公开(公告)号：US10546823B2

公开(公告)日：2020-01-28

申请号：US15767306

申请日：2015-11-13

申请人： INTEL CORPORATION

发明人： Balu Pathangey ,  Mihir A. Oka ,  Andrew Proctor

IPC分类号： H01L23/00 ,  H01L21/67 ,  H01L21/683 ,  H01L21/78 ,  H01L25/065 ,  H01L25/18

摘要： Described is an apparatus which comprises: a die having a first side and a second side opposite to the first side; a die backside film (DBF) or die attach film (DAF) disposed over the first side of the die; and a fluorocarbon layer disposed over the DBF or DAF. Described is a method which comprises: applying a die backside film (DBF) over a first side of a die, wherein the die has a second side which metal bumps; and applying a plasma polymerization process to treat the DBF with a fluorocarbon plasma.

公开(公告)号：US09859248B2

公开(公告)日：2018-01-02

申请号：US15196866

申请日：2016-06-29

申请人： INTEL CORPORATION

发明人： Danish Faruqui ,  Edward R. Prack ,  Sergei L. Voronov ,  David K. Wilkinson, Jr. ,  Tony Dambrauskas ,  Lars D. Skoglund ,  Yoshihiro Tomita ,  Mihir A. Oka ,  Rajen C. Dias

IPC分类号： H01L23/00 ,  H01L23/538 ,  H01L23/544 ,  H01L21/768 ,  H01L23/498 ,  H01L25/065 ,  H01L21/56

CPC分类号： H01L24/83 ,  H01L21/56 ,  H01L21/568 ,  H01L21/76898 ,  H01L23/49816 ,  H01L23/5389 ,  H01L23/544 ,  H01L24/13 ,  H01L24/16 ,  H01L24/19 ,  H01L24/29 ,  H01L24/32 ,  H01L24/73 ,  H01L24/75 ,  H01L24/81 ,  H01L24/92 ,  H01L25/0657 ,  H01L2223/54426 ,  H01L2223/54486 ,  H01L2224/0401 ,  H01L2224/04105 ,  H01L2224/0557 ,  H01L2224/06181 ,  H01L2224/08225 ,  H01L2224/131 ,  H01L2224/13147 ,  H01L2224/16145 ,  H01L2224/2929 ,  H01L2224/293 ,  H01L2224/29311 ,  H01L2224/29318 ,  H01L2224/29323 ,  H01L2224/29324 ,  H01L2224/29347 ,  H01L2224/29366 ,  H01L2224/29387 ,  H01L2224/29393 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/73259 ,  H01L2224/73267 ,  H01L2224/81132 ,  H01L2224/83132 ,  H01L2224/83191 ,  H01L2224/83192 ,  H01L2224/83224 ,  H01L2224/92125 ,  H01L2224/92143 ,  H01L2224/9222 ,  H01L2224/94 ,  H01L2225/06541 ,  H01L2924/10252 ,  H01L2924/10253 ,  H01L2924/10328 ,  H01L2924/10329 ,  H01L2924/10332 ,  H01L2924/10335 ,  H01L2924/10525 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/1431 ,  H01L2924/1433 ,  H01L2924/1434 ,  H01L2924/15311 ,  H01L2924/15787 ,  H01L2924/15788 ,  H01L2924/1579 ,  H01L2924/18161 ,  H01L2924/3511 ,  H01L2924/014 ,  H01L2224/27 ,  H01L2924/0535 ,  H01L2924/01023 ,  H01L2924/00

摘要： Embodiments of the present disclosure are directed to die adhesive films for integrated circuit (IC) packaging, as well as methods for forming and removing die adhesive films and package assemblies and systems incorporating such die adhesive films. A die adhesive film may be transparent to a first wavelength of light and photoreactive to a second wavelength of light. In some embodiments, the die adhesive film may be applied to a back or “inactive” side of a die, and the die surface may be detectable through the die adhesive film. The die adhesive film may be cured and/or marked with laser energy having the second wavelength of light. The die adhesive film may include a thermochromic dye and/or nanoparticles configured to provide laser mark contrast. UV laser energy may be used to remove the die adhesive film in order to expose underlying features such as TSV pads.

公开(公告)号：US20170033069A1

公开(公告)日：2017-02-02

申请号：US15295952

申请日：2016-10-17

申请人： Intel Corporation

发明人： Mihir A. Oka ,  Edward R. PRACK ,  Dingying XU ,  Saikumar JAYARAMAN

IPC分类号： H01L23/00 ,  C09D5/20 ,  C09D7/12 ,  H01L21/02 ,  H01L21/311

CPC分类号： H01L24/11 ,  C08G73/22 ,  C09D5/20 ,  C09D7/63 ,  C09D179/04 ,  C09D179/08 ,  C09D181/04 ,  H01L21/02112 ,  H01L21/02118 ,  H01L21/02282 ,  H01L21/02318 ,  H01L21/31127 ,  H01L24/13 ,  H01L2224/05568 ,  H01L2224/11009 ,  H01L2224/11332 ,  H01L2224/1147 ,  H01L2224/116 ,  H01L2224/11849 ,  H01L2224/13023 ,  H01L2924/095 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/00 ,  C08L83/04

摘要： Techniques are disclosed for protecting a surface using a dry-removable protective coating that does not require chemical solutions to be removed. In an embodiment, a protective layer is disposed on a surface. The protective layer is composed of one layer that adheres to the surface. The surface is then processed while the protective coating is on the surface. Thereafter, the protective layer is removed from the surface by separating the protective layer away from the surface without the use of chemical solutions.

摘要翻译： 公开了用于使用不需要除去化学溶液的可干燥去除的保护涂层来保护表面的技术。 在一个实施例中，保护层设置在表面上。 保护层由附着在表面上的一层组成。 然后在表面上保护表面进行处理。 此后，通过将保护层从表面分离而不使用化学溶液，从表面除去保护层。

公开(公告)号：US10515914B2

公开(公告)日：2019-12-24

申请号：US16260908

申请日：2019-01-29

申请人： Intel Corporation

发明人： Mihir A. Oka ,  Ken P. Hackenberg ,  Vijay Krishnan (Vijay) Subramanian ,  Neha M. Patel ,  Nachiket R. Raravikar

IPC分类号： H01L23/48 ,  H01L23/52 ,  H01L29/40 ,  H01L23/00

摘要： Foundation layers and methods of forming a foundation layer are described. Die pads are formed over a die. A dielectric layer is formed over die pads and the die. The dielectric layer is then recessed to expose top portions of the die pads. A first plurality of sintered conductive vias are formed over the die pads. The first sintered conductive vias are coupled to at least one of the die pads. In addition, a photoresist layer may be formed over the dielectric layer and the top portions of the die pads. Via openings are formed in the photoresist layer. A second plurality of sintered conductive vias may then be formed over the first sintered conductive vias to form a plurality of sintered conductive lines. Each of the first and second sintered conductive vias are formed with a liquid phase sintering (LPS) solder paste.

公开(公告)号：US10224299B2

公开(公告)日：2019-03-05

申请号：US15394460

申请日：2016-12-29

申请人： INTEL CORPORATION

发明人： Mihir A. Oka ,  Ken P. Hackenberg ,  Vijay Krishnan (Vijay) Subramanian ,  Neha M. Patel ,  Nachiket R. Raravikar

IPC分类号： H01L23/48 ,  H01L23/52 ,  H01L29/40 ,  H01L23/00

摘要： Foundation layers and methods of forming a foundation layer are described. Die pads are formed over a die. A dielectric layer is formed over die pads and the die. The dielectric layer is then recessed to expose top portions of the die pads. A first plurality of sintered conductive vias are formed over the die pads. The first sintered conductive vias are coupled to at least one of the die pads. In addition, a photoresist layer may be formed over the dielectric layer and the top portions of the die pads. Via openings are formed in the photoresist layer. A second plurality of sintered conductive vias may then be formed over the first sintered conductive vias to form a plurality of sintered conductive lines. Each of the first and second sintered conductive vias are formed with a liquid phase sintering (LPS) solder paste.

公开(公告)号：US09412702B2

公开(公告)日：2016-08-09

申请号：US13830126

申请日：2013-03-14

申请人： Intel Corporation

发明人： Danish Faruqui ,  Edward R. Prack ,  Sergei L. Voronov ,  David K. Wilkinson ,  Tony Dambrauskas ,  Lars D. Skoglund ,  Yoshihiro Tomita ,  Mihir A. Oka ,  Rajen C. Dias

IPC分类号： H01L23/00 ,  H01L23/538 ,  H01L23/544 ,  H01L21/56

CPC分类号： H01L24/83 ,  H01L21/56 ,  H01L21/568 ,  H01L21/76898 ,  H01L23/49816 ,  H01L23/5389 ,  H01L23/544 ,  H01L24/13 ,  H01L24/16 ,  H01L24/19 ,  H01L24/29 ,  H01L24/32 ,  H01L24/73 ,  H01L24/75 ,  H01L24/81 ,  H01L24/92 ,  H01L25/0657 ,  H01L2223/54426 ,  H01L2223/54486 ,  H01L2224/0401 ,  H01L2224/04105 ,  H01L2224/0557 ,  H01L2224/06181 ,  H01L2224/08225 ,  H01L2224/131 ,  H01L2224/13147 ,  H01L2224/16145 ,  H01L2224/2929 ,  H01L2224/293 ,  H01L2224/29311 ,  H01L2224/29318 ,  H01L2224/29323 ,  H01L2224/29324 ,  H01L2224/29347 ,  H01L2224/29366 ,  H01L2224/29387 ,  H01L2224/29393 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/73259 ,  H01L2224/73267 ,  H01L2224/81132 ,  H01L2224/83132 ,  H01L2224/83191 ,  H01L2224/83192 ,  H01L2224/83224 ,  H01L2224/92125 ,  H01L2224/92143 ,  H01L2224/9222 ,  H01L2224/94 ,  H01L2225/06541 ,  H01L2924/10252 ,  H01L2924/10253 ,  H01L2924/10328 ,  H01L2924/10329 ,  H01L2924/10332 ,  H01L2924/10335 ,  H01L2924/10525 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/1431 ,  H01L2924/1433 ,  H01L2924/1434 ,  H01L2924/15311 ,  H01L2924/15787 ,  H01L2924/15788 ,  H01L2924/1579 ,  H01L2924/18161 ,  H01L2924/3511 ,  H01L2924/014 ,  H01L2224/27 ,  H01L2924/0535 ,  H01L2924/01023 ,  H01L2924/00

摘要： Embodiments of the present disclosure are directed to die adhesive films for integrated circuit (IC) packaging, as well as methods for forming and removing die adhesive films and package assemblies and systems incorporating such die adhesive films. A die adhesive film may be transparent to a first wavelength of light and photoreactive to a second wavelength of light. In some embodiments, the die adhesive film may be applied to a back or “inactive” side of a die, and the die surface may be detectable through the die adhesive film. The die adhesive film may be cured and/or marked with laser energy having the second wavelength of light. The die adhesive film may include a thermochromic dye and/or nanoparticles configured to provide laser mark contrast. UV laser energy may be used to remove the die adhesive film in order to expose underlying features such as TSV pads.

摘要翻译： 本公开的实施例涉及用于集成电路（IC）封装的芯片粘合膜，以及用于形成和去除模具粘合剂膜和封装组件的方法以及结合这种模具粘合剂膜的系统。 模具粘合剂膜可以对第一波长的光是透明的，并且对第二波长的光进行光反应。 在一些实施例中，模具粘合剂膜可以施加到模具的背面或“非活性”侧，并且模具表面可以通过模具粘合剂膜检测。 模具粘合剂膜可以用具有第二波长的光的激光能量固化和/或标记。 模具粘合剂膜可以包括被配置为提供激光标记对比度的热变色染料和/或纳米颗粒。 可以使用UV激光能量去除模具粘合剂膜以暴露诸如TSV焊盘之类的底层特征。

公开(公告)号：US20190067213A1

公开(公告)日：2019-02-28

申请号：US15767306

申请日：2015-11-13

申请人： INTEL CORPORATION

发明人： Balu Pathangey ,  Mihir A. Oka ,  Andrew Proctor

IPC分类号： H01L23/00 ,  H01L21/67 ,  H01L21/683 ,  H01L21/78 ,  H01L25/18 ,  H01L25/065

摘要： Described is an apparatus which comprises: a die having a first side and a second side opposite to the first side; a die backside film (DBF) or die attach film (DAF) disposed over the first side of the die; and a fluorocarbon layer disposed over the DBF or DAF. Described is a method which comprises: applying a die backside film (DBF) over a first side of a die, wherein the die has a second side which metal bumps; and applying a plasma polymerization process to treat the DBF with a fluorocarbon plasma.

公开(公告)号：US20160307869A1

公开(公告)日：2016-10-20

申请号：US15196866

申请日：2016-06-29

申请人： INTEL CORPORATION

发明人： Danish Faruqui ,  Edward R. Prack ,  Sergei L. Voronov ,  David K. Wilkinson, JR. ,  Tony Dambrauskas ,  Lars D. Skoglund ,  Yoshihiro Tomita ,  Mihir A. Oka ,  Rajen C. Dias

IPC分类号： H01L23/00 ,  H01L21/56 ,  H01L23/498 ,  H01L23/538 ,  H01L21/768 ,  H01L25/065

CPC分类号： H01L24/83 ,  H01L21/56 ,  H01L21/568 ,  H01L21/76898 ,  H01L23/49816 ,  H01L23/5389 ,  H01L23/544 ,  H01L24/13 ,  H01L24/16 ,  H01L24/19 ,  H01L24/29 ,  H01L24/32 ,  H01L24/73 ,  H01L24/75 ,  H01L24/81 ,  H01L24/92 ,  H01L25/0657 ,  H01L2223/54426 ,  H01L2223/54486 ,  H01L2224/0401 ,  H01L2224/04105 ,  H01L2224/0557 ,  H01L2224/06181 ,  H01L2224/08225 ,  H01L2224/131 ,  H01L2224/13147 ,  H01L2224/16145 ,  H01L2224/2929 ,  H01L2224/293 ,  H01L2224/29311 ,  H01L2224/29318 ,  H01L2224/29323 ,  H01L2224/29324 ,  H01L2224/29347 ,  H01L2224/29366 ,  H01L2224/29387 ,  H01L2224/29393 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/73259 ,  H01L2224/73267 ,  H01L2224/81132 ,  H01L2224/83132 ,  H01L2224/83191 ,  H01L2224/83192 ,  H01L2224/83224 ,  H01L2224/92125 ,  H01L2224/92143 ,  H01L2224/9222 ,  H01L2224/94 ,  H01L2225/06541 ,  H01L2924/10252 ,  H01L2924/10253 ,  H01L2924/10328 ,  H01L2924/10329 ,  H01L2924/10332 ,  H01L2924/10335 ,  H01L2924/10525 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/1431 ,  H01L2924/1433 ,  H01L2924/1434 ,  H01L2924/15311 ,  H01L2924/15787 ,  H01L2924/15788 ,  H01L2924/1579 ,  H01L2924/18161 ,  H01L2924/3511 ,  H01L2924/014 ,  H01L2224/27 ,  H01L2924/0535 ,  H01L2924/01023 ,  H01L2924/00

摘要： Embodiments of the present disclosure are directed to die adhesive films for integrated circuit (IC) packaging, as well as methods for forming and removing die adhesive films and package assemblies and systems incorporating such die adhesive films. A die adhesive film may be transparent to a first wavelength of light and photoreactive to a second wavelength of light. In some embodiments, the die adhesive film may be applied to a back or “inactive” side of a die, and the die surface may be detectable through the die adhesive film. The die adhesive film may be cured and/or marked with laser energy having the second wavelength of light. The die adhesive film may include a thermochromic dye and/or nanoparticles configured to provide laser mark contrast. UV laser energy may be used to remove the die adhesive film in order to expose underlying features such as TSV pads.

摘要翻译： 本公开的实施例涉及用于集成电路（IC）封装的芯片粘合膜，以及用于形成和去除模具粘合剂膜和封装组件的方法以及结合这种模具粘合剂膜的系统。 模具粘合剂膜可以对第一波长的光是透明的，并且对第二波长的光进行光反应。 在一些实施例中，模具粘合剂膜可以施加到模具的背面或“非活性”侧，并且模具表面可以通过模具粘合剂膜检测。 模具粘合剂膜可以用具有第二波长的光的激光能量固化和/或标记。 模具粘合剂膜可以包括被配置为提供激光标记对比度的热变色染料和/或纳米颗粒。 可以使用UV激光能量去除模具粘合剂膜以暴露诸如TSV焊盘之类的底层特征。