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公开(公告)号:US20190221533A1
公开(公告)日:2019-07-18
申请号:US16246912
申请日:2019-01-14
发明人: Horst THEUSS , Rudolf BERGER , Walter HARTNER , Veronika HUBER , Werner ROBL
IPC分类号: H01L23/00 , H01L23/498 , H01L21/48
CPC分类号: H01L24/05 , H01L21/4857 , H01L21/486 , H01L23/49822 , H01L23/49827 , H01L23/49838 , H01L23/49866 , H01L24/03 , H01L24/13 , H01L24/16 , H01L24/81 , H01L2224/0231 , H01L2224/0239 , H01L2224/03462 , H01L2224/03848 , H01L2224/0401 , H01L2224/05647 , H01L2224/13023 , H01L2224/13024 , H01L2224/13147 , H01L2224/16227 , H01L2924/3512
摘要: A semiconductor device includes a semiconductor chip, an electrical connection element for electrically connecting the semiconductor device to a carrier, and a metallization adjoining the electrical connection element, the metallization contains porous nanocrystalline copper that contains portions of organic acids.