公开(公告)号：US20240332153A1

公开(公告)日：2024-10-03

申请号：US18129880

申请日：2023-04-02

申请人： Intel Corporation

发明人： Tchefor NDUKUM ,  Yonggang LI ,  Rengarajan SHANMUGAM ,  Darko GRUJICIC ,  Deniz TURAN

IPC分类号： H01L23/498 ,  H01L21/48 ,  H01L23/15

CPC分类号： H01L23/49838 ,  H01L21/486 ,  H01L21/4864 ,  H01L23/15 ,  H01L23/49827 ,  H01L23/49866

摘要： Embodiments disclosed herein include electronic packages. In an embodiment, the electronic package comprises a substrate and a seed layer over the substrate. In an embodiment, sidewalls of the seed layer are sloped. In an embodiment, the electronic package further comprises a feature over the seed layer, where the feature is electrically conductive.

公开(公告)号：US20240181572A1

公开(公告)日：2024-06-06

申请号：US18060578

申请日：2022-12-01

申请人： Intel Corporation

发明人： Tchefor NDUKUM ,  Deniz TURAN ,  Yonggang LI

IPC分类号： B23K26/40 ,  B23K26/0622 ,  B23K26/082

CPC分类号： B23K26/40 ,  B23K26/0622 ,  B23K26/082 ,  B23K2101/40

摘要： The present disclosure generally relates to a method. The method may include providing a substrate and forming a seed layer on the substrate. The method may further include forming a first metal layer on selected portions of the seed layer to form exposed portions of the seed layer. The method may also include scanning a laser beam across the substrate to remove the exposed portions of the seed layer to form exposed portions of the substrate.