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公开(公告)号：US11937367B2
公开(公告)日：2024-03-19
申请号：US18346313
申请日：2023-07-03
申请人： Intel Corporation
发明人： Sidharth Dalmia , Zhenguo Jiang , William J. Lambert , Kirthika Nahalingam , Swathi Vijayakumar
CPC分类号： H05K1/0243 , G06F1/1613 , H01F5/04 , H05K1/028 , H05K1/181 , H05K1/189 , G06F1/1626 , G06F1/163 , G06F2200/1631 , H01L25/16 , H04B1/40 , H05K2201/1006 , H05K2201/10098
摘要： Disclosed herein are radio frequency (RF) front-end structures, as well as related methods and devices. In some embodiments, an RF front-end package may include an RF package substrate including an embedded passive circuit element. At least a portion of the embedded passive circuit element may be included in a metal layer of the RF package substrate. The RF package substrate may also include a ground plane in the metal layer.
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公开(公告)号：US20230354508A1
公开(公告)日：2023-11-02
申请号：US18346313
申请日：2023-07-03
申请人： Intel Corporation
发明人： Sidharth Dalmia , Zhenguo Jiang , William J. Lambert , Kirthika Nahalingam , Swathi Vijayakumar
CPC分类号： H05K1/0243 , H05K1/028 , H05K1/181 , G06F1/1613 , H05K1/189 , H01F5/04 , H04B1/40
摘要： Disclosed herein are radio frequency (RF) front-end structures, as well as related methods and devices. In some embodiments, an RF front-end package may include an RF package substrate including an embedded passive circuit element. At least a portion of the embedded passive circuit element may be included in a metal layer of the RF package substrate. The RF package substrate may also include a ground plane in the metal layer.
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公开(公告)号：US20220278439A1
公开(公告)日：2022-09-01
申请号：US17739880
申请日：2022-05-09
申请人： Intel Corporation
发明人： Sidharth Dalmia , Jonathan Jensen , Ozgur Inac , Trang Thai , William J. Lambert , Benjamin Jann
摘要： Disclosed herein are integrated circuit (IC) packages, antenna boards, antenna modules, and communication devices (e.g., for millimeter wave communications). For example, in some embodiments, an antenna module may include: a logic die; a radio frequency front-end (RFFE) die in electrical communication with the logic die; and an antenna patch, wherein the RFFE die is closer to the antenna patch than the logic die is to the antenna patch.
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公开(公告)号：US20210391853A1
公开(公告)日：2021-12-16
申请号：US17255291
申请日：2018-12-28
申请人： Intel Corporation
发明人： Benjamin Jann , Ashoke Ravi , Satwik Patnaik , Elan Banin , Ofir Degani , Nebil Tanzi , Brandon Davis , Igal Kushnir , Jonathan Jensen , Sidharth Dalmia , Peter Pawliuk
摘要： Techniques are described related to digital radio control, partitioning, and operation. The various techniques described herein enable high-frequency local oscillator signal generation and frequency multiplication using radio-frequency (RF) digital to analog converters (RFDACs). The use of these components and others described throughout this disclosure allow for the realization of various improvements. For example, digital, analog, and hybrid beamforming control are implemented and the newly-enabled digital radio architecture partitioning enables radio components to be pushed to the radio head, allowing for the omission of high frequency cables and/or connectors.
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公开(公告)号：US20200253040A1
公开(公告)日：2020-08-06
申请号：US16268318
申请日：2019-02-05
申请人： Intel Corporation
发明人： Sidharth Dalmia , Zhenguo Jiang , William James Lambert , Kirthika Nahalingam , Swathi Vijayakumar
摘要： Disclosed herein are radio frequency (RF) front-end structures, as well as related methods and devices. In some embodiments, an RF front-end package may include an RF package substrate including an embedded passive circuit element. At least a portion of the embedded passive circuit element may be included in a metal layer of the RF package substrate. The RF package substrate may also include a ground plane in the metal layer.
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公开(公告)号：US20240164010A1
公开(公告)日：2024-05-16
申请号：US18418513
申请日：2024-01-22
申请人： Intel Corporation
发明人： Sidharth Dalmia , Zhenguo Jiang , William J. Lambert , Kirthika Nahalingam , Swathi Vijayakumar
CPC分类号： H05K1/0243 , G06F1/1613 , H01F5/04 , H05K1/028 , H05K1/181 , H05K1/189 , H04B1/40
摘要： Disclosed herein are radio frequency (RF) front-end structures, as well as related methods and devices. In some embodiments, an RF front-end package may include an RF package substrate including an embedded passive circuit element. At least a portion of the embedded passive circuit element may be included in a metal layer of the RF package substrate. The RF package substrate may also include a ground plane in the metal layer.
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公开(公告)号：US11955732B2
公开(公告)日：2024-04-09
申请号：US18089220
申请日：2022-12-27
申请人： Intel Corporation
发明人： Erkan Alpman , Arnaud Lucres Amadjikpe , Omer Asaf , Kameran Azadet , Rotem Banin , Miroslav Baryakh , Anat Bazov , Stefano Brenna , Bryan K. Casper , Anandaroop Chakrabarti , Gregory Chance , Debabani Choudhury , Emanuel Cohen , Claudio Da Silva , Sidharth Dalmia , Saeid Daneshgar Asl , Kaushik Dasgupta , Kunal Datta , Brandon Davis , Ofir Degani , Amr M. Fahim , Amit Freiman , Michael Genossar , Eran Gerson , Eyal Goldberger , Eshel Gordon , Meir Gordon , Josef Hagn , Shinwon Kang , Te Yu Kao , Noam Kogan , Mikko S. Komulainen , Igal Yehuda Kushnir , Saku Lahti , Mikko M. Lampinen , Naftali Landsberg , Wook Bong Lee , Run Levinger , Albert Molina , Resti Montoya Moreno , Tawfiq Musah , Nathan G. Narevsky , Hosein Nikopour , Oner Orhan , Georgios Palaskas , Stefano Pellerano , Ron Pongratz , Ashoke Ravi , Shmuel Ravid , Peter Andrew Sagazio , Eren Sasoglu , Lior Shakedd , Gadi Shor , Baljit Singh , Menashe Soffer , Ra'anan Sover , Shilpa Talwar , Nebil Tanzi , Moshe Teplitsky , Chintan S. Thakkar , Jayprakash Thakur , Avi Tsarfati , Yossi Tsfati , Marian Verhelst , Nir Weisman , Shuhei Yamada , Ana M. Yepes , Duncan Kitchin
IPC分类号： H01Q9/04 , H01Q1/24 , H01Q1/38 , H01Q1/48 , H01Q3/24 , H01Q5/47 , H01Q21/24 , H03L7/14 , H04B1/3827 , H04B7/0456 , H04B7/06 , H04B15/04
CPC分类号： H01Q9/0414 , H01Q1/243 , H01Q1/38 , H01Q1/48 , H01Q3/24 , H01Q5/47 , H01Q21/24 , H03L7/145 , H04B1/3827 , H04B7/0482 , H04B7/0639 , H04B15/04
摘要： Millimeter wave (mmWave) technology, apparatuses, and methods that relate to transceivers, receivers, and antenna structures for wireless communications are described. The various aspects include co-located millimeter wave (mmWave) and near-field communication (NFC) antennas, scalable phased array radio transceiver architecture (SPARTA), phased array distributed communication system with MIMO support and phase noise synchronization over a single coax cable, communicating RF signals over cable (RFoC) in a distributed phased array communication system, clock noise leakage reduction, IF-to-RF companion chip for backwards and forwards compatibility and modularity, on-package matching networks, 5G scalable receiver (Rx) architecture, among others.
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8.发明公开公开(公告)号：US20230276568A1
公开(公告)日：2023-08-31
申请号：US18157835
申请日：2023-01-22
申请人： INTEL CORPORATION
发明人： Ofer Markish , Sidharth Dalmia , Arnaud Amadjikpe
IPC分类号： H05K1/02 , H05K1/18 , H05K1/11 , G01S13/931 , G01S7/03
CPC分类号： H05K1/0242 , H05K1/181 , H05K1/116 , G01S13/931 , G01S7/032 , H05K2201/09609 , H05K2201/096 , H05K2201/10734
摘要： For example, an apparatus may include a Printed Circuit Board (PCB) including a Ball Grid Array (BGA) on a first side of the PCB, the BGA configured to connect a Surface Mounted Device (SMD) to the PCB; an antenna disposed on a second side of the PCB opposite to the first side, the antenna to communicate a Radio Frequency (RF) signal of the SMD; and an RF transition to transit the RF signal between the BGA and the antenna, the RF transition including a plurality of signal buried-vias; a first plurality of microvias configured to transit the RF signal between the plurality of signal buried-vias and a ball of the BGA, the first plurality of microvias are rotationally misaligned with respect to the plurality of signal buried-vias; and a second plurality of microvias configured to transit the RF signal between the plurality of signal buried-vias and the antenna.
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公开(公告)号：US20230035608A1
公开(公告)日：2023-02-02
申请号：US17938768
申请日：2022-10-07
申请人： Intel Corporation
发明人： Sidharth Dalmia , Trang Thai
摘要： Disclosed herein are antenna boards, integrated circuit (IC) packages, antenna modules, and communication devices. For example, in some embodiments, an antenna module may include: an IC package having a die and a package substrate, and the package substrate has a recess therein; and an antenna patch, coupled to the package substrate, such that the antenna patch is over or at least partially in the recess.
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公开(公告)号：US11509037B2
公开(公告)日：2022-11-22
申请号：US15991295
申请日：2018-05-29
申请人： Intel Corporation
发明人： Sidharth Dalmia , Trang Thai
摘要： Disclosed herein are antenna boards, integrated circuit (IC) packages, antenna modules, and communication devices. For example, in some embodiments, an antenna module may include: an IC package having a die and a package substrate, and the package substrate has a recess therein; and an antenna patch, coupled to the package substrate, such that the antenna patch is over or at least partially in the recess.
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