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公开(公告)号：US09939331B2
公开(公告)日：2018-04-10
申请号：US14284198
申请日：2014-05-21
Applicant: Infineon Technologies AG
Inventor： Jonathan Silvano de Sousa , Tobias Frischmuth , Peter Irsigler , Ulrich Schmid , Thomas Grille , Ursula Hedenig , Sylvicley Figueira da Silva
CPC classification number: G01K7/34 , B81B3/0021 , G01K1/024 , G01K13/002
Abstract: Various embodiments disclosed herein include a capacitive thermometer including a deflectable membrane and a sense electrode. The deflectable membrane is configured to adjust a capacitive value based on a temperature of the deflectable membrane.
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公开(公告)号：US10106398B2
公开(公告)日：2018-10-23
申请号：US14724224
申请日：2015-05-28
Applicant: Infineon Technologies AG
Inventor： Ulrich Schmid , Tobias Frischmuth , Peter Irsigler , Thomas Grille , Daniel Maurer , Ursula Hedenig , Markus Kahn , Guenter Denifl , Michael Schneider
Abstract: A micromechanical structure comprises a substrate and a functional structure arranged at the substrate. The functional structure comprises a functional region which is deflectable with respect to the substrate responsive to a force acting on the functional region. The functional structure comprises a carbon layer arrangement, wherein a basis material of the carbon layer arrangement is a carbon material.
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公开(公告)号：US20180002167A1
公开(公告)日：2018-01-04
申请号：US15636702
申请日：2017-06-29
Applicant: Infineon Technologies AG
Inventor： Tobias Frischmuth , Guenter Denifl , Thomas Grille , Ursula Hedenig , Markus Kahn , Daniel Maurer , Ulrich Schmid , Michael Schneider
Abstract: A micromechanical structure in accordance with various embodiments may include: a substrate; and a functional structure arranged at the substrate; wherein the functional structure includes a functional region which is deflectable with respect to the substrate responsive to a force acting on the functional region; and wherein at least a section of the functional region has an elastic modulus in the range from about 5 GPa to about 70 GPa.
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公开(公告)号：US10710874B2
公开(公告)日：2020-07-14
申请号：US15636702
申请日：2017-06-29
Applicant: Infineon Technologies AG
Inventor： Tobias Frischmuth , Guenter Denifl , Thomas Grille , Ursula Hedenig , Markus Kahn , Daniel Maurer , Ulrich Schmid , Michael Schneider
IPC: H04R19/00 , B81C1/00 , G01Q70/14 , H04R7/26 , G01L7/08 , G01L1/00 , B81B3/00 , G01Q60/24 , H04R19/02 , H04R7/10 , H04R19/04
Abstract: A micromechanical structure in accordance with various embodiments may include: a substrate; and a functional structure arranged at the substrate; wherein the functional structure includes a functional region which is deflectable with respect to the substrate responsive to a force acting on the functional region; and wherein at least a section of the functional region has an elastic modulus in the range from about 5 GPa to about 70 GPa.
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Patent Agency Ranking
公开(公告)号：US20150338285A1
公开(公告)日：2015-11-26
申请号：US14284198
申请日：2014-05-21
Applicant: Infineon Technologies AG
Inventor： Jonathan Silvano de Sousa , Tobias Frischmuth , Peter Irsigler , Ulrich Schmid , Thomas Grille , Ursula Hedenig , Sylvicley Figueira da Silva
CPC classification number: G01K7/34 , B81B3/0021 , G01K1/024 , G01K13/002
Abstract: Various embodiments disclosed herein include a capacitive thermometer including a deflectable membrane and a sense electrode. The deflectable membrane is configured to adjust a capacitive value based on a temperature of the deflectable membrane.
Abstract translation: 本文公开的各种实施例包括电容式温度计，其包括可偏转膜和感测电极。 可偏转膜构造成基于可偏转膜的温度调节电容值。
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公开(公告)号：US10081533B2
公开(公告)日：2018-09-25
申请号：US14448767
申请日：2014-07-31
Applicant: Infineon Technologies AG
Inventor： Ulrich Schmid , Tobias Frischmuth , Peter Irsigler , Thomas Grille , Daniel Maurer , Ursula Hedenig , Markus Kahn , Günter Denifl
IPC: B81B3/00 , B06B1/02 , B81C1/00 , H04R19/02 , H04R19/04 , H04R31/00 , H04R7/24 , H04R7/02 , H04R19/00
CPC classification number: B81B3/0021 , B06B1/02 , B81B3/007 , B81B2201/0257 , B81B2201/0264 , B81B2203/0109 , B81B2203/0118 , B81B2203/0127 , B81B2203/051 , B81C1/00142 , B81C1/0015 , B81C1/00158 , B81C1/00373 , B81C2201/0176 , B81C2201/0181 , B81C2201/019 , H04R7/02 , H04R7/24 , H04R19/005 , H04R19/02 , H04R19/04 , H04R31/00 , H04R31/003 , H04R2201/003 , H04R2307/023 , H04R2400/01 , H04R2499/11
Abstract: A micromechanical structure includes a substrate and a functional structure arranged at the substrate. The functional structure has a functional region configured to deflect with respect to the substrate responsive to a force acting on the functional region. The functional structure includes a conductive base layer and a functional structure comprising a stiffening structure having a stiffening structure material arranged at the conductive base layer and only partially covering the conductive base layer at the functional region. The stiffening structure material includes a silicon material and at least a carbon material.
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公开(公告)号：US20160353210A1
公开(公告)日：2016-12-01
申请号：US14724224
申请日：2015-05-28
Applicant: Infineon Technologies AG
Inventor： Ulrich Schmid , Tobias Frischmuth , Peter Irsigler , Thomas Grille , Daniel Maurer , Ursula Hedenig , Markus Kahn , Guenter Denifl , Michael Schneider
CPC classification number: B81C1/00158 , B81B3/007 , B81B3/0072 , B81B2201/0257 , B81B2203/0118 , B81B2203/0127 , B81C2201/0167 , B81C2201/0177 , B81C2201/0181 , H04R2201/003
Abstract: A micromechanical structure comprises a substrate and a functional structure arranged at the substrate. The functional structure comprises a functional region which is deflectable with respect to the substrate responsive to a force acting on the functional region. The functional structure comprises a carbon layer arrangement, wherein a basis material of the carbon layer arrangement is a carbon material.
Abstract translation: 微机械结构包括衬底和布置在衬底上的功能结构。 功能结构包括响应于作用在功能区域上的力而相对于衬底可偏转的功能区域。 功能结构包括碳层布置，其中碳层布置的基础材料是碳材料。
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公开(公告)号：US20160031701A1
公开(公告)日：2016-02-04
申请号：US14448767
申请日：2014-07-31
Applicant: Infineon Technologies AG
Inventor： Ulrich Schmid , Tobias Frischmuth , Peter Irsigler , Thomas Grille , Daniel Maurer , Ursula Hedenig , Markus Kahn , Günter Denifl
CPC classification number: B81B3/0021 , B06B1/02 , B81B3/007 , B81B2201/0257 , B81B2201/0264 , B81B2203/0109 , B81B2203/0118 , B81B2203/0127 , B81B2203/051 , B81C1/00142 , B81C1/0015 , B81C1/00158 , B81C1/00373 , B81C2201/0176 , B81C2201/0181 , B81C2201/019 , H04R7/02 , H04R7/24 , H04R19/005 , H04R19/02 , H04R19/04 , H04R31/00 , H04R31/003 , H04R2201/003 , H04R2307/023 , H04R2400/01 , H04R2499/11
Abstract: A micromechanical structure includes a substrate and a functional structure arranged at the substrate. The functional structure has a functional region configured to deflect with respect to the substrate responsive to a force acting on the functional region. The functional structure includes a conductive base layer and a functional structure comprising a stiffening structure having a stiffening structure material arranged at the conductive base layer and only partially covering the conductive base layer at the functional region. The stiffening structure material includes a silicon material and at least a carbon material.
Abstract translation: 微机械结构包括衬底和布置在衬底上的功能结构。 功能结构具有功能区域，其被配置为响应于作用在功能区域上的力而相对于衬底偏转。 该功能结构包括导电基底层和功能结构，该功能结构包括具有布置在导电基底层处并且仅在功能区域部分地覆盖导电基底层的加强结构材料的加强结构。 加强结构材料包括硅材料和至少一种碳材料。
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公开(公告)号：US09212045B1
公开(公告)日：2015-12-15
申请号：US14448783
申请日：2014-07-31
Applicant: Infineon Technologies AG
Inventor： Ulrich Schmid , Tobias Frischmuth , Peter Irsigler , Thomas Grille , Daniel Maurer , Ursula Hedenig , Markus Kahn , Guenter Denifl
CPC classification number: B81C1/00658 , B81B2201/0257 , B81B2203/0127 , H04R19/005 , H04R31/00 , H04R2307/023
Abstract: A micro mechanical structure includes a substrate and a functional structure arranged at the substrate. The functional structure includes a functional region which is deflectable with respect to the substrate responsive to a force acting on the functional region. The functional structure further includes a conductive base layer having a conductive base layer material. The conductive base layer material includes sectionally in a stiffening section a carbon material such that a carbon concentration of the carbon material in the conductive base layer material is at least 1014 per cubic cm and at least higher by a factor of 103 than in the conductive base layer material adjacent to the stiffening section.
Abstract translation: 微机械结构包括衬底和布置在衬底上的功能结构。 功能结构包括响应于作用在功能区上的力而相对于衬底可偏转的功能区域。 功能结构还包括具有导电性基底层材料的导电性基底层。 导电基层材料在硬化部分中包括碳材料，使得导电基材层材料中的碳材料的碳浓度至少为1014每立方厘米，并且至少高于导电基体中的103倍 邻近加强部分的层材料。
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