LAND GRID ARRAY (LGA) SOCKET CARTRIDGE AND METHOD OF FORMING
    7.
    发明申请
    LAND GRID ARRAY (LGA) SOCKET CARTRIDGE AND METHOD OF FORMING 有权
    LAND GRID ARRAY(LGA)插座盒及其形成方法

    公开(公告)号:US20140206206A1

    公开(公告)日:2014-07-24

    申请号:US13745965

    申请日:2013-01-21

    IPC分类号: H01R12/16 H01R43/00

    摘要: Aspects of the present invention relate to land grid array socket cartridge structures. In one embodiment, a land grid array (LGA) cartridge structure includes: a deformable thin film having at least one aperture configured to hold a substantially liquid metal, whereby in a compressed state of the deformable thin film, the substantially liquid metal of the deformable thin film is configured to electro-mechanically couple a carrier and a socket base. Another embodiment includes a method of forming a LGA cartridge structure. The method includes: providing a deformable thin film having a first surface and a second surface, and forming at least one aperture within the deformable thin film through the first surface and the second surface, wherein the aperture is configured to hold a substantially liquid metal.

    摘要翻译: 本发明的方面涉及陆地阵列插座盒结构。 在一个实施例中,焊盘格栅阵列(LGA)暗盒结构包括:可变形薄膜,其具有构造成保持基本上液态金属的至少一个孔,由此在可变形薄膜的压缩状态下,基本上液态的可变形金属 薄膜构造成电 - 机械耦合载体和插座底座。 另一实施例包括形成LGA盒结构的方法。 该方法包括:提供具有第一表面和第二表面的可变形薄膜,以及通过所述第一表面和所述第二表面在所述可变形薄膜内形成至少一个孔,其中所述孔构造成保持基本上液态的金属。