公开(公告)号：US11043442B2

公开(公告)日：2021-06-22

申请号：US16298443

申请日：2019-03-11

Applicant: HUAWEI TECHNOLOGIES CO., LTD.

Inventor： Shoubiao Xu ,  Shanjiu Chi ,  Wenhui Zeng

IPC: H01L23/00 ,  H01L23/40 ,  H01L23/467 ,  H01L23/427 ,  H05K7/20 ,  F28F3/06

Abstract: One example heat sink includes a heat dissipation substrate, a connector, and a fastener. The heat dissipation substrate is configured to dissipate heat for a packaged chip located on a circuit board, and the heat dissipation substrate is located on a surface that is of the packaged chip and that is opposite to the circuit board. A first heat dissipation substrate and a second heat dissipation substrate of the heat dissipation substrate each have a heat conduction surface that conducts heat with a chip in the packaged chip. Different heat conduction surfaces correspond to different chips.

公开(公告)号：US11502019B2

公开(公告)日：2022-11-15

申请号：US17320533

申请日：2021-05-14

Applicant: HUAWEI TECHNOLOGIES CO., LTD.

Inventor： Shoubiao Xu ,  Shanjiu Chi ,  Wenhui Zeng

IPC: H01L23/00 ,  H01L23/40 ,  H01L23/467 ,  H01L23/427 ,  H05K7/20 ,  F28F3/06

Abstract: One example heat sink includes a heat dissipation substrate, a connector, and a fastener. The heat dissipation substrate is configured to dissipate heat for a packaged chip located on a circuit board, and the heat dissipation substrate is located on a surface that is of the packaged chip and that is opposite to the circuit board. A first heat dissipation substrate and a second heat dissipation substrate of the heat dissipation substrate each have a heat conduction surface that conducts heat with a chip in the packaged chip. Different heat conduction surfaces correspond to different chips.