AIR PURIFIER AND AUTOMBILE AIR CONDITIONER WITH AIR PURIFIER

    公开(公告)号:US20210030914A1

    公开(公告)日:2021-02-04

    申请号:US16525616

    申请日:2019-07-30

    Abstract: The disclosure is directed to an air purifier and an automobile air conditioner with an air purifier. The air purifier includes a reactor, a column, an air guider and a plurality of light emitting elements. The reactor includes an air inlet and an air outlet. The column is disposed in the reactor, and the column has a N-side walls. The air guider is disposed on the column, and the air guider is coated with a photocatalyst. The light emitting elements are placed on the N side walls of the column configured to irradiate on the photocatalyst, where each of the light emitting elements has an emitting angle of θ and θ*N>360°.

    LIGHT SOURCE APPARATUS AND METHOD OF USING THE SAME

    公开(公告)号:US20180193499A1

    公开(公告)日:2018-07-12

    申请号:US15826690

    申请日:2017-11-30

    Abstract: A light source apparatus comprises a main body, a plurality of light source modules and a processor. The main body includes a plurality of configuration areas distributed on a surface of the main body. The plurality of configuration areas is oriented towards different directions, respectively. The plurality of light source modules is located in the plurality of configuration areas, respectively. Each of the plurality of light source modules includes a circuit substrate and an ultraviolet emitting device. The processor is electrically connected to the plurality of light source modules. The processor is adapted to drive the ultraviolet emitting device of each of the plurality of light source modules. A method of using a light source apparatus is also provided.

    Light emitting diode
    3.
    发明授权
    Light emitting diode 有权
    发光二极管

    公开(公告)号:US09391239B2

    公开(公告)日:2016-07-12

    申请号:US14166864

    申请日:2014-01-29

    Abstract: A light emitting diode includes a semiconductor stacked structure, a substrate, a first electrode, a second electrode and a third electrode. The semiconductor stacked structure includes a first semiconductor layer, a second semiconductor layer and a light emitting layer. The first semiconductor layer has a first surface and a second surface opposite to each other and has a first region and a second region. The second semiconductor layer is disposed on the second surface. The light emitting layer is disposed between the first semiconductor layer and the second semiconductor layer. The substrate has a first conductive layer and a second conductive layer thereon. The first electrode is disposed between the second semiconductor layer and the first conductive layer. The second electrode is disposed on the first surface. The third electrode is disposed between the second region and the second conductive layer, and electrically connected to the second electrode.

    Abstract translation: 发光二极管包括半导体层叠结构,基板,第一电极,第二电极和第三电极。 半导体堆叠结构包括第一半导体层,第二半导体层和发光层。 第一半导体层具有彼此相对的第一表面和第二表面,并且具有第一区域和第二区域。 第二半导体层设置在第二表面上。 发光层设置在第一半导体层和第二半导体层之间。 衬底上具有第一导电层和第二导电层。 第一电极设置在第二半导体层和第一导电层之间。 第二电极设置在第一表面上。 第三电极设置在第二区域和第二导电层之间,并且电连接到第二电极。

    Light emitting diode package structure
    4.
    发明授权
    Light emitting diode package structure 有权
    发光二极管封装结构

    公开(公告)号:US09231168B2

    公开(公告)日:2016-01-05

    申请号:US14267919

    申请日:2014-05-02

    CPC classification number: H01L33/501

    Abstract: A light-emitting diode package structure including a chip carrier portion, a light-emitting diode chip, and a package material is provided. The light-emitting diode chip is disposed on the chip carrier portion of the package. The package material is filled in the chip carrier portion and covers the light-emitting diode chip. The package material includes a matrix material, a plurality of first powder particles, and a plurality of second powder particles. The first powder particles and the second powder particles are distributed in the matrix material. Each first powder particle is a wavelength conversion material. Each second powder particle has a shell-like structure.

    Abstract translation: 提供了包括芯片载体部分,发光二极管芯片和封装材料的发光二极管封装结构。 发光二极管芯片设置在封装的芯片载体部分上。 封装材料填充在芯片载体部分中并覆盖发光二极管芯片。 包装材料包括基质材料,多个第一粉末颗粒和多个第二粉末颗粒。 第一粉末颗粒和第二粉末颗粒分布在基质材料中。 每个第一粉末颗粒是波长转换材料。 每个第二粉末颗粒具有壳状结构。

    Fluid sterilizing device
    5.
    发明授权

    公开(公告)号:US11312642B2

    公开(公告)日:2022-04-26

    申请号:US16381816

    申请日:2019-04-11

    Abstract: A fluid sterilizing device includes a first reaction chamber, a second reaction chamber, a communication chamber and a light source. The first reaction chamber is connected to a fluid inlet. The second reaction chamber is connected to a fluid outlet. The communication chamber is connected the first reaction chamber with the second reaction chamber. The light source is configured to emit sterilization light to enter the first reaction chamber and the second reaction chamber. The fluid inlet allows a fluid to enter the first reaction chamber, the communication chamber allows the fluid to pass through and enter the second reaction chamber, and a flow velocity distribution of the fluid in the second reaction chamber is different from that of the fluid in the first reaction chamber.

    FLUID STERILIZING DEVICE
    6.
    发明申请

    公开(公告)号:US20190233309A1

    公开(公告)日:2019-08-01

    申请号:US16381816

    申请日:2019-04-11

    CPC classification number: C02F1/325 C02F2201/322

    Abstract: A fluid sterilizing device includes a first reaction chamber, a second reaction chamber, a communication chamber and a light source. The first reaction chamber is connected to a fluid inlet. The second reaction chamber is connected to a fluid outlet. The communication chamber is connected the first reaction chamber with the second reaction chamber. The light source is configured to emit sterilization light to enter the first reaction chamber and the second reaction chamber. The fluid inlet allows a fluid to enter the first reaction chamber, the communication chamber allows the fluid to pass through and enter the second reaction chamber, and a flow velocity distribution of the fluid in the second reaction chamber is different from that of the fluid in the first reaction chamber.

    Package structure of an ultraviolet light emitting diode

    公开(公告)号:US10134963B2

    公开(公告)日:2018-11-20

    申请号:US15291043

    申请日:2016-10-11

    Abstract: A package structure of an ultraviolet light emitting diode is provided, which includes a substrate, a transparent body, at least one ultraviolet light emitting diode, a connecting element and an ultraviolet shielding layer. The transparent body is disposed on the substrate. The transparent body has a space inside thereof. The at least one ultraviolet light emitting diode is disposed on the substrate and inside the space. The connecting element is disposed between the substrate and the transparent body. The ultraviolet shielding layer is disposed between the transparent body and the connecting element.

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