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公开(公告)号：US20140071621A1
公开(公告)日：2014-03-13
申请号：US14077498
申请日：2013-11-12
发明人： Yuan Dong , Liqian Zhai , Shanjiu Chi , Jun Zhao
IPC分类号： H05K7/20
CPC分类号： H05K7/20581 , H05K7/20727 , H05K7/20736
摘要： Embodiments of the present invention disclose an electronic equipment cooling system including: a cabinet; at least one electronic equipment chassis that is installed inside the cabinet; and an auxiliary cooling device including an air pressurizing device, an air supply plenum box, and an air-guiding device. The air supply plenum box is disposed on an inner side of the cabinet. The air pressurizing device is disposed at the top or bottom of the cabinet, and an air exhaust on a sidewall of the air pressurizing device is connected to a corresponding air intake on a sidewall of the air supply plenum box. The air-guiding device is installed inside the electronic equipment chassis, an air intake of the air-guiding device is connected to an air exhaust of the air supply plenum device, and an air exhaust of the air-guiding device faces a component inside the electronic equipment chassis.
摘要翻译： 本发明的实施例公开了一种电子设备冷却系统，包括：机柜; 安装在机柜内的至少一个电子设备底盘; 以及辅助冷却装置，其包括空气加压装置，空气供给箱和空气引导装置。 供气室被设置在机柜的内侧。 空气加压装置设置在机柜的顶部或底部，空气加压装置的侧壁上的排气口与供气室的侧壁上的相应进气口连接。 空气引导装置安装在电子设备底盘的内部，空气引导装置的进气口连接到供气通风装置的排气口，空气引导装置的排气面向内部的部件 电子设备底盘。
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公开(公告)号：US20140003615A1
公开(公告)日：2014-01-02
申请号：US13905325
申请日：2013-05-30
发明人： Baosheng Li , Liqian Zhai , Shanjiu Chi
IPC分类号： H04R3/00
CPC分类号： H04R3/002 , G10K11/175 , G10K11/178 , G10K2210/109 , G10K2210/3033
摘要： Embodiments of the present invention provide a noise reduction method, device, and system. In the embodiments of the present invention, operating condition information of a noise source is obtained, where the operating condition information represents an operating condition of the noise source, then sound wave information corresponding to the obtained operating condition information is determined according to a pre-set mapping between the operating condition information and the sound wave information, and active noise reduction is performed by using the corresponding sound wave information. Steps such as collection, conversion, and calculation for noise generated by the noise source are not required, thereby shortening time for the active noise reduction.
摘要翻译： 本发明的实施例提供了一种降噪方法，装置和系统。 在本发明的实施例中，获得噪声源的工作状态信息，其中操作条件信息表示噪声源的操作条件，然后根据预先确定的所获得的操作条件信息确定与获得的操作条件信息相对应的声波信息， 在操作条件信息和声波信息之间设置映射，并且通过使用相应的声波信息来执行主动降噪。 不需要对由噪声源产生的噪声的采集，转换和计算等步骤，从而缩短了主动降噪的时间。
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3.发明授权公开(公告)号：US11502019B2
公开(公告)日：2022-11-15
申请号：US17320533
申请日：2021-05-14
发明人： Shoubiao Xu , Shanjiu Chi , Wenhui Zeng
IPC分类号： H01L23/00 , H01L23/40 , H01L23/467 , H01L23/427 , H05K7/20 , F28F3/06
摘要： One example heat sink includes a heat dissipation substrate, a connector, and a fastener. The heat dissipation substrate is configured to dissipate heat for a packaged chip located on a circuit board, and the heat dissipation substrate is located on a surface that is of the packaged chip and that is opposite to the circuit board. A first heat dissipation substrate and a second heat dissipation substrate of the heat dissipation substrate each have a heat conduction surface that conducts heat with a chip in the packaged chip. Different heat conduction surfaces correspond to different chips.
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公开(公告)号：US20210051818A1
公开(公告)日：2021-02-18
申请号：US17089089
申请日：2020-11-04
发明人： Lei Cao , Shoubiao Xu , Shanjiu Chi
摘要： A heat dissipation apparatus includes a heat dissipation substrate, a heat dissipation component, and a plurality of heat dissipation fins disposed on a first side of the heat dissipation substrate. The heat dissipation fins are configured to dissipate heat on the heat dissipation substrate. A first surface of the heat dissipation component is fastened on a second side of the heat dissipation substrate. There is a gap between a side surface of the heat dissipation component and the heat dissipation substrate, and a second surface of the heat dissipation component is used to be attached to a first to-be-heat-dissipated component, to dissipate heat on the first to-be-heat-dissipated component. An area that is on the second side of the heat dissipation substrate is used to be attached to another to-be-heat-dissipated component. Heating power of the first to-be-heat-dissipated component is greater than heating power of the another to-be-heat-dissipated component.
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公开(公告)号：US09917029B2
公开(公告)日：2018-03-13
申请号：US14081288
申请日：2013-11-15
发明人： Zhenzhen Liu , Xiaojing Hou , Shanjiu Chi
IPC分类号： F28F7/00 , H01L23/367 , H01L23/36 , H01L23/40 , H01L23/427
CPC分类号： H01L23/3672 , H01L23/36 , H01L23/40 , H01L23/4006 , H01L23/427 , H01L2924/0002 , H01L2924/00
摘要： Embodiments of the present invention provide a heat dissipater and relate to the communications field. The heat dissipater includes a sub heat dissipater, a connecting apparatus, and a shared bracket; the sub heat dissipater is connected to the shared bracket through the connecting apparatus; the sub heat dissipater includes a first heat conducting surface, and the sub heat dissipater contacts a first heat source through the first heat conducting surface to dissipate heat for the first heat source; the shared bracket includes a second heat conducting surface, and the shared bracket contacts a second heat source through the second heat conducting surface to dissipate heat for the second heat source; and the second heat conducting surface and the sub heat dissipater are disposed in different positions of the shared bracket respectively.
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公开(公告)号：US11490545B2
公开(公告)日：2022-11-01
申请号：US17089089
申请日：2020-11-04
发明人： Lei Cao , Shoubiao Xu , Shanjiu Chi
摘要： A heat dissipation apparatus includes a heat dissipation substrate, a heat dissipation component, and a plurality of heat dissipation fins disposed on a first side of the heat dissipation substrate. The heat dissipation fins are configured to dissipate heat on the heat dissipation substrate. A first surface of the heat dissipation component is fastened on a second side of the heat dissipation substrate. There is a gap between a side surface of the heat dissipation component and the heat dissipation substrate, and a second surface of the heat dissipation component is used to be attached to a first to-be-heat-dissipated component, to dissipate heat on the first to-be-heat-dissipated component. An area that is on the second side of the heat dissipation substrate is used to be attached to another to-be-heat-dissipated component. Heating power of the first to-be-heat-dissipated component is greater than heating power of the another to-be-heat-dissipated component.
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公开(公告)号：US10470339B2
公开(公告)日：2019-11-05
申请号：US15468859
申请日：2017-03-24
发明人： Yaofeng Peng , Zhijian Li , Honghui Liu , Shanjiu Chi
摘要： A system, including a first pipeline and a second pipeline, where the first pipeline includes a first steam pipe, a first liquid pipe, and an evaporation section connected between the first steam pipe and the first liquid pipe, and the second pipeline includes a second steam pipe, a second liquid pipe, and a heat exchanger connected between the second steam pipe and the second liquid pipe. Two pairs of quick connectors are respectively connected between the first steam pipe and the second steam pipe and between the first liquid pipe and the second liquid pipe. The loop heat pipe includes a valve and a nozzle that are configured for vacuum pumping. Refrigerant is provided inside the loop heat pipe. A capillary structure is provided inside the evaporation section to provide a capillary suction force to enable the refrigerant to circulate in the loop heat pipe.
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公开(公告)号：US20180042141A1
公开(公告)日：2018-02-08
申请号：US15785159
申请日：2017-10-16
发明人： Zhongjiang Qu , Shanjiu Chi , Yangfan Zhong , Jin Wang
CPC分类号： H05K7/20736 , H05K7/1489 , H05K7/20145 , H05K7/20172 , H05K7/20181 , H05K7/20336 , H05K7/20409 , H05K7/20745 , H05K7/20818
摘要： The present disclosure provides a cabinet and a heat dissipation system. The cabinet includes: an operating compartment, disposed on one side of a heat dissipation substrate, where the operating compartment is configured to accommodate a server; and a heat dissipation compartment, disposed on the other side of the heat dissipation substrate. Both the heat dissipation compartment and the operating compartment share the heat dissipation substrate as a compartment wall. The operating compartment is separated from the heat dissipation compartment by using the heat dissipation substrate. The heat dissipation compartment accommodates multiple heat dissipation fins, and the multiple heat dissipation fins are connected to the heat dissipation substrate. An air intake vent is disposed in a first compartment wall of the heat dissipation compartment, and an air exhaust vent is disposed in a second compartment wall of the heat dissipation compartment disclosure.
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公开(公告)号：US20140069611A1
公开(公告)日：2014-03-13
申请号：US14081288
申请日：2013-11-15
发明人： Zhenzhen Liu , Xiaojing Hou , Shanjiu Chi
IPC分类号： H01L23/367 , H01L23/40
CPC分类号： H01L23/3672 , H01L23/36 , H01L23/40 , H01L23/4006 , H01L23/427 , H01L2924/0002 , H01L2924/00
摘要： Embodiments of the present invention provide a heat dissipater and relate to the communications field. The heat dissipater includes a sub heat dissipater, a connecting apparatus, and a shared bracket; the sub heat dissipater is connected to the shared bracket through the connecting apparatus; the sub heat dissipater includes a first heat conducting surface, and the sub heat dissipater contacts a first heat source through the first heat conducting surface to dissipate heat for the first heat source; the shared bracket includes a second heat conducting surface, and the shared bracket contacts a second heat source through the second heat conducting surface to dissipate heat for the second heat source; and the second heat conducting surface and the sub heat dissipater are disposed in different positions of the shared bracket respectively.
摘要翻译： 本发明的实施例提供一种散热器并且涉及通信领域。 散热器包括副散热器，连接装置和共用支架; 辅助散热器通过连接装置连接到共享支架; 副散热器包括第一导热表面，并且副散热器通过第一导热表面接触第一热源以散热第一热源; 所述共用支架包括第二导热表面，并且所述共享支架通过所述第二导热表面接触第二热源以散热用于所述第二热源; 并且第二导热面和副散热器分别设置在共享支架的不同位置。
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公开(公告)号：US20240237295A1
公开(公告)日：2024-07-11
申请号：US18616219
申请日：2024-03-26
发明人： Weiming Liu , Shanjiu Chi , Xiaoxiao Lu
IPC分类号： H05K7/20
CPC分类号： H05K7/20609 , H05K7/20727 , H05K7/20772
摘要： A heat dissipation apparatus including an air-cooling structure and a liquid-cooling structure, and a server are provided. The air-cooling structure is configured to simultaneously perform air cooling on a first-type component and a second-type component, and the liquid-cooling structure is configured to perform liquid cooling on the first-type component, where heat generated by the first-type component is higher than heat generated by the second-type component. The liquid-cooling structure specifically includes a liquid-cooling assembly and a heat exchanger. The liquid-cooling assembly can conduct the heat generated by the first-type component into a coolant in a liquid-cooling pipe of the liquid-cooling assembly. The heat exchanger is configured for heat exchange between the coolant and external air, and the heat exchanger herein is disposed at a tail end of the server.
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