improving adhesion properties, and reducing thermal resistance in flip chip packages by using more than one underfill material deposited in different regions of the flip chip interface. According to one embodiment, a method of forming a first underfill in an interior region of an interface such that a periphery region of the interface remains open, and forming a second underfill in the periphery region is disclosed.
摘要翻译： 本发明一般涉及倒装芯片技术，更具体地说，涉及一种用于减少内部封装应力，改善粘合性能以及通过使用沉积在翻盖的不同区域中的多于一个底部填充材料来降低倒装芯片封装中的热阻的方法和结构 芯片接口。 根据一个实施方案，公开了一种在界面的内部区域中形成第一底部填充物的方法，使得界面的外围区域保持开放，并且在周边区域中形成第二底部填充物。
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公开(公告)号：US08910853B2
公开(公告)日：2014-12-16
申请号：US13932070
申请日：2013-07-01
发明人： Charles L. Arvin , Alexandre Blander , Peter J. Brofman , Donald W. Henderson , Gareth G. Hougham , Hsichang Liu , Eric D. Perfecto , Srinivasa S.N. Reddy , Krystyna W. Semkow , Kamalesh K. Srivastava , Brian R. Sundlof , Julien Sylvestre , Renee L. Weisman
IPC分类号： B23K31/02 , H01L21/44 , B23K35/36 , C22C13/00 , B23K35/02 , B23K35/26 , H01L23/498 , H01B13/00 , H01B1/02 , H05K3/34 , B82Y30/00
CPC分类号： H01B1/02 , B23K35/0244 , B23K35/262 , B23K35/36 , B23K35/3602 , B82Y30/00 , C22C13/00 , H01B13/00 , H01L23/49866 , H01L2924/0002 , H05K3/3436 , H05K3/3463 , H05K2201/0209 , H05K2201/0257 , Y10T29/49117 , H01L2924/00
摘要： In one embodiment of the present invention, inert nano-sized particles having dimensions from 1 nm to 1,000 nm are added into a solder ball. The inert nano-sized particles may comprise metal oxides, metal nitrides, metal carbides, metal borides, etc. The inert nano-sized particles may be a single compound, or may be a metallic material having a coating of a different material. In another embodiment of the present invention, a small quantity of at least one elemental metal that forms stable high melting intermetallic compound with tin is added to a solder ball. The added at least one elemental metal forms precipitates of intermetallic compounds with tin, which are dispersed as fine particles in the solder.
摘要翻译： 在本发明的一个实施方案中，将尺寸为1nm至1000nm的惰性纳米尺寸颗粒加入到焊球中。 惰性纳米尺寸颗粒可以包括金属氧化物，金属氮化物，金属碳化物，金属硼化物等。惰性纳米尺寸颗粒可以是单一化合物，或者可以是具有不同材料的涂层的金属材料。 在本发明的另一个实施方案中，将少量与锡形成稳定的高熔点金属间化合物的元素金属添加到焊料球中。 添加的至少一种元素金属与锡形成金属间化合物的沉淀物，其作为细颗粒分散在焊料中。
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公开(公告)号：US20140124566A1
公开(公告)日：2014-05-08
申请号：US14149272
申请日：2014-01-07
CPC分类号： B23K31/02 , B23K1/0016 , B23K3/047 , B23K35/0222 , B23K37/04 , B23K2101/40 , H01L24/81 , H01L2924/10253 , H01L2924/1305 , H01L2924/15787 , H01L2924/00
摘要： A flip chip assembly apparatus includes at least one warpage-suppressor assembly. Each warpage-suppressor assembly can include a side heater, a deformable material pad, and an actuator assembly for moving the side heater and the deformable material pad. Each side heater provides additional heat to peripheral solder balls during bonding of two substrates, thereby facilitating the reflow of the peripheral solder balls. Each deformable material pad contacts, and presses down on, a surface of one of the two substrates under bonding. The deformable material pad(s) can prevent or minimize warpage of the contacted substrate.
摘要翻译： 倒装芯片组装装置包括至少一个翘曲抑制组件。 每个翘曲抑制组件可以包括侧加热器，可变形材料垫和用于移动侧加热器和可变形材料垫的致动器组件。 每个侧面加热器在两个基板的接合期间向外围焊球提供额外的热量，从而便于外围焊球的回流。 每个可变形材料焊盘在粘合下接触并压下两个基板之一的表面。 可变形材料垫可以防止或最小化接触的基底的翘曲。
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公开(公告)号：US20160049345A1
公开(公告)日：2016-02-18
申请号：US14925159
申请日：2015-10-28
IPC分类号： H01L23/31 , H01L23/00 , H01L25/065 , H01L23/498
CPC分类号： H01L23/3142 , H01L21/563 , H01L23/49838 , H01L24/13 , H01L24/16 , H01L24/17 , H01L24/27 , H01L24/29 , H01L24/73 , H01L24/81 , H01L24/83 , H01L24/92 , H01L25/0657 , H01L2224/0401 , H01L2224/131 , H01L2224/14131 , H01L2224/16145 , H01L2224/16148 , H01L2224/16225 , H01L2224/16227 , H01L2224/1703 , H01L2224/17181 , H01L2224/2732 , H01L2224/2755 , H01L2224/29036 , H01L2224/2919 , H01L2224/3201 , H01L2224/32145 , H01L2224/32225 , H01L2224/73104 , H01L2224/73204 , H01L2224/81191 , H01L2224/81203 , H01L2224/81801 , H01L2224/81815 , H01L2224/83102 , H01L2224/83191 , H01L2224/83947 , H01L2224/83951 , H01L2224/83986 , H01L2224/92125 , H01L2225/06513 , H01L2225/06517 , H01L2924/1431 , H01L2924/1434 , H01L2924/152 , H01L2924/15311 , H01L2924/182 , H01L2924/183 , H01L2924/351 , H01L2924/014 , H01L2924/00 , H01L2924/00012 , H01L2924/00014
摘要： The present invention relates generally to flip chip technology and more particularly, to a method and structure for reducing internal packaging stresses, improving adhesion properties, and reducing thermal resistance in flip chip packages by using more than one underfill material deposited in different regions of the flip chip interface. According to one embodiment, a method of forming a first underfill in an interior region of an interface such that a periphery region of the interface remains open, and forming a second underfill in the periphery region is disclosed.
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公开(公告)号：US20150255312A1
公开(公告)日：2015-09-10
申请号：US14197280
申请日：2014-03-05
CPC分类号： H01L23/3142 , H01L21/563 , H01L23/49838 , H01L24/13 , H01L24/16 , H01L24/17 , H01L24/27 , H01L24/29 , H01L24/73 , H01L24/81 , H01L24/83 , H01L24/92 , H01L25/0657 , H01L2224/0401 , H01L2224/131 , H01L2224/14131 , H01L2224/16145 , H01L2224/16148 , H01L2224/16225 , H01L2224/16227 , H01L2224/1703 , H01L2224/17181 , H01L2224/2732 , H01L2224/2755 , H01L2224/29036 , H01L2224/2919 , H01L2224/3201 , H01L2224/32145 , H01L2224/32225 , H01L2224/73104 , H01L2224/73204 , H01L2224/81191 , H01L2224/81203 , H01L2224/81801 , H01L2224/81815 , H01L2224/83102 , H01L2224/83191 , H01L2224/83947 , H01L2224/83951 , H01L2224/83986 , H01L2224/92125 , H01L2225/06513 , H01L2225/06517 , H01L2924/1431 , H01L2924/1434 , H01L2924/152 , H01L2924/15311 , H01L2924/182 , H01L2924/183 , H01L2924/351 , H01L2924/014 , H01L2924/00 , H01L2924/00012 , H01L2924/00014
摘要： The present invention relates generally to flip chip technology and more particularly, to a method and structure for reducing internal packaging stresses, improving adhesion properties, and reducing thermal resistance in flip chip packages by using more than one underfill material deposited in different regions of the flip chip interface. According to one embodiment, a method of forming a first underfill in an interior region of an interface such that a periphery region of the interface remains open, and forming a second underfill in the periphery region is disclosed.
摘要翻译： 本发明一般涉及倒装芯片技术，更具体地说，涉及一种用于减少内部封装应力，改善粘合性能以及通过使用沉积在翻盖的不同区域中的多于一个底部填充材料来降低倒装芯片封装中的热阻的方法和结构 芯片接口。 根据一个实施方案，公开了一种在界面的内部区域中形成第一底部填充物的方法，使得界面的外围区域保持开放，并且在周边区域中形成第二底部填充物。
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公开(公告)号：US09698072B2
公开(公告)日：2017-07-04
申请号：US14925159
申请日：2015-10-28
IPC分类号： H01L25/00 , H01L25/065 , H01L23/00 , H01L23/31 , H01L21/56 , H01L23/498
CPC分类号： H01L23/3142 , H01L21/563 , H01L23/49838 , H01L24/13 , H01L24/16 , H01L24/17 , H01L24/27 , H01L24/29 , H01L24/73 , H01L24/81 , H01L24/83 , H01L24/92 , H01L25/0657 , H01L2224/0401 , H01L2224/131 , H01L2224/14131 , H01L2224/16145 , H01L2224/16148 , H01L2224/16225 , H01L2224/16227 , H01L2224/1703 , H01L2224/17181 , H01L2224/2732 , H01L2224/2755 , H01L2224/29036 , H01L2224/2919 , H01L2224/3201 , H01L2224/32145 , H01L2224/32225 , H01L2224/73104 , H01L2224/73204 , H01L2224/81191 , H01L2224/81203 , H01L2224/81801 , H01L2224/81815 , H01L2224/83102 , H01L2224/83191 , H01L2224/83947 , H01L2224/83951 , H01L2224/83986 , H01L2224/92125 , H01L2225/06513 , H01L2225/06517 , H01L2924/1431 , H01L2924/1434 , H01L2924/152 , H01L2924/15311 , H01L2924/182 , H01L2924/183 , H01L2924/351 , H01L2924/014 , H01L2924/00 , H01L2924/00012 , H01L2924/00014
摘要： The present invention relates generally to flip chip technology and more particularly, to a method and structure for reducing internal packaging stresses, improving adhesion properties, and reducing thermal resistance in flip chip packages by using more than one underfill material deposited in different regions of the flip chip interface. According to one embodiment, a method of forming a first underfill in an interior region of an interface such that a periphery region of the interface remains open, and forming a second underfill in the periphery region is disclosed.
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公开(公告)号：US08978960B2
公开(公告)日：2015-03-17
申请号：US14149272
申请日：2014-01-07
CPC分类号： B23K31/02 , B23K1/0016 , B23K3/047 , B23K35/0222 , B23K37/04 , B23K2101/40 , H01L24/81 , H01L2924/10253 , H01L2924/1305 , H01L2924/15787 , H01L2924/00
摘要： A flip chip assembly apparatus includes at least one warpage-suppressor assembly. Each warpage-suppressor assembly can include a side heater, a deformable material pad, and an actuator assembly for moving the side heater and the deformable material pad. Each side heater provides additional heat to peripheral solder balls during bonding of two substrates, thereby facilitating the reflow of the peripheral solder balls. Each deformable material pad contacts, and presses down on, a surface of one of the two substrates under bonding. The deformable material pad(s) can prevent or minimize warpage of the contacted substrate.
摘要翻译： 倒装芯片组装装置包括至少一个翘曲抑制组件。 每个翘曲抑制组件可以包括侧加热器，可变形材料垫和用于移动侧加热器和可变形材料垫的致动器组件。 每个侧面加热器在两个基板的接合期间向外围焊球提供额外的热量，从而便于外围焊球的回流。 每个可变形材料焊盘在粘合下接触并压下两个基板之一的表面。 可变形材料垫可以防止或最小化接触的基底的翘曲。
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