Methods for Forming Back-Channel-Etch Devices with Copper-Based Electrodes
    6.
    发明申请
    Methods for Forming Back-Channel-Etch Devices with Copper-Based Electrodes 有权
    用铜基电极形成背沟槽蚀刻器件的方法

    公开(公告)号:US20140273341A1

    公开(公告)日:2014-09-18

    申请号:US14133421

    申请日:2013-12-18

    摘要: Embodiments described herein provide methods for forming indium-gallium-zinc oxide (IGZO) devices. A substrate is provided. An IGZO layer is formed above the substrate. A copper-containing layer is formed above the IGZO layer. A wet etch process is performed on the copper-containing layer to form a source region and a drain region above the IGZO layer. The performing of the wet etch process on the copper-containing layer includes exposing the copper-containing layer to an etching solution including a peroxide compound and one of citric acid, formic acid, malonic acid, lactic acid, etidronic acid, phosphonic acid, or a combination thereof.

    摘要翻译: 本文所述的实施方案提供了形成铟镓锌氧化物(IGZO)器件的方法。 提供基板。 在基板上形成IGZO层。 在IGZO层上形成含铜层。 在含铜层上进行湿式蚀刻处理,以在IGZO层上形成源极区域和漏极区域。 在含铜层上执行湿法蚀刻工艺包括将含铜层暴露于包括过氧化物化合物和柠檬酸,甲酸,丙二酸,乳酸,依替膦酸,膦酸或其中的一种的蚀刻溶液 其组合。

    Silicon Texturing Formulations
    7.
    发明申请
    Silicon Texturing Formulations 审中-公开
    硅纹制剂

    公开(公告)号:US20140231704A1

    公开(公告)日:2014-08-21

    申请号:US14261739

    申请日:2014-04-25

    IPC分类号: H01L31/0236

    摘要: The present disclosure includes a texture formulation that includes an aliphatic diol, an alkaline compound and water which provides a consistent textured region across a silicon surface suitable for solar cell applications. The current invention describes silicon texturing formulations that include at least one high boiling point additive. The high boiling point additive may be a derivative compound of propylene glycol or a derivative compound of ethylene glycol. Processes for texturing a crystalline silicon substrate using these formulations are also described. Additionally, a combinatorial method of optimizing the textured surface of a crystalline silicon substrate is described.

    摘要翻译: 本公开内容包括包含脂族二醇,碱性化合物和水的纹理制剂,其在适于太阳能电池应用的硅表面上提供一致的纹理区域。 本发明描述了包含至少一种高沸点添加剂的硅纹理配方。 高沸点添加剂可以是丙二醇或乙二醇的衍生化合物的衍生化合物。 还描述了使用这些制剂对晶体硅衬底进行纹理化的工艺。 另外,描述了优化结晶硅衬底的纹理表面的组合方法。

    Silicon texturing formulations
    9.
    发明授权
    Silicon texturing formulations 有权
    硅纹理配方

    公开(公告)号:US09099582B2

    公开(公告)日:2015-08-04

    申请号:US14261739

    申请日:2014-04-25

    摘要: The present disclosure includes a texture formulation that includes an aliphatic diol, an alkaline compound and water which provides a consistent textured region across a silicon surface suitable for solar cell applications. The current invention describes silicon texturing formulations that include at least one high boiling point additive. The high boiling point additive may be a derivative compound of propylene glycol or a derivative compound of ethylene glycol. Processes for texturing a crystalline silicon substrate using these formulations are also described. Additionally, a combinatorial method of optimizing the textured surface of a crystalline silicon substrate is described.

    摘要翻译: 本公开内容包括包含脂族二醇,碱性化合物和水的纹理制剂,其在适于太阳能电池应用的硅表面上提供一致的纹理区域。 本发明描述了包含至少一种高沸点添加剂的硅纹理配方。 高沸点添加剂可以是丙二醇或乙二醇的衍生化合物的衍生化合物。 还描述了使用这些制剂对晶体硅衬底进行纹理化的工艺。 另外,描述了优化结晶硅衬底的纹理表面的组合方法。