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1.发明授权Chip arrangement with a recessed chip housing region and a method for manufacturing the same 有权具有凹陷芯片壳体区域的芯片布置及其制造方法公开(公告)号：US09111947B2
公开(公告)日：2015-08-18
申请号：US13909158
申请日：2013-06-04
发明人： David O'Sullivan , Thorsten Meyer
CPC分类号： H01L21/56 , H01L21/561 , H01L21/568 , H01L23/3157 , H01L24/19 , H01L24/96 , H01L2224/04105 , H01L2224/12105 , H01L2224/1403 , H01L2224/16145 , H01L2224/16225 , H01L2924/12042 , H01L2924/181 , H01L2924/1815 , H01L2924/19104 , H01L2924/00
摘要： A chip arrangement may include: a semiconductor chip; an encapsulating structure at least partially encapsulating the semiconductor chip, the encapsulating structure having a first side and a second side opposite the first side, the encapsulating structure including a recess over the first side of the encapsulating structure, the recess having a bottom surface located at a first level; and at least one electrical connector disposed at the first side of the encapsulating structure outside the recess, wherein a surface of the at least one electrical connector facing the encapsulating structure may be disposed at a second level different from the first level.
摘要翻译： 芯片布置可以包括：半导体芯片; 至少部分地封装半导体芯片的封装结构，所述封装结构具有第一侧和与所述第一侧相对的第二侧，所述封装结构包括在所述封装结构的第一侧上的凹部，所述凹部具有位于 一级; 以及至少一个电连接器，其设置在所述封装结构的位于所述凹部外部的第一侧上，其中面向所述封装结构的所述至少一个电连接器的表面可以设置在与所述第一电平不同的第二电平处。
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公开(公告)号：US09646856B2
公开(公告)日：2017-05-09
申请号：US14715928
申请日：2015-05-19
IPC分类号： H01L21/02 , H01L21/304 , H01L21/56 , H01L23/31 , H01L23/00 , H01L21/311 , H01L21/683 , H01L21/78
CPC分类号： H01L21/561 , H01L21/02013 , H01L21/02016 , H01L21/304 , H01L21/311 , H01L21/56 , H01L21/568 , H01L21/6835 , H01L21/78 , H01L23/3107 , H01L23/3121 , H01L23/3135 , H01L23/3157 , H01L23/3185 , H01L24/02 , H01L24/13 , H01L24/19 , H01L24/20 , H01L24/96 , H01L2221/68327 , H01L2223/6677 , H01L2224/0231 , H01L2224/0401 , H01L2224/04105 , H01L2224/05548 , H01L2224/12105 , H01L2224/13022 , H01L2224/73267 , H01L2924/01029 , H01L2924/12042 , H01L2924/1461 , H01L2924/18162 , H01L2924/2064 , H01L2924/00
摘要： A method of manufacturing a device includes providing a semiconductor chip having a first face and a second face opposite to the first face with a contact pad arranged on the first face. The semiconductor chip is placed on a carrier with the first face facing the carrier. The semiconductor chip is encapsulated with an encapsulation material. The carrier is removed and the semiconductor material is removed from the second face of the first semiconductor chip without removing encapsulation material at the same time.
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3.发明申请SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE INCLUDING GRINDING SETS 有权半导体器件及制造包含研磨组的半导体器件的方法公开(公告)号：US20150262844A1
公开(公告)日：2015-09-17
申请号：US14715928
申请日：2015-05-19
IPC分类号： H01L21/56 , H01L23/00 , H01L23/31 , H01L21/304 , H01L21/311 , H01L21/78 , H01L21/683
CPC分类号： H01L21/561 , H01L21/02013 , H01L21/02016 , H01L21/304 , H01L21/311 , H01L21/56 , H01L21/568 , H01L21/6835 , H01L21/78 , H01L23/3107 , H01L23/3121 , H01L23/3135 , H01L23/3157 , H01L23/3185 , H01L24/02 , H01L24/13 , H01L24/19 , H01L24/20 , H01L24/96 , H01L2221/68327 , H01L2223/6677 , H01L2224/0231 , H01L2224/0401 , H01L2224/04105 , H01L2224/05548 , H01L2224/12105 , H01L2224/13022 , H01L2224/73267 , H01L2924/01029 , H01L2924/12042 , H01L2924/1461 , H01L2924/18162 , H01L2924/2064 , H01L2924/00
摘要： A method of manufacturing a device includes providing a semiconductor chip having a first face and a second face opposite to the first face with a contact pad arranged on the first face. The semiconductor chip is placed on a carrier with the first face facing the carrier. The semiconductor chip is encapsulated with an encapsulation material. The carrier is removed and the semiconductor material is removed from the second face of the first semiconductor chip without removing encapsulation material at the same time.
摘要翻译： 一种制造器件的方法包括提供具有第一面和与第一面相对的第二面的半导体芯片，其具有布置在第一面上的接触焊盘。 将半导体芯片放置在载体上，其第一面朝向载体。 半导体芯片用封装材料封装。 移除载体，并且半导体材料从第一半导体芯片的第二面去除，而不会同时去除封装材料。
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