Abstract:
A system, including a first pipeline and a second pipeline, where the first pipeline includes a first steam pipe, a first liquid pipe, and an evaporation section connected between the first steam pipe and the first liquid pipe, and the second pipeline includes a second steam pipe, a second liquid pipe, and a heat exchanger connected between the second steam pipe and the second liquid pipe. Two pairs of quick connectors are respectively connected between the first steam pipe and the second steam pipe and between the first liquid pipe and the second liquid pipe. The loop heat pipe includes a valve and a nozzle that are configured for vacuum pumping. Refrigerant is provided inside the loop heat pipe. A capillary structure is provided inside the evaporation section to provide a capillary suction force to enable the refrigerant to circulate in the loop heat pipe.
Abstract:
The present invention is applicable to the technical field of heat-radiation structures and discloses a flow-guiding apparatus and an electronic device including the flow-guiding apparatus. The flow-guiding apparatus includes a support and flow-guiding members for guiding an air flow generated by an axial fan to a directed area, where the flow-guiding members are connected to the support, at least two flow-guiding members are arranged and are located on both sides of a hub of the axial fan or around the hub of the axial fan, and the flow-guiding members tilt toward the hub of the axial fan along an air-blowing direction of the axial fan. The electronic device includes a chassis, where the chassis is provided with an air vent, an axial fan is arranged at the air vent, and an air outlet of the axial fan is arranged with a flow-guiding apparatus mentioned above.
Abstract:
A heat radiator comprising a heat dissipation plate, where a plurality of circumferentially disposed heat dissipation regions are disposed on the heat radiator, a plurality of first heat dissipation fins disposed in parallel with each other are disposed at intervals in each heat dissipation region, a heat dissipation channel is formed between adjacent first heat dissipation fins, one end that is of the heat dissipation channel and that is away from a center of the heat dissipation plate is an air inlet, and a direction that is above the heat dissipation channel and that is towards a hollow region is an air outlet.
Abstract:
The present invention is applicable to the technical field of heat-radiation structures and discloses a flow-guiding apparatus and an electronic device including the flow-guiding apparatus. The flow-guiding apparatus includes a support and flow-guiding members for guiding an air flow generated by an axial fan to a directed area, where the flow-guiding members are connected to the support, at least two flow-guiding members are arranged and are located on both sides of a hub of the axial fan or around the hub of the axial fan, and the flow-guiding members tilt toward the hub of the axial fan along an air-blowing direction of the axial fan. The electronic device includes a chassis, where the chassis is provided with an air vent, an axial fan is arranged at the air vent, and an air outlet of the axial fan is arranged with a flow-guiding apparatus mentioned above.
Abstract:
A noise reduction door related to a noise reduction device in order to resolve a problem that the noise reduction door cannot meet a requirement for different noise reduction effects and different air duct resistance. The noise reduction door includes a T-shaped mechanical part, two fan-shaped mechanical parts, and a door plate. The T-shaped mechanical part and the fan-shaped mechanical part are connected to the door plate using a detachable connection mechanical part. The T-shaped mechanical part is located on a central axis of the door plate, and the two fan-shaped mechanical parts are respectively located on two sides of the T-shaped mechanical part. Therefore, the fan-shaped mechanical part on the door plate may be changed to have different installation positions and installation manners in order to obtain noise reduction doors in different forms. The embodiments of the present disclosure are applied in cabinet noise reduction.
Abstract:
A system, including a first pipeline and a second pipeline, where the first pipeline includes a first steam pipe, a first liquid pipe, and an evaporation section connected between the first steam pipe and the first liquid pipe, and the second pipeline includes a second steam pipe, a second liquid pipe, and a heat exchanger connected between the second steam pipe and the second liquid pipe. Two pairs of quick connectors are respectively connected between the first steam pipe and the second steam pipe and between the first liquid pipe and the second liquid pipe. The loop heat pipe includes a valve and a nozzle that are configured for vacuum pumping. Refrigerant is provided inside the loop heat pipe. A capillary structure is provided inside the evaporation section to provide a capillary suction force to enable the refrigerant to circulate in the loop heat pipe.
Abstract:
A noise reduction door related to a noise reduction device in order to resolve a problem that the noise reduction door cannot meet a requirement for different noise reduction effects and different air duct resistance. The noise reduction door includes a T-shaped mechanical part, two fan-shaped mechanical parts, and a door plate. The T-shaped mechanical part and the fan-shaped mechanical part are connected to the door plate using a detachable connection mechanical part. The T-shaped mechanical part is located on a central axis of the door plate, and the two fan-shaped mechanical parts are respectively located on two sides of the T-shaped mechanical part. Therefore, the fan-shaped mechanical part on the door plate may be changed to have different installation positions and installation manners in order to obtain noise reduction doors in different forms. The embodiments of the present disclosure are applied in cabinet noise reduction.
Abstract:
An apparatus can be used to dissipate heat from a memory with liquid cooling. A liquid-cooling block is disposed on a main board such that the liquid-cooling block is adjacent to a memory slot. The liquid-cooling block includes a metal block, metal spring leaves fixed on two sides of the metal block, and a liquid channel that penetrates through the metal block. The metal spring leaves are configured to contact a memory bank in the memory slot and conduct heat that is generated during operation of the memory bank to the metal block. A liquid inlet pipe and a liquid outlet pipe are installed on the main board and located at two ends of the liquid-cooling block in a manner such that cooling liquid can enter the liquid-cooling block via the liquid inlet pipe and exit the liquid-cooling block via the outlet pipe to form a cooling liquid loop.