公开(公告)号：US20240332153A1

公开(公告)日：2024-10-03

申请号：US18129880

申请日：2023-04-02

申请人： Intel Corporation

发明人： Tchefor NDUKUM ,  Yonggang LI ,  Rengarajan SHANMUGAM ,  Darko GRUJICIC ,  Deniz TURAN

IPC分类号： H01L23/498 ,  H01L21/48 ,  H01L23/15

CPC分类号： H01L23/49838 ,  H01L21/486 ,  H01L21/4864 ,  H01L23/15 ,  H01L23/49827 ,  H01L23/49866

摘要： Embodiments disclosed herein include electronic packages. In an embodiment, the electronic package comprises a substrate and a seed layer over the substrate. In an embodiment, sidewalls of the seed layer are sloped. In an embodiment, the electronic package further comprises a feature over the seed layer, where the feature is electrically conductive.

公开(公告)号：US20240096678A1

公开(公告)日：2024-03-21

申请号：US17949258

申请日：2022-09-21

申请人： Intel Corporation

发明人： Deniz TURAN ,  Yosef KORNBLUTH ,  Yonggang LI

IPC分类号： H01L21/683 ,  H01L21/677

CPC分类号： H01L21/6833 ,  H01L21/67781

摘要： The present disclosure is directed to a carrier chuck having a base plate with a top surface, at least one electrode positioned in a first carrier region of the top surface and configured to produce an electrostatic force to retain a panel placed on the carrier chuck during panel processing, and a dielectric layer positioned over the at least one electrode. The at least one electrode extends from the top surface by a height of at least 20 um.

公开(公告)号：US20240181572A1

公开(公告)日：2024-06-06

申请号：US18060578

申请日：2022-12-01

申请人： Intel Corporation

发明人： Tchefor NDUKUM ,  Deniz TURAN ,  Yonggang LI

IPC分类号： B23K26/40 ,  B23K26/0622 ,  B23K26/082

CPC分类号： B23K26/40 ,  B23K26/0622 ,  B23K26/082 ,  B23K2101/40

摘要： The present disclosure generally relates to a method. The method may include providing a substrate and forming a seed layer on the substrate. The method may further include forming a first metal layer on selected portions of the seed layer to form exposed portions of the seed layer. The method may also include scanning a laser beam across the substrate to remove the exposed portions of the seed layer to form exposed portions of the substrate.

公开(公告)号：US20240178157A1

公开(公告)日：2024-05-30

申请号：US18071257

申请日：2022-11-29

申请人： Intel Corporation

发明人： Vinith BEJUGAM ,  Whitney BRYKS ,  Brandon C. MARIN ,  Vishal Bhimrao ZADE ,  Deniz TURAN ,  Srinivas V. PIETAMBARAM

IPC分类号： H01L23/00 ,  H01L23/498

CPC分类号： H01L23/562 ,  H01L23/49822

摘要： Embodiments disclosed herein include package substrates. In a particular embodiment, the package substrate comprises a core. The core may be a glass core. In an embodiment, buildup layers are provided over the core, and a shape memory polymer (SMP) is provided over the core.