Invention Grant
- Patent Title: Micro mechanical structure and method for fabricating the same
- Patent Title (中): 微机械结构及其制造方法
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Application No.: US14448783Application Date: 2014-07-31
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Publication No.: US09212045B1Publication Date: 2015-12-15
- Inventor: Ulrich Schmid , Tobias Frischmuth , Peter Irsigler , Thomas Grille , Daniel Maurer , Ursula Hedenig , Markus Kahn , Guenter Denifl
- Applicant: Infineon Technologies AG
- Applicant Address: DE Neubiberg
- Assignee: Infineon Technologies AG
- Current Assignee: Infineon Technologies AG
- Current Assignee Address: DE Neubiberg
- Agency: Slater & Matsil, L.L.P.
- Main IPC: H01L29/66
- IPC: H01L29/66 ; B81B3/00 ; B81C1/00

Abstract:
A micro mechanical structure includes a substrate and a functional structure arranged at the substrate. The functional structure includes a functional region which is deflectable with respect to the substrate responsive to a force acting on the functional region. The functional structure further includes a conductive base layer having a conductive base layer material. The conductive base layer material includes sectionally in a stiffening section a carbon material such that a carbon concentration of the carbon material in the conductive base layer material is at least 1014 per cubic cm and at least higher by a factor of 103 than in the conductive base layer material adjacent to the stiffening section.
Information query
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