公开(公告)号：US11259399B2

公开(公告)日：2022-02-22

申请号：US15901660

申请日：2018-02-21

申请人： Intel Corporation

发明人： Hongfei Yan ,  Yuan-Liang Li ,  Leo Liu ,  Chunlei Guo

IPC分类号： H01L23/367 ,  H05K1/02 ,  H01L23/498 ,  H01L23/42 ,  H01L23/373 ,  G01R1/04

摘要： Embodiments herein may include apparatuses, systems, and processes related to a socket with a first side to receive a package substrate and a second side coupled with a printed circuit board (PCB), which may be a mother board, where the socket has a cavity into which a thermal conductor is inserted to conduct heat from the package substrate to the PCB. In embodiments, the PCB may contain thermal vias to conduct heat from one side of the PCB to the other side. Other embodiments may be described and/or claimed.

公开(公告)号：US09131603B2

公开(公告)日：2015-09-08

申请号：US13844761

申请日：2013-03-15

申请人： INTEL CORPORATION

发明人： Kai Xiao ,  Jimmy Hsu ,  Yuan-Liang Li ,  Richard K. Kunze

IPC分类号： H05K1/02 ,  H01P3/08 ,  H01P11/00

CPC分类号： H05K1/0228 ,  H01P3/08 ,  H01P11/00 ,  H05K1/0245 ,  H05K1/0298 ,  H05K2201/09236 ,  H05K2201/09709 ,  Y10T29/49155

摘要： A signal line design is described herein. A circuit board may include a first signal line and a second signal line. The first signal line includes a pair of signal lines at a first depth of a section of a circuit board, wherein a centerline extends lengthwise between the pair of signal lines. The second signal line is disposed at a second depth of the circuit board. The second signal line includes a first segment that runs parallel to the first signal line at a first displacement from the center line. The second signal line includes a second segment that runs parallel to the first signal line on the other side of the center line at a second displacement distance from the center line.

摘要翻译： 这里描述了信号线设计。 电路板可以包括第一信号线和第二信号线。 第一信号线包括在电路板的一部分的第一深度处的一对信号线，其中中心线在该对信号线之间纵向延伸。 第二信号线设置在电路板的第二深度处。 第二信号线包括第一段，该第一段在与中心线的第一位移处平行于第一信号线延伸。 第二信号线包括与中心线的另一侧平行于第一信号线的第二段，距中心线的第二位移距离。

公开(公告)号：US20190045619A1

公开(公告)日：2019-02-07

申请号：US15901660

申请日：2018-02-21

申请人： Intel Corporation

发明人： Hongfei Yan ,  Yuan-Liang Li ,  Leo Liu ,  Chunlei Guo

IPC分类号： H05K1/02 ,  H01L23/367 ,  H01L23/498

摘要： Embodiments herein may include apparatuses, systems, and processes related to a socket with a first side to receive a package substrate and a second side coupled with a printed circuit board (PCB), which may be a mother board, where the socket has a cavity into which a thermal conductor is inserted to conduct heat from the package substrate to the PCB. In embodiments, the PCB may contain thermal vias to conduct heat from one side of the PCB to the other side. Other embodiments may be described and/or claimed.

公开(公告)号：US20240260228A1

公开(公告)日：2024-08-01

申请号：US18565916

申请日：2022-04-01

申请人： Intel Corporation

发明人： Jimmy Chuang ,  Jin Yang ,  Yuan-Liang Li ,  David Shia ,  Yuehong Fan ,  Hao Zhou ,  Sandeep Ahuja ,  Peng Wei ,  Ming Zhang ,  Je-Young Chang ,  Paul J. Gwin ,  Ra'anan Sover ,  Lianchang Du ,  Eric D. McAfee ,  Timothy Glen Hanna ,  Liguang Du ,  Qing Jiang ,  Xicai Jing ,  Liu Yu ,  Guoliang Ying ,  Cong Zhou ,  Yinglei Ren ,  Xinfeng Wang

IPC分类号： H05K7/20

CPC分类号： H05K7/20236 ,  H05K7/20254 ,  H05K7/20263 ,  H05K7/20463

摘要： Immersion cooling systems, apparatus, and related methods for cooling electronic computing platforms and/or associated electronic components are disclosed herein. An example apparatus includes a first chamber including a first coolant disposed therein, the first coolant having a first boiling point. The example apparatus further includes a second chamber disposed in the first chamber, the second chamber to receive an electronic component therein. The second chamber includes a second coolant having a second boiling point different that the first boiling point. The second chamber is to separate the electronic component and the second coolant from the first coolant.