Invention Application
- Patent Title: Micromechanical Structure and Method for Fabricating the Same
- Patent Title (中): 微机械结构及其制造方法
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Application No.: US14724224Application Date: 2015-05-28
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Publication No.: US20160353210A1Publication Date: 2016-12-01
- Inventor: Ulrich Schmid , Tobias Frischmuth , Peter Irsigler , Thomas Grille , Daniel Maurer , Ursula Hedenig , Markus Kahn , Guenter Denifl , Michael Schneider
- Applicant: Infineon Technologies AG
- Main IPC: H04R19/04
- IPC: H04R19/04 ; H04R31/00 ; B81C1/00 ; G01L9/00 ; B81B3/00
Abstract:
A micromechanical structure comprises a substrate and a functional structure arranged at the substrate. The functional structure comprises a functional region which is deflectable with respect to the substrate responsive to a force acting on the functional region. The functional structure comprises a carbon layer arrangement, wherein a basis material of the carbon layer arrangement is a carbon material.
Public/Granted literature
- US10106398B2 Micromechanical structure comprising carbon material and method for fabricating the same Public/Granted day:2018-10-23
Information query
