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公开(公告)号:US20240173795A1
公开(公告)日:2024-05-30
申请号:US18085657
申请日:2022-12-21
发明人: FU-LUNG CHOU , Chien-Jung Huang , Yu-Chung Lin
CPC分类号: B23K26/0648 , B23K26/032 , B23K26/38 , B23K26/402
摘要: A cavity forming method includes the steps of: providing the material modification processing device; according to the cavity topography of the workpiece, utilizing the material modification processing device to perform local modification including: calculating the laser-light shaping and scanning information, and based on the laser-light shaping and scanning information to have the optical axis adjustment unit to adjust positions of the laser-light shaping and scanning processing module and the processing stage, such that the area of the workpiece to be projected by the Bessel beam can be formed as the modified area; and, etching the modified area to form a cavity of the cavity topography. In additional, a material modification processing device is also provided.
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公开(公告)号:US11338392B2
公开(公告)日:2022-05-24
申请号:US16279186
申请日:2019-02-19
发明人: Hsin-Yu Chang , Fu-Lung Chou , Chien-Jung Huang , Yu-Chung Lin , Min-Kai Lee
IPC分类号: B23K26/36 , B23K26/38 , B23K26/40 , B23K26/362 , B23K103/00 , B23K101/36 , B23K101/18
摘要: A cutting method for forming a chamfered corner includes a step of selecting a light pattern-adjusting module according to a pre-cut chamfer angle, a step of the light pattern-adjusting module emitting a laser beam to a substrate and thus forming a modified region extending in a thickness direction at the substrate, a step of the light pattern-adjusting module adjusting an axial energy distribution of a light pattern of the laser beam to vary an appearance of the modified region so as to form the modified region fulfilling the pre-cut chamfer angle, and a step of etching the substrate having the modified region to form a chamfered surface on the substrate by cutting the modified region from the substrate.
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公开(公告)号:US20140093660A1
公开(公告)日:2014-04-03
申请号:US13712394
申请日:2012-12-12
发明人: Chun-Han Li , Chien-Jung Huang , Sung-Ho Liu
IPC分类号: B05D3/06
CPC分类号: B05D3/06 , C08K3/04 , C08K3/041 , C08K3/042 , C09D7/61 , H01M8/0206 , H01M8/0226 , H01M8/0228 , Y02P70/56
摘要: A method for manufacturing bipolar plate includes placing a mixed material on a plate wherein the mixed material includes a carbon material as well as a resin and the material of the plate is metal, and irradiating a light to the mixed material for modifying the mixed material wherein the light is a laser light.
摘要翻译: 一种双极板的制造方法,其特征在于,在混合材料包含碳材料和树脂的板上放置混合材料,并且所述板材为金属,向所述混合材料照射光, 光是激光。
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公开(公告)号:US20220141961A1
公开(公告)日:2022-05-05
申请号:US17134132
申请日:2020-12-24
发明人: Chih-I Wu , Shih-Ming Lin , Pin-Hao Hu , Yu-Chung Lin , Hsin-Yu Chang , Fu-Lung Chou , Chien-Jung Huang
摘要: A method of fabricating a substrate having a through via includes: providing a carrier board having a release layer thereon; attaching the substrate onto the carrier board via the release layer; applying a light beam to the substrate to form a first blind hole in the substrate, wherein the first blind hole penetrates a first surface and a second surface of the substrate; performing an enlargement process on the first blind hole to form a second blind hole; forming a through via in the second blind hole; and performing a de-bonding process to release the substrate having a through via from the carrier board.
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公开(公告)号:US20210245294A1
公开(公告)日:2021-08-12
申请号:US16881010
申请日:2020-05-22
摘要: A scanning light source module for providing a pattern beam to a target object on a work plane is provided. The scanning light source module includes a light emitting device for providing a beam, a beam reducing/expanding device for adjusting an outer diameter of the beam, a shaping lens set for converting the beam into a pattern beam, a scanning reflective mirror set for reflecting the pattern beam to move along at least one direction, and a telecentric flat-field focusing element having an incident surface. The pattern beam has multiple parts. There is a spacing between the parts. The pattern beam is reflected to different positions on the incident surface by the rotation of the scanning reflective mirror set. There is a distance between the work plane and a focal plane of the telecentric flat-field focusing element.
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公开(公告)号:US11052436B2
公开(公告)日:2021-07-06
申请号:US16133199
申请日:2018-09-17
IPC分类号: B08B7/00 , B23K26/064 , B23K26/06 , B23K26/067
摘要: A laser cleaning apparatus and a laser cleaning method are furnished, for switching the wavelengths of laser beams furnished by a single laser module using a wavelength switching module and cleaning a test piece using the laser beams having wavelengths and energy suitable for manufacturing needs. The laser cleaning method includes: creating a laser beam; switching the wavelength output by the laser based on process requirements; propagating the laser beam via an optical path propagating module for laser cleaning the test piece; and removing debris. A transfer platform allows movements of the laser beams with respect to the test piece to achieve cleaning of the entire test piece. A control module controls the wavelength switching unit, the laser beam regulating module, and the transfer platform. Total laser cleaning with improved laser cleaning quality is achieved by using these laser beams with the appropriate wavelengths and energy.
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公开(公告)号:US10326151B2
公开(公告)日:2019-06-18
申请号:US15375270
申请日:2016-12-12
发明人: Chun-Han Li , Chih-Wei Chien , Chien-Jung Huang
IPC分类号: H01M8/0297 , H01M8/0276 , H01M8/1004 , H01M8/247 , H01M8/249 , H01M8/1018
摘要: A modular structure of a fuel cell is provided, which includes a membrane electrode assembly (MEA), at least one first electrode plate, at least one second electrode plate, at least one first fixing element and at least one second fixing element. The first electrode plate is disposed at one side of the MEA and has at least one first through hole. The second electrode plate is disposed at the other side of the MEA and has at least one second through hole corresponding to the first through hole. The first fixing element and the second fixing element correspond to each other, and are joined to each other through the first through hole and the second through hole to fix the first electrode plate and the second electrode plate for the first electrode plate, the MEA and the second electrode plate to form a single cell module.
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公开(公告)号:US20180123147A1
公开(公告)日:2018-05-03
申请号:US15375270
申请日:2016-12-12
发明人: Chun-Han Li , Chih-Wei Chien , Chien-Jung Huang
IPC分类号: H01M8/0297 , H01M8/1004 , H01M8/0276
CPC分类号: H01M8/0297 , H01M8/0276 , H01M8/1004 , H01M8/247 , H01M8/249 , H01M2008/1095
摘要: A modular structure of a fuel cell is provided, which includes a membrane electrode assembly (MEA), at least one first electrode plate, at least one second electrode plate, at least one first fixing element and at least one second fixing element. The first electrode plate is disposed at one side of the MEA and has at least one first through hole. The second electrode plate is disposed at the other side of the MEA and has at least one second through hole corresponding to the first through hole. The first fixing element and the second fixing element correspond to each other, and are joined to each other through the first through hole and the second through hole to fix the first electrode plate and the second electrode plate for the first electrode plate, the MEA and the second electrode plate to form a single cell module.
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公开(公告)号:US20160174358A1
公开(公告)日:2016-06-16
申请号:US14620214
申请日:2015-02-12
发明人: Cheng-Che Wu , Chen-Chu Tsai , Chien-Jung Huang , Yung-Hui Yeh , Heng-Yin Chen
CPC分类号: H05K1/028 , H05K1/0281 , H05K3/0032 , H05K3/007 , H05K2201/0145 , H05K2201/0154 , H05K2201/10106 , H05K2201/10128 , H05K2201/2009 , H05K2203/1178
摘要: According to embodiments of the disclosure, a flexible device and a fabrication method thereof are provided. The flexible device has a first area and a second area, and the stiffness of a portion of the first area is greater than the stiffness of the second area. The flexible device may include a flexible substrate and a rigid element. The flexible substrate includes a first surface and a second surface opposite to each other. The second surface has a coarse structure. The surface roughness of the second surface is greater in the first area than in the second area. The rigid element is disposed on the first surface of the flexible substrate and located in the first area. The stiffness of the rigid element is greater than the stiffness of the flexible substrate. A projection area of the coarse structure on the flexible substrate overlaps an area of the rigid element.
摘要翻译: 根据本公开的实施例,提供了柔性装置及其制造方法。 柔性装置具有第一区域和第二区域,并且第一区域的一部分的刚度大于第二区域的刚度。 柔性装置可以包括柔性基底和刚性元件。 柔性基板包括彼此相对的第一表面和第二表面。 第二表面具有粗糙的结构。 在第一区域中第二表面的表面粗糙度大于第二区域中的表面粗糙度。 刚性元件设置在柔性基板的第一表面上并且位于第一区域中。 刚性元件的刚度大于柔性基板的刚度。 柔性基板上的粗糙结构的投影区域与刚性元件的区域重叠。
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公开(公告)号:US11406022B2
公开(公告)日:2022-08-02
申请号:US17134132
申请日:2020-12-24
发明人: Chih-I Wu , Shih-Ming Lin , Pin-Hao Hu , Yu-Chung Lin , Hsin-Yu Chang , Fu-Lung Chou , Chien-Jung Huang
IPC分类号: H05K1/11 , H05K3/00 , H05K3/42 , H01L23/498
摘要: A method of fabricating a substrate having a through via includes: providing a carrier board having a release layer thereon; attaching the substrate onto the carrier board via the release layer; applying a light beam to the substrate to form a first blind hole in the substrate, wherein the first blind hole penetrates a first surface and a second surface of the substrate; performing an enlargement process on the first blind hole to form a second blind hole; forming a through via in the second blind hole; and performing a de-bonding process to release the substrate having a through via from the carrier board.
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