- 专利标题： DRY SEED REMOVAL BY LASER FOR LINE-SPACE AND VIA FORMATION
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申请号： US18129880申请日： 2023-04-02
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公开(公告)号： US20240332153A1公开(公告)日： 2024-10-03
- 发明人: Tchefor NDUKUM , Yonggang LI , Rengarajan SHANMUGAM , Darko GRUJICIC , Deniz TURAN
- 申请人： Intel Corporation
- 申请人地址： US CA Santa Clara
- 专利权人： Intel Corporation
- 当前专利权人： Intel Corporation
- 当前专利权人地址： US CA Santa Clara
- 主分类号： H01L23/498
- IPC分类号： H01L23/498 ; H01L21/48 ; H01L23/15
摘要：
Embodiments disclosed herein include electronic packages. In an embodiment, the electronic package comprises a substrate and a seed layer over the substrate. In an embodiment, sidewalls of the seed layer are sloped. In an embodiment, the electronic package further comprises a feature over the seed layer, where the feature is electrically conductive.
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