Invention Publication
- Patent Title: DRY SEED REMOVAL BY LASER FOR LINE-SPACE AND VIA FORMATION
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Application No.: US18129880Application Date: 2023-04-02
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Publication No.: US20240332153A1Publication Date: 2024-10-03
- Inventor: Tchefor NDUKUM , Yonggang LI , Rengarajan SHANMUGAM , Darko GRUJICIC , Deniz TURAN
- Applicant: Intel Corporation
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Main IPC: H01L23/498
- IPC: H01L23/498 ; H01L21/48 ; H01L23/15
Abstract:
Embodiments disclosed herein include electronic packages. In an embodiment, the electronic package comprises a substrate and a seed layer over the substrate. In an embodiment, sidewalls of the seed layer are sloped. In an embodiment, the electronic package further comprises a feature over the seed layer, where the feature is electrically conductive.
Information query
IPC分类:
